Three-dimensional light-emitting diode (LED) light source module and lamp with LED light source module

Abstract

The invention discloses a three-dimensional light-emitting diode (LED) light source module, which comprises a base, LED chips arranged on the base, and packaging structures covered on the LED chips, wherein the base is provided with at least two LED chip mounting surfaces, each of the LED chip mounting surfaces faces different directions and is provided with the LED chips, and the cross-section of each of the LED chip mounting surfaces is circumscribed around or inscribed in the same circle. According to the three-dimensional light-emitting diode (LED) light source module, the base is provided with at least two LED chip mounting surfaces facing different directions so that the LED chips on the LED chip mounting surfaces are provided with different light emitting directions, and not only the light emitting angles of the light source module are enlarged, but also the light emitting efficiency of the light source module is improved; and simultaneously, each of the LED chip mounting surfaces is provided with a same circumscribed circle or a same inscribed circle so that the center of the circumscribed circle or the inscribed circle can be used as a rotation point, the mounting surfaces can only be rotated at a certain angle, and the horizontal mounting of the chips on different chip mounting surfaces can be achieved. The invention further discloses a lamp.

Description

technical field [0001] The invention relates to a packaging structure of a light-emitting diode (LED), in particular to a three-dimensional LED light source module with high light extraction efficiency and high chip installation efficiency and a lamp provided with the LED light source module. Background technique [0002] Nowadays, due to the advantages of long life, high luminous efficiency, no radiation and low power consumption, light-emitting diodes (LEDs) are more and more widely used in various products, such as indicator lights and display panels of various electronic products. , as a liquid crystal display (LCD) backlight, etc. Existing LEDs generally include a substrate or a bracket and several LED chips arranged on the substrate, and then packaged with a packaging structure. Wherein the packaging structure is used for packaging LED chips, which may include packaging colloid or preformed packaging lenses. Most of the existing LEDs only have one LED chip mounting s...

AI Technical Summary

Problems solved by technology

Most of the existing LEDs only have one LED chip mounting surface or are provided with mounting surfaces on the same plane. This structure will cause each LED chip to have the same light output direction, and light absorption will occur between each LED chip. , low light extraction efficiency, small light output angle

The Chinese patent application with the patent application number 200710098179.9 discloses an LED package, in which, the mounting part where the chip is mounted has a block-shaped raised structure, and the top of the block-shaped raised structure is flat and adjacent to the flat At least two non-parallel planes formed on the top of the LED and facing in different directions. Although this structure can prevent the side light emission of the LED chip from being lost, during processing, since the chip must be placed on a plane at a different angle from the horizontal plane, the package There is a cup-shaped structure on the periphery of the part, so it is impossible to realize the automatic installation of chip placement and gold wire bonding, and the installation efficiency is low; The upper surface of the raised structure makes the amount of encapsulation colloid more, and the cost increases; moreover, the restriction of the light output direction by the groove structure reduces the application range of the light source module, which is not conducive to the popularization and application of LED light source modules

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