Fracture method of brittle material substrate

A brittle material substrate, brittle material technology, applied in nonlinear optics, stone processing tools, stone processing equipment, etc., can solve the problems of difficulty in enhancing the strength of the end face, and the split surface is easy to break, so as to reduce the load and reduce the unqualified products. , the effect of end face strength enhancement
CN102596523BInactive Publication Date: 2014-10-08MITSUBOSHI DIAMOND IND CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
MITSUBOSHI DIAMOND IND CO LTD
Publication Date
2014-10-08
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The present invention provides a fracture method that can make the strength of the end surface stronger than before. The method for fracturing a brittle material substrate of the present invention includes the step of forming a scribe line on the brittle material substrate, and the fracturing step of fracturing along the scribe line, and during the fracturing step, the The substrate is rolled and crimped near the scribe line along a position separated from the scribe line on one side, and a load is applied, and the brittle material substrate is divided by bending under a low load.
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Description

technical field

[0001] The present invention relates to a fracture method for singulation along a scribe line formed on a brittle material substrate. Here, the brittle material substrate includes glass, ceramics (low-temperature fired ceramics and high-temperature fired ceramics), semiconductor materials such as silicon, sapphire, and the like. In addition, the form of the substrate to be divided includes not only a single board but also a bonded substrate in which two substrates are bonded together. Background technique

[0002] Figure 8 It is a diagram showing an example of a conventional method of dividing a glass substrate on which a functional film such as a panel product has been formed using a breaking bar. First, the substrate G is placed on the scribing table of the scribing device, and the scribing line S is formed along the planned division line of the first surface using the cutter wheel W ( Figure 8 (a)). Next, the substrate G is placed on the elastic scribi...

Claims

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