Unlock instant, AI-driven research and patent intelligence for your innovation.

Printed substrate manufacturing equipment and manufacturing method

一种印刷基板、制造方法的技术，应用在印刷电路制造、印刷电路、印刷电路等方向，能够解决裂缝、半导体芯片支撑力变低等问题，达到防止裂缝的效果

Inactive Publication Date: 2012-09-26
HITACHI LTD
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the supporting force of the semiconductor chip becomes low, and there is a possibility that cracks may occur at the solder ring portion of the solder ball

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed substrate manufacturing equipment and manufacturing method
  • Printed substrate manufacturing equipment and manufacturing method
  • Printed substrate manufacturing equipment and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] Hereinafter, the manufacturing apparatus and manufacturing method of the printed circuit board of this invention are demonstrated using drawing. figure 1 It is a figure explaining one Example of the manufacturing method of the printed circuit board 33 of this invention, and shows the process of mounting the semiconductor chip 41 on the printed circuit board 33. Although in figure 1 Although not shown, solder bumps 39 are printed on the surface of the printed circuit board 33 using a solder ball printing machine in a previous process, and are fixed to the surface of the printed circuit board 33 by reflow.

[0018] like figure 1 As shown in (a), the printed circuit board 33 on which the solder bumps 39 are formed is carried into the underfill forming part and mounted on the lower stage 34 (step S1). When the printed circuit board 33 is mounted on the lower stage 34, a film-shaped underfill film ( Hereinafter also referred to as film) 30 .

[0019] In addition, protrus...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Solder bumps are formed on a plurality of electrode parts of a printed substrate (33) and a semiconductor chip (41) is loaded on the printed substrate via the plurality of solder bumps (39). In this case, a thermoplastic film (30) is prepared as an underfill that covers a surface of the printed substrate on which the solder bumps are formed. In the film, parts corresponding to the solder bumps are removed and a peripheral edge of a part on which the semiconductor chip will be loaded has a protruded form. After the printed substrate has been covered with the film, the film is bonded onto the board and the semiconductor chip is loaded on the printed substrate and carried into a reflow furnace. In the reflow furnace, heat and pressure (hp) are applied to fuse the solder bumps.

Description

technical field [0001] The present invention relates to a manufacturing device and method of a printed board, and more particularly to a manufacturing device and method of a printed board suitable for mounting a semiconductor chip on a printed board. Background technique [0002] In flip-chip bonding on a printed board, solder balls are attached to connection pads formed on the printed board, and a semiconductor chip is mounted via the solder balls. When the semiconductor chip is mounted on the printed board by this flip-chip bonding method, a gap G is generated between the semiconductor chip and the printed board according to the height of the solder ball attached to the connection pad. Therefore, the supporting force of the semiconductor chip becomes low, and cracks may occur in the solder ring portion of the solder ball. In particular, when a large temperature change occurs, thermal stress occurs in the solder balls due to differences in thermal expansion coefficients be...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34H01L21/603H01L21/56
CPCH01L2924/01082H05K2203/167H05K3/3436H01L2224/75281H05K3/303H01L2224/83192H01L21/563H05K2201/10674H01L23/564H01L2924/014H01L2224/81191H01L2224/83191H01L24/81H01L2224/81815H01L2224/9211H01L2224/8388H01L24/83H01L2924/01005H01L2924/01033H01L2924/01006H01L2224/81192H05K2201/0129H01L2224/83951H05K2201/10977H01L2224/16225H01L24/75H01L2224/75272H01L2224/73104H01L2924/351Y10T156/1304Y02P70/50H01L2224/81H01L2224/83H01L2924/3512H01L2924/00H05K3/28H05K3/34
Inventor 向井范昭三本胜本间真
Owner HITACHI LTD