Unlock instant, AI-driven research and patent intelligence for your innovation.

Two-step etching method for resonant accelerometer resonant beam and support beam

An accelerometer and two-step corrosion technology, applied in the direction of measuring acceleration, velocity/acceleration/impact measurement, manufacturing microstructure devices, etc., can solve the problems of easy cracking and difficult bonding surface, etc., to reduce cross-axis interference and Effect of measurement error, simple structure

Inactive Publication Date: 2016-01-06
CHINA JILIANG UNIV
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To solve this problem, Christian Burrer et al fabricated the upper half of the resonant beam and mass on one wafer, and the lower half of the support beam and mass on another substrate, and then bonded the two together , the bonding surface is difficult and easy to crack

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Two-step etching method for resonant accelerometer resonant beam and support beam
  • Two-step etching method for resonant accelerometer resonant beam and support beam
  • Two-step etching method for resonant accelerometer resonant beam and support beam

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Embodiment 1: The thickness of the resonant beam (1) is 10 microns, the thickness of the support beam (2) is 50 microns, the thickness of the original silicon wafer (3) is 380 microns, and the width of the etching groove (6) is 661 microns. The production process determined based on this data is as follows:

[0035] 1) Thermal oxidation, making a silicon dioxide film with a thickness of 1.5 microns on both sides of the silicon wafer (3). (see attached image 3 [1])

[0036] 2) Photolithography on the back side to form a back etching window, the position of the window is facing the four corners of the resonant beam (1) and the etching groove (6). The length (along the length direction of the resonant beam (1)) and width (along the width direction of the resonant beam (1)) of the resonant beam back corrosion window (8) are 661 microns and 724 microns respectively compared with the length and width of the resonant beam (1). The back corrosion window (9) at the corner of...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Resonant frequencyaaaaaaaaaa
Sensitivityaaaaaaaaaa
Login to View More

Abstract

The invention discloses a two-step corrosion manufacturing method for a support beam and a resonant beam of a resonance type accelerometer, which belongs to the field of micro-electronic mechanical systems. The two-step corrosion manufacturing method aims to manufacturing the resonant beam (1) and the support beam (2) which are not positioned on the same plane on the same silicon wafer (3), wherein the resonant beam (1) is positioned on the upper surface of a substrate, and a neutral surface of the support beam (2) and the gravity center of a mass block (4) are positioned on the same plane. The two-step corrosion manufacturing method is characterized, in terms of manufacturing technique, by including corroding the back of the resonant beam (1) to a certain depth by an existing mask corrosion process; photoetching the front and the back of the resonant beam (1), and corroding or etching parts, except for lobe compensation portions of the resonant beam (1) and the mass block (4), of a corrosion masking layer (7); and finally combining masking corrosion with non-masking corrosion to realize one-step molding of the resonant beam (1) and the support beam, wherein the thickness of the resonant beam (1) and the thickness of the support beam (2) simultaneously meet set values. The resonance type accelerometer manufactured by the two-step corrosion manufacturing method is simple in structure, and interference of intersecting axes is low.

Description

technical field [0001] The invention relates to a method for manufacturing a resonant beam and a supporting beam of a resonant accelerometer, in particular to a two-step corrosion method for manufacturing a resonant beam and a supporting beam of a resonant accelerometer using mask-no-mask etching technology, belonging to microelectronics Mechanical systems (Micro-Electro-MechanicalSystems, MEMS) field. Background technique [0002] Micro accelerometer is an important kind of mechanical quantity sensor. As early as the end of the 1960s, people began to study one-dimensional micro-silicon accelerometers. In the late 1980s, the large-scale production of one-dimensional miniature accelerometers began. In the 1990s, with the development of science and technology and the needs of the military and commercial markets, research on three-dimensional micro accelerometers began to be used in military, automotive electronics, industrial automation, robotics, consumer electronics and ot...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00G01P15/097
Inventor 韩建强李森林李青冯日盛李琰
Owner CHINA JILIANG UNIV
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com