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Method and device for determining a deformation of a disk-shaped workpiece, particularly a mold wafer

一种模塑成型、变形量的技术，应用在电气元件、半导体/固态器件制造、电路等方向，能够解决干扰量测结果、不能精确地确定变形量等问题

Active Publication Date: 2012-10-03
ERS ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Usually all these known methods cannot determine the deflection precisely because the measuring method or the clamping device has disturbed the measuring result

Method used

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  • Method and device for determining a deformation of a disk-shaped workpiece, particularly a mold wafer
  • Method and device for determining a deformation of a disk-shaped workpiece, particularly a mold wafer
  • Method and device for determining a deformation of a disk-shaped workpiece, particularly a mold wafer

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Embodiment Construction

[0039] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be practiced. Furthermore, the directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside" or "side", etc., It is only for orientation with reference to the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

[0040] In the icons, identical or functionally identical elements will be assigned the same reference numerals.

[0041] Figure 1a -c is a cross-sectional schematic diagram of a first embodiment of the device according to the present invention, and the device is used to determine a deformation amount of a disc-shaped workpiece (especially a molded wafer);

[0042] exist Figure 1a In -c, reference numeral 3 denotes a molded wafer...

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Abstract

The present invention relates to a method and to a device for determining a deformation of a disk-shaped workpiece, particularly a mold wafer. The device comprises a rotatable, height and laterally adjustable mounting unit (5, 5a, 15a-c; 5, 5a, 15d) for mounting an inner region (IB) of the disk-shaped workpiece (3); a determination unit (25) for determining eccentricity ([delta]) of a center axis (M') of the disk-shaped workpiece (3) from a center axis (M) of the mounting unit (5, 5a, 15a-c; 5, 5a, 15d) and for generating a suitable adjustment signal for the mounting unit (5, 5a, 15a-c; 5, 5a, 15d); a deposit unit (3a, 3b, 3c) for depositing the disk-shaped workpiece (3) during a lateral adjustment process of the mounting unit (5, 5a, 15a-c; 5, 5a, 15d), and a fixed-height detector unit (50) for measuring the deviation (WR) of a plurality of measuring points (P1-P8), respectively, in a non-mounted outer region (AB) of the disk-shaped workpiece (3) from a predetermined height position (Z0) corresponding to the deformation using a height position (Z0) of the mounting unit (5, 5a, 15a-c; 5, 5a, 15d) predetermined by rotating the mounting unit (5, 5a, 15a-c; 5, 5a, 15d) or the detector unit (50).

Description

technical field [0001] The present invention relates to a method and a device for judging a deformation amount of a disc-shaped workpiece, especially a molded wafer. Background technique [0002] Although not limited to the field of semiconductor technology, the invention and the problems underlying it will be elucidated in relation to mold wafers. [0003] In the field of semiconductor technology, disc-shaped workpieces (disc-shaped workpieces) in this case wafers are generally processed in a linear process chain, that is, under the flow line production of several consecutive devices, carrying out coordinated method steps . [0004] In the wafer processing of this case, precise alignment of the wafer is necessary before further processing, especially before cutting out several single chips from the wafer or before electrically contacting the chips. For this purpose, so-called workpiece alignment devices are used, which are known in the semiconductor industry as wafer alig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/68
CPCH01L21/67288
Inventor 鲁弟格·史金德勒
Owner ERS ELECTRONICS
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