LED packaging structure

一种LED封装、LED芯片的技术,应用在电气元件、电固体器件、电路等方向,能够解决荧光粉激发效果降低、演色性不佳、出光颜色不均匀等问题

Active Publication Date: 2012-09-19
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally speaking, after these phosphors of different colors are mixed into the encapsulant and solidified, since the phosphor particles of different colors inside the encapsulant are mixed together, the phosphors of different colors have different excitation efficiencies and different wavelengths. It will interact with each other and reduce the excitation effect of the phosphor, resulting in uneven light color and poor color rendering.

Method used

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Embodiment Construction

[0011] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0012] see figure 1 as well as figure 2 , shows the LED packaging structure 10 of the present invention, which includes a substrate 12 , a reflective cup 14 , an encapsulant 16 and an LED chip 18 .

[0013] The substrate 12 has a top surface 122 with two electrodes 120 on the top surface 122 . The two electrodes 120 extend from the top surface 122 to the bottom surface 124 opposite to the top surface 122 . One of the two electrodes 120 is a positive electrode and the other is a negative electrode. The reflecting cup 14 is disposed on the top surface 122 and surrounds the periphery of the substrate 12 , and a groove 1220 is formed on the top surface 122 . The LED chip 18 is disposed at the bottom of the groove 1220 and is electrically connected to the two electrodes 120 through conductive wires 182 . After the LED chip 18 is electrically connected, the light emi...

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PUM

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Abstract

The invention provides an LED packaging structure, which comprises a substrate, a refection cup, a packaging rubber body and an LED chip, wherein the substrate comprises a top surface, and the top surface comprises two electrodes; the reflection cup is arranged on the top surface, and the top surface is provided with a groove; the LED chip is arranged on the bottom of the groove, and electrically connected with the two electrodes; and the packaging rubber body comprises a first fluorescent rubber layer and a second fluorescent rubber layer, the first fluorescent rubber layer comprises a first layer of fluorescent powder which is deposited on the bottom of the groove, and the second fluorescent rubber layer is covered on the first fluorescent rubber layer. The first fluorescent powder of the first fluorescent rubber layer is separated from the first fluorescence rubber layer, thus light-emitting efficiency corresponding to the LED chip can ensure that the photic excitation effects are same and light is uniformly stirred.

Description

technical field [0001] The invention relates to an LED package structure, in particular to an LED package structure with better fluorescent powder excitation effect. Background technique [0002] The LED industry is one of the industries that has attracted the most attention in recent years. Up to now, LED products have the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle, mercury-free, and environmental protection benefits. However, Generally, in order to obtain the required brightness and color for high-power LED products, phosphors with different excitation colors must be used for mixing and matching. For example, an LED chip that emits blue light is combined with red and green phosphors that are excited into red and green phosphors in the package and mixed fluorescent glue. After excitation, the light is mixed to form white light. Generally speaking, after these phosphors of different colors are mixed into the encapsulant a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50
CPCH01L33/486H01L2933/0041H01L2224/48091H01L33/504H01L2224/48227H01L2924/00014
Inventor 林新强曾文良张洁玲
Owner ZHANJING TECH SHENZHEN
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