Activating solution composition for nonmetallic material electroless plating

Abstract

The invention discloses an activating solution composition for nonmetallic material electroless plating. The activating solution composition for the nonmetallic material electroless plating contains palladium sulfate, a stabilizer, a reaction accelerator and a surfactant; and the pH value of an activating solution is regulated to 9-11 by dilute lye. The improved activating solution composition for electroless copper plating can keep the stability of the activating solution in horizontal line equipment and enhances the speed of activation reaction; and in combination with a subsequent electroless copper process, the activating solution composition for the nonmetallic material electroless plating can reliably perform electroless copper plating on a through hole and a blind hole of a circuit board, with complete functionality.

Description

technical field [0001] The invention relates to an electroless plating process, which belongs to the technical field of electroless plating surface treatment, in particular to an activation solution composition for electroless plating of non-metallic materials. Background technique [0002] Electroless plating plays a very important role in surface treatment technology. Compared with electroplating, it can not only obtain a uniform thickness of plating for complex geometric shapes, but also directly coat various substrates such as metals, non-metals, and semiconductors. plating on the material. [0003] Therefore, electroless plating is widely used in the electronics industry, especially in the process of making printed circuit boards, through-hole electroless plating on non-metallic materials has become a basic process requirement, and electroless copper plating is usually used. [0004] In the production process of printed circuit boards, the key to electroless copper pla...

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Problems solved by technology

[0006] At the same time, the application of the traditional chemical copper activation process on the horizontal line equipment will also cause some new problems and difficulties. One is the stability of the solution. The violent circulation of the activation solution of the horizontal line equipment will destroy the colloidal palladium solution system. , resulting in the decomposition and catalytic failure of the palladium solution; the second is the activation reaction speed problem, the ordinary ionic palladium solution needs a long time to process, in order to absorb a sufficient amount of metal palladium on the through-hole wall of the non-metallic material to ensure that the hole wall Complete Plating Catalysis During Electroless Copper Deposition

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