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Non-silicon release paper

A non-silicon release and non-silicon technology, which is applied in papermaking, paper coating, textiles and papermaking, etc., can solve the problems of variable delivery time and high cost, and achieve the effects of easy identification, uniform coating, and low water and moisture absorption

Active Publication Date: 2012-09-26
广州市鸿鹄胶粘材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing release paper can no longer meet the needs of consumers, especially for PI cover film factories, whose production mainly relies on high-priced imported release paper, which is often troubled by the change of delivery time and the cost is very high

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0021] The non-silicon release paper of the present invention is mainly applied to flexible circuit board cover films. In a preferred embodiment of the present invention, it is applied to polyimide (PI) cover films as an example.

[0022] Such as figure 1 As shown, the non-silicon release paper in the preferred embodiment of the present invention includes plastic coating layer 1, base paper 2, plastic coating layer 3, and non-silicon release layer 4 from bottom to top.

[0023] The above-mentioned base paper can be selected from a base paper made from long-fiber base pulp with high density, and its weight is preferably 70 g, 80 g or 90 g. The coating plastic is preferably a mixture of low-density polyethylene (LDPE) and high-density polyethylene (HDPE), and more preferably low-density polyethylene (LDPE) and high-density polyethylene (LDPE) with a weight percentage of 2:8 or 3:7 or 4:6 A mixture of ethylene (HDPE). The non-silicon release agent is preferably a urethane release co...

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PUM

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Abstract

The invention relates to non-silicon release paper which sequentially comprises a plastic laminating layer, base paper, a plastic laminating layer and a non-silicon release layer from bottom to top. The non-silicon release paper is low in cost and cannot influence the energization performance of a circuit board even if non-silicon release agents are transferred to glue and the circuit board when used. Two faces of the base paper are made into a glossy face and a matt face by means of laminating, a release coating is coated on the glossy face to enable a user to recognize easily, and the non-silicon release paper is low in water absorption and moisture absorption rates.

Description

Technical field [0001] The invention belongs to the field of release materials, and specifically relates to a non-silicon release paper, in particular to a non-silicon release paper applied to a flexible circuit board cover film. Background technique [0002] There are already many commercial release papers, they are mainly the following types: [0003] [0004] With the development of economy, some customers have higher and higher requirements for the types and requirements of release paper. Existing release paper can no longer meet the needs of consumers, especially for PI cover film factories, whose production mainly relies on high-priced imported release paper, which is often troubled by changes in delivery periods and is costly. Summary of the invention [0005] The purpose of the present invention is to provide a non-silicon release paper that is low in cost and does not affect the electrical performance of the circuit board in view of the deficiencies of the prior art. [000...

Claims

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Application Information

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IPC IPC(8): D21H19/22D21H19/24D21H19/80
Inventor 黄建中
Owner 广州市鸿鹄胶粘材料科技有限公司
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