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Cooling device

A technology of heat dissipation device and heat sink, which is applied in heat exchange equipment, lighting and heating equipment, laminated components, etc., can solve the problem of low heat dissipation efficiency of heat dissipation device, and achieve the effect of improving heat dissipation efficiency and increasing heat dissipation area.

Inactive Publication Date: 2012-09-26
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] see figure 1 , which is a commonly used cooling device includes a radiator 80 and a fan 90, the radiator 80 includes a base 81 and a number of cooling fins 83 parallel to the top of the base 81, these cooling fins 83 are vertical Straight plate body, an air duct 85 is formed between two adjacent cooling fins 83, the base 81 of the radiator 80 can be in contact with a heating element 71 of a circuit board 70 to conduct the heat generated by the heating element to the heat sink. On the fins 83, the fan 90 can be installed on one side of the heat dissipation fins 83 to drive cold air to flow through the air duct 85 of the radiator 80, thereby taking away the heat on the heat dissipation fins 83, but the heat dissipation efficiency of the above-mentioned heat dissipation device is relatively low

Method used

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Embodiment Construction

[0023] Please also refer to Figure 2 to Figure 4 , In a preferred embodiment of the present invention, a heat dissipation device includes a heat sink 10 and a fan 30 that can be installed on one side of the heat sink 10 .

[0024] The heat sink 10 includes a base 11, the base 11 is provided with a plurality of first cooling fins 13, and the lower surface of the base 11 can be connected to the heating element 60 (such as a central processing unit) on a circuit board 50. touch. The first cooling fins 13 are parallel to each other and substantially perpendicular to the base 11 . A second heat dissipation fin 15 is installed between every two adjacent first heat dissipation fins 13 . Each second heat dissipation fin 15 includes a plurality of first heat dissipation fins 150 and second heat dissipation fins 151 . A first heat sink 150 is in contact with the base 11 . In one embodiment, the second heat dissipation fins 151 are in contact with the first heat dissipation fins 13 ...

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Abstract

A cooling device comprises a cooler. The cooler comprises a plurality of first fins and further comprises a plurality of second fins. Each of the second fins is between two adjacent first fins, and comprises a plurality of first cooling fins and second cooling fins connecting two adjacent first cooling fins.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device with high heat dissipation efficiency. Background technique [0002] Now the running speed of the computer is getting faster and faster, because the running speed of the computer mainly depends on the central processing unit, so the running speed of the central processing unit is also getting faster and faster, but for integrated circuit electronic components such as the central processing unit , the faster the running speed, the more heat it generates per unit time, if it is not discharged in time, it will cause its temperature to rise and cause its operation to be unstable. The industry all installs a cooling device on the surface of the central processing unit to assist its heat dissipation. As new processors are continuously released, the matching cooling device is also continuously improved. [0003] see figure 1 , which is a commonly used cooling devi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCH01L23/467G06F1/20H01L23/3672H01L2924/0002F28F3/048F28F3/025H01L2924/00
Inventor 曾祥鲲姚志江徐礼福
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD