Method for electrical connection between two surfaces of ceramic substrate
A ceramic substrate and two-sided technology, applied in the field of conductive process technology, can solve the problems of time-consuming workmanship, difficult wiring, holes, etc., and achieve the effect of high convenience and saving working time
Inactive Publication Date: 2012-08-01
CHENMING MOLD IND CORP
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Problems solved by technology
[0003] In the ceramic substrate circuit manufacturing process in the prior art, when it is necessary to make conductive connections between the separated circuit points on both sides of the substrate or to perform heat conduction treatment between the two After choosing to directly drill a hole in the nearest place, the hole is filled with conductive metal material (such as copper) by means of electroplating or electroforming deposition. However, this is done in order to consider the electrical function in actual operation. , so the electroplating time must be lengthened, the workmanship is very time-consuming, and precise control of parameters such as current, voltage, liquid concentration, and working temperature is required, which is complicated and troublesome, and the quality control is not easy, and it is easy to occur when the perforation is not completely filled. Full and full of holes, there is a bottleneck in the yield control of the product. Therefore, considering the above difficulties, the inventor of the present invention thought about and designed a method for conducting the circuit between the two sides of the ceramic substrate, hoping to address the lack of the existing technology. To be improved, and then to enhance the implementation and utilization of the industry
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[0016] In order for Ligui examiners to understand the inventive features, content and advantages of the present invention and the effects it can achieve, the present invention is hereby combined with the accompanying drawings and described in detail in the form of embodiments as follows, and the drawings used therein are, Its purpose is only for illustration and auxiliary instructions, not necessarily the true proportion and precise configuration of the present invention after implementation, so the proportion and configuration relationship of the attached drawings should not limit the patent scope of the present invention in actual implementation, and it is in accordance with Explain first.
[0017] Please refer to figure 1 As shown, the present invention is a method for conducting electric circuits between two sides of a ceramic substrate, which comprises the following steps in a preferred embodiment:
[0018] Substrate perforation step,
[0019] nail implantation steps, a...
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The present invention discloses a method for electrical connection between two surfaces of a ceramic substrate, and the method includes the steps of forming a through hole between the two surfaces of the ceramic substrate corresponding to electrical connection points of a circuit on the ceramic substrate, and then mounting a conductive assembly inside the through hole to form a conduction path between the two surfaces of the ceramic substrate. By this means, time cost of manufacturing of ceramic substrate circuit board could be largely decreased, and the manufacturing procedures could be much simplified as well.
Description
technical field [0001] The invention relates to a method for conducting electric circuits between two sides of a ceramic substrate, in particular to a process technology of using dry-type nail implantation on the ceramic substrate as a conductive means between the two sides of the substrate. Background technique [0002] Ceramic substrates are currently widely used in the electronics industry as an important circuit board material, such as LED ceramic substrates, which can be further arranged and configured with circuits on both sides of the substrate through surface electroplating. [0003] In the ceramic substrate circuit manufacturing process in the prior art, when it is necessary to make conductive connections between the separated circuit points on both sides of the substrate or to perform heat conduction treatment between the two After choosing to directly drill a hole in the nearest place, the hole is filled with conductive metal material (such as copper) by means of ...
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IPC IPC(8): H05K3/40H05K1/11
CPCH05K1/0306H05K3/4046H05K3/0047H05K2201/10242Y10T29/49117
Inventor 邱耀弘范淑惠高明哲
Owner CHENMING MOLD IND CORP