Monolithic integrated sensor device, method of forming and method of forming its cavity structure

Abstract

Embodiments relate to MEMS devices, particularly MEMS devices integrated with related electrical devices on a single wafer. Embodiments utilize a modular process flow concept as part of a MEMS-first approach, enabling use of a novel cavity sealing process. The impact and potential detrimental effects on the electrical devices by the MEMS processing are thereby reduced or eliminated. At the same time, a highly flexible solution is provided that enables implementation of a variety of measurement principles, including capacitive and piezoresistive. A variety of sensor applications can therefore be addressed with improved performance and quality while remaining cost-effective.

Description

technical field [0001] The present invention relates generally to microelectromechanical systems (MEMS) devices, and more particularly, to MEMS devices and electrical devices on a single wafer. Background technique [0002] MEMS devices, such as sensors, and associated electronics, such as application-specific integrated circuits (ASICs), are typically provided on separate chips because the manufacturing processes for the two are incompatible with each other. For example, in modern CMOS technology it is critical to avoid high temperatures to protect doping profiles, whereas in the fabrication of electronic devices high temperature steps may be required. The two-chip solution has many disadvantages, such as more complex and expensive packaging, and the inability to implement applications that require processing of very small signals. [0003] A so-called "MEMSfirst" process has recently been developed for integrating MEMS with electronics on a single chip. However, there ar...

AI Technical Summary

Problems solved by technology

However, there are still defects and deficiencies in this process, and there is still room for improvement

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