Methods and apparatus for calculating electromagnetic scattering properties of a structure
An electromagnetic scattering and property technology, applied in the direction of optomechanical equipment, microlithography exposure equipment, material analysis through optical means, etc., can solve the problem of large overall calculation time
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[0069] figure 1 A lithographic apparatus is schematically depicted. Lithography equipment includes:
[0070] - an illumination system (irradiator) configured to condition a radiation beam B (eg UV radiation or DUV radiation).
[0071] - a support structure (e.g. mask table) MT configured to support a patterning device (e.g. mask) MA and connected to a first positioner PM configured to be precisely positioned according to certain parameters said patterning device;
[0072] - a substrate table (e.g. a wafer table) WT configured to hold a substrate (e.g. a resist-coated wafer) W and connected to a second positioner PW configured according to certain parameters to precisely position the substrate; and
[0073] - a projection system (e.g. a refractive projection lens system) PL configured to project a pattern imparted to the radiation beam B onto a target portion C (e.g. comprising one or more dies) of the substrate W by the patterning device MA superior.
[0074] The illumin...
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