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LED (Light-Emitting Diode) package and packaging method thereof

A technology of LED packaging and LED chips, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of difficult and low-cost small LED packaging, high cost of injection molding molds, loss of sealant and phosphor materials, etc., to achieve Reduced losses, saving mold costs, and low cost effects

Inactive Publication Date: 2014-12-24
AAC TECH PTE LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention provides an LED package and its packaging method to solve the problems of high cost of injection molding in the prior art, difficulty in low-cost manufacturing of small LED packages, and serious loss of sealant and phosphor materials during the LED package process

Method used

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  • LED (Light-Emitting Diode) package and packaging method thereof
  • LED (Light-Emitting Diode) package and packaging method thereof

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Embodiment Construction

[0016] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0017] Such as figure 1 and figure 2 As shown, the present invention provides an LED package and a packaging method thereof, wherein the LED package includes a substrate 1, a first ceramic retaining wall 2 fixed on the substrate 1, and surrounding the first ceramic retaining wall 2 The second ceramic retaining wall 3 on the peripheral side and fixed on the substrate 1, a housing 4 fixed on the substrate 1, and a luminous body 5 accommodated in the housing 4, the first ceramic retaining wall 2 and the second ceramic retaining wall A gap 6 is provided between the retaining walls 3, and the shell 4 covers the first ceramic retaining wall 2 and the illuminant 5, forming a gap between the shell 4 and the illuminant 5, and the shell 4 and the substrate 1 The joint is located in the gap 6 between the first ceramic retaining wall 2 and the second ceramic ret...

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Abstract

The invention provides an LED (Light-Emitting Diode) package and a packaging method thereof. The LED package comprises a substrata, first ceramic retaining walls, second ceramic retaining walls, a shell and a luminous body, wherein the first ceramic retaining walls are fixed on the substrate; the second ceramic retaining walls are annularly arranged on the peripheral sides of the first ceramic retaining walls and are fixed on the substrate; the shell is fixed on the substrate; the luminous body is contained in the shell; gaps are formed between the first ceramic retaining walls and the second ceramic retaining walls; the shell covers the first ceramic retaining walls and the luminous body; and the joints of the shell and the substrate are positioned in the gaps between the first ceramic retaining walls and the second ceramic retaining walls. The LED package and he packaging method thereof have the beneficial effects that the loss of a sealed stop agent and a phosphor material can be reduced, the mold expense of a pressure injection mold is saved, and the miniature LED package can be manufactured with a low cost.

Description

【Technical field】 [0001] The invention belongs to the technical field of photoelectric devices, and in particular relates to an LED package and a package method thereof. 【Background technique】 [0002] Semiconductor light-emitting diode (LED) has the characteristics of high brightness, low energy consumption, long life, and fast response. It is a green and environmentally friendly solid light source, so it is widely used in lighting, traffic light display, flat panel display and other fields. [0003] However, traditional LED packages often use molds to manufacture lenses and then mount them on the retaining wall. In this way, the injection molds are often changed in small batch production and variety diversification, resulting in high production costs. In addition, the above-mentioned traditional LED packaging is difficult to apply to small LED products, because in miniaturized LED products, the assembly waste rate of small-sized objects is high, and it is also easy to over...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48
Inventor 金东明李忠硕南佶模金荣基河宗秀
Owner AAC TECH PTE LTD
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