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Solar wafer cassette

A wafer box and end plate technology, which is applied to the types of packaging items, special packaging items, photovoltaic power generation, etc., can solve the problems of unqualified wafer boxes, heavy material characteristics, and increased weight of wafer boxes, so as to save maintenance costs and manufacturing costs, prevention of failure and shortened life, and elimination of weakening effects

Inactive Publication Date: 2014-08-06
SANG A FRONTEC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, as mentioned above, the core material of the support rod (5) is made of metal material, so there is no problem in terms of strength, but due to the relatively heavy material properties, the overall weight of the wafer cassette (1) is increased as a result, which is not only inconvenient to operate, Excessive loads are also applied to the carrying device for carrying high-weight wafer cassettes and the moving device for moving, which becomes the cause of failure or shortened life of these devices
[0008] In order to solve the above problems, it may be considered to replace the above-mentioned supporting rods with synthetic resins, but synthetic resins are weak in strength and have a large potential deformation, so a solution needs to be proposed
[0009] In addition, in the conventional wafer box, since the support rods (5) and the end plates (3) are thermally welded together, even if a certain one of the multiple support rods is damaged, the entire wafer box needs to be replaced. When thermally welding the support rod (5) and the end plate (3), even if a certain support rod and the end plate are poorly thermally welded, the entire wafer box is regarded as a substandard product and needs to be discarded, resulting in economic losses

Method used

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Embodiment Construction

[0034] A wafer cassette according to an embodiment of the present invention will be described below.

[0035] The described embodiments are intended to enable those skilled in the art to easily understand the concept of the present invention, and the present invention is not limited thereto. The embodiments of the present invention can be modified into other forms within the technical idea and scope of the present invention. In this specification, "and / or" is used as a meaning including at least one of the constituent elements listed before and after. In this specification, the meaning of being "on" another component includes not only the other component being directly on one component, but also the meaning that a third component may be located on the above-mentioned one component. In this specification, each constituent element or part, etc. is referred to using a first, second, etc. expression form, but this is an expression form used for clarification, and is not limited t...

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PUM

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Abstract

A wafer cassette is proposed. The proposed wafer box includes a pair of end plates and a plurality of lightweight support rods. The pair of end plates are arranged at a predetermined interval and arranged opposite to each other. The side and bottom surface of the wafer; the above-mentioned light-weight support rods include: a non-metallic core material with a reinforcement groove formed at least one place, a reinforcement member pressed into the above-mentioned reinforcement groove, and a non-metal material that wraps the surface of the above-mentioned core material by insert injection molding. Surface material of material; at both ends of the above-mentioned heartwood, a headless screw with threads formed on the outer peripheral surface is combined, and a connecting nut connected with the above-mentioned headless screw is embedded in the position corresponding to the above-mentioned headless screw on the above-mentioned end plate. Set within the thickness of the end plate.

Description

technical field [0001] The present invention relates to wafer cassettes. [0002] In particular, it relates to a wafer cassette which uses lightweight support rods with sufficient strength and can combine the lightweight support rods and end plates in an assembled manner. Background technique [0003] Wafers go through manufacturing processes such as material inbound inspection, grinding, glueing, sawing, separation, cleaning, and testing. Since the wafer manufacturing process is carried out while moving the wafer, it is necessary to ensure physical and chemical stability against the external environment. , through the above-mentioned multiple processes. [0004] figure 1 It is a perspective view showing the structure of a conventional wafer cassette. [0005] Such as figure 1 As shown, the wafer box (1) has a pair of end plates (3) made of resin material, arranged at a predetermined interval, arranged opposite to each other, and includes a plurality of support rods (5)...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/673B65D85/38B65D85/86H01L31/04
CPCY02E10/50A47J37/043A47J37/047A47J37/0745
Inventor 李康声千俊焕
Owner SANG A FRONTEC