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Semiconductor plastic package material and manufacturing method thereof as well as semiconductor plastic package piece

A technology of plastic encapsulants and packages, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as chip function failure, and achieve the effect of improving reliability

Active Publication Date: 2012-10-03
SAMSUNG SEMICON CHINA RES & DEV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When there is a defect in the chip area, especially a hole defect, with the accumulation of water vapor, at high temperature, it will cause the chip function to fail

Method used

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  • Semiconductor plastic package material and manufacturing method thereof as well as semiconductor plastic package piece
  • Semiconductor plastic package material and manufacturing method thereof as well as semiconductor plastic package piece
  • Semiconductor plastic package material and manufacturing method thereof as well as semiconductor plastic package piece

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Embodiment Construction

[0015] Hereinafter, exemplary embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

[0016] The semiconductor molding compound of the present invention includes a molding compound resin and a filler filled in the molding compound resin. In addition, the outer surface of the filler is covered with a water-absorbing material with high water absorption.

[0017] figure 2 is a schematic cross-sectional view showing a semiconductor package according to an exemplary embodiment of the present invention. refer to figure 2 , the semiconductor package according to an exemplary embodiment of the present invention includes: a substrate 5; a mount adhesive 4 positioned above the substrate 5; a chip 3 positioned above the substrate 5 and bonded to the substrate 5 through the mount adhesive 4; bonding Leads 6 electrically connect the chip 3 to the substrate 5 ; plastic encapsulant encapsulates and protects the above comp...

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Abstract

The invention discloses a semiconductor plastic package material and a manufacturing method thereof as well as a semiconductor plastic package piece. The plastic package material comprises plastic package material resin, a filling material which is filled into the plastic package material resin and a water absorbing material which covers the outer surface of the filling material. According to the invention, the moisture air in the semiconductor plastic package piece can be adsorbed, so that the reliability of the semiconductor plastic package piece is improved.

Description

technical field [0001] The invention relates to a semiconductor molding compound, a manufacturing method thereof, and a semiconductor package using the semiconductor molding compound. More specifically, the present invention relates to a semiconductor molding compound with high reliability, a manufacturing method thereof, and a semiconductor package using the semiconductor molding compound. Background technique [0002] With the development of information technology, people have more and more demands on semiconductor packages. figure 1 is a schematic cross-sectional view showing a semiconductor package according to the related art. refer to figure 1 , the semiconductor package includes: substrate 5; SMT adhesive 4, located above the substrate 5; chip 3, located above the substrate 5, bonded together with the substrate 5 through the SMT adhesive 4; bonding wire 6, the chip 3 and the substrate 5 electrical connection; molding compound resin 1 is used to encapsulate the chip...

Claims

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Application Information

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IPC IPC(8): H01L23/29H01L21/56
CPCH01L23/26H01L23/295H01L2224/16145H01L2224/16225H01L2224/32225H01L2224/48227H01L2224/73265H01L2924/15311H01L2924/1815H01L24/73H01L2924/00012H01L2924/00C08L101/00C08L63/00C08K9/04H01L23/29
Inventor 杜茂华
Owner SAMSUNG SEMICON CHINA RES & DEV
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