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Cooling device

A technology of cooling devices and coolers, applied in cooling/ventilation/heating transformation, electrical components, printed circuits, etc., can solve time-consuming problems and achieve the effect of reducing time consumption and reducing space requirements

Inactive Publication Date: 2012-08-22
HYDAC COOLING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, it is time consuming to completely remove the cooling liquid from such equipment

Method used

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Examples

Experimental program
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Embodiment Construction

[0020] figure 1 A schematic circuit diagram of a cooling device 1 for an electrical energy supply device 2 of a wind power installation is shown, schematically including its essential components. The cooling device 1 is used to cool power components 4 , such as capacitor modules and semiconductor modules of a converter 14 with filter capacitors and connection capacitors. The converter 14 has a housing 18 with cooling plates 4 on which cooling components 3 with losses are mounted. The cooling plate 4 is flushed with a liquid coolant 6 which is preferably formed as a water-glycol mixture. The operating temperature of the heat sink 3 in the converter 14 is thus kept at a temperature at which self-destruction of the semiconductor components is avoided.

[0021] The cooling device 1 has a fluid-conducting connection 5 in the form of a pipe or hose from the pump 7 to the cooler 8 . The pump 7 is preferably designed as a circulation pump and is driven by an electric motor 20 via a...

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PUM

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Abstract

The invention relates to a cooling device for an electric energy supply (2), comprising at least one first heat-dissipating part (3), the power components (4) of which are connected to the cooling device (1) in a thermally conductive manner, wherein a fluid-conducting connection (5) conducts liquid coolant (6) from a pump (7) to a cooler (8) over the first heat-dissipating part (3), wherein one shut-off unit (9', 9) each is arranged in the fluid-conducting connection (5) at least between the first heat-dissipating part (3) and the cooler (8) and between the pump (7) and the first heat-dissipating part (3). The cooling device is characterized in that, in order to avoid an overpressure in at least one part (3, 14) to be cooled, at least one pressure limiting valve (17, 28) is provided, which is arranged in connection with the fluid conductor inside the part (3, 14) and / or, as part of a unit (15) for preloading the cooling liquid (6) in the fluid-conducting connection (5), is connected to the part (3, 14) by means of the pressure side of a check valve (13) provided downstream of the part (3, 14).

Description

technical field [0001] The invention relates to a cooling device for an electrical energy supply device, which cooling device comprises at least one first heat sink component, the power module of which is connected to the cooling device in a heat-conducting manner, wherein a fluid-conducting connection part connects a liquid Coolant is conveyed from the pump via the first cooling element to the cooler, at least one shut-off is provided in each case in the fluid-carrying connection of the cooling device between the first cooling element and the cooler and between the pump and the first cooling element. device. Background technique [0002] Such a cooling device is known from DE 2 135 677 A. The known cooling device is part of a transformer rectifier arrangement, the rectifier units of which are oil-cooled. Each rectifier unit is installed in a separate rectifier housing, wherein coolant or cooling oil is pumped by means of a pump through the pipes and then through the recti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20272H05K7/20281H05K7/20927H05K2201/064
Inventor R·赫贝尔C·魏茨施泰因
Owner HYDAC COOLING