Methods and apparatus for calculating electromagnetic scattering properties of a structure and for reconstruction of approximate structures

A technique for electromagnetic scattering and approximate structure, used in computer-aided design, originals for optomechanical processing, optomechanical equipment, etc.

Active Publication Date: 2014-11-05
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This reformulation makes the mismatch of the data independent of the measurement of χ and J a linear problem, while the mismatch in Maxwell's equations remains nonlinear due to the coupling of χ and J

Method used

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  • Methods and apparatus for calculating electromagnetic scattering properties of a structure and for reconstruction of approximate structures
  • Methods and apparatus for calculating electromagnetic scattering properties of a structure and for reconstruction of approximate structures
  • Methods and apparatus for calculating electromagnetic scattering properties of a structure and for reconstruction of approximate structures

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Embodiment Construction

[0047] This specification discloses one or more embodiments that incorporate the features of this invention. The disclosed embodiments are merely exemplary of the invention. The scope of the present invention is not limited to these disclosed embodiments. The invention is defined by the appended claims.

[0048] The described embodiments and references in the specification to "one embodiment", "an embodiment", "exemplary embodiment" and the like mean that the described embodiments may include particular features, structures, or characteristics, but each implementation Examples may not necessarily include specific features, structures or characteristics. Also, these paragraphs are not necessarily referring to the same embodiment. Furthermore, when particular features, structures or characteristics are described in conjunction with an embodiment, it should be understood that it is within the scope of knowledge of those skilled in the art to implement such features, structures...

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Abstract

A CSI algorithm for reconstructing grating profiles is disclosed. Solving a volume integral equation for current density, J, employs the implicit construction of vector field, F S related to the electric field, E S , and current density, J, by selection of continuous components of E and J, F being continuous at one or more material boundaries, so as to determine an approximate solution of J. F is represented by at least one finite Fourier series with respect to at least one direction, x, y, and the step of numerically solving the volume integral equation comprises determining a component of J, by convolution of F , with a convolution operator, M comprising material and geometric structure properties in both directions. J may be represented by at least one finite Fourier series with respect to both directions. The continuous components can be extracted using convolution operators, P T and P N , acting on E and J.

Description

technical field [0001] The invention relates to the calculation of electromagnetic scattering properties of structures. The invention can be applied to the metrology of microstructures, for example to evaluate the critical dimension (CD) performance of lithographic equipment. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually a target portion of the substrate. For example, lithographic equipment may be used in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to generate the circuit pattern to be formed on the individual layers of the IC. The pattern can be transferred onto a target portion (eg, comprising a portion, one or more dies) on a substrate (eg, a silicon wafer). The transfer of the pattern is usually by imaging the pattern onto a layer of radiation sensitive material (resist) provided on the substrate....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G06F17/10
CPCG06F17/11G03F7/705G01N21/4788G06F17/50G01N21/95607G03F1/84G03F7/70625H01L21/0274G06F30/00
Inventor M·C·范布尔登
Owner ASML NETHERLANDS BV
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