Light-emitting diode lamp bar with fully waterproof glue pouring structure and manufacturing method thereof

A technology for LED light strips and glue filling, which is used in gas/waterproof devices, parts of lighting devices, semiconductor devices of light-emitting components, etc. It can solve the problems of large production space, low waterproof level, cracking, etc. The effect of improved life and reliability, good waterproof sealing performance and simple production process

Inactive Publication Date: 2012-08-08
惠州市串联电子科技有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

However, when this method of dispensing glue is cured by baking or natural air drying, it not only involves additional processes, but also takes a long time in this process, the production efficiency is too low, the production space occupied is large, and the waterproof level Low
[0003] Not only that, but the LED light bar made by dripping glue in this way can

Method used

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  • Light-emitting diode lamp bar with fully waterproof glue pouring structure and manufacturing method thereof
  • Light-emitting diode lamp bar with fully waterproof glue pouring structure and manufacturing method thereof
  • Light-emitting diode lamp bar with fully waterproof glue pouring structure and manufacturing method thereof

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Embodiment Construction

[0024] A specific embodiment of a method for sealing an LED light bar according to the present invention will be described in more detail below.

[0025] However, those skilled in the art should understand that the following are only examples and descriptions of some preferred implementations, and other similar or equivalent implementations can also be used to implement the present invention.

[0026] In the present invention, "LED light strip" should be understood in a broad sense, including not only LED flexible light strips, that is, LED light strips installed on flexible circuit boards (FPC), but also LED hard light strips, that is, on LED light strips mounted on PCB circuit boards (also known as "rigid boards" or "rigid circuit boards" in the industry); not only light strips with LEDs mounted on single-sided circuit boards, but also double-sided circuit boards or multi-layer circuit boards LED strips, etc. These all belong to the scope of the present invention.

[0027]...

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Abstract

The invention relates to a light-emitting diode lamp bar with a fully waterproof glue pouring structure and a manufacturing method thereof. Specifically, an LED lamp bar is provided. The LED lamp comprises an LED lamp bar body (1) and a fully waterproof glue pouring structure (2) which is extruded and enclosed on the LED lamp bar body (1). The invention further provides a glue sealing method for the LED lamp bar. The method comprises the following steps: providing the LED lamp bar body (1); and extruding and molding a glue sealing material on the LED lamp bar body (1) by an extrusion molding process, so as to form the fully waterproof glue pouring structure (2) annularly enclosing the LED lamp bar body (1). The LED lamp bar has a high waterproof and sealing property on waterproof glue sealing. The LED lamp bar product subjected to glue sealing greatly improves weather resistance and reliability, prolongs the service life, and has a simple and quick production process and high production efficiency.

Description

technical field [0001] The invention relates to the field of LED light bars and LED light bar sealing glue, more specifically, the invention relates to a fully waterproof glue filling structure of LED light bars and a manufacturing method thereof. Background technique [0002] The glue sealing of traditional LED light strips usually adopts the method of dropping glue, that is, after completing the SMT mounting of LEDs and other components on the LED light strip, the front of the light strip (that is, the light strip has LEDs and other components) The side of the component) is drip-irrigated with liquid PU material (silica gel), and then baked or air-dried naturally. However, when this method of dispensing glue is cured by baking or natural air drying, it not only involves additional processes, but also takes a long time in this process, the production efficiency is too low, the production space occupied is large, and the waterproof level Low. [0003] Not only that, but th...

Claims

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Application Information

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IPC IPC(8): F21S4/00F21V31/04F21Y101/02F21S4/24F21Y115/10
Inventor 田茂福
Owner 惠州市串联电子科技有限公司
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