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Method and device for controlling the manufacture of semiconductor by measuring contamination

A technology of semiconductors and manufacturing plants, applied in the field of manufacturing semiconductors or micro-electromechanical systems, can solve the problems of increasing the output and flexibility of semiconductor manufacturing plants, and achieve the effects of shortening storage and transmission time, optimizing manufacturing time, and extending storage time

Inactive Publication Date: 2012-10-03
ADIXEN VACUUM PRODUCTS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this is still not enough to achieve a satisfactory increase in the output and flexibility of semiconductor fabs

Method used

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  • Method and device for controlling the manufacture of semiconductor by measuring contamination
  • Method and device for controlling the manufacture of semiconductor by measuring contamination
  • Method and device for controlling the manufacture of semiconductor by measuring contamination

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Experimental program
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Embodiment Construction

[0069] First, we refer to figure 1 A schematic diagram in which incorporates a substrate processing apparatus according to an embodiment of the present invention. Therefore, it can be recognized that the semiconductor manufacturing unit 1 has a plurality of substrate processing apparatuses 2a, 2b, 2c, 2d, 2e, and 2f, and these reference numerals are given as examples only. Each processing device 2a-2f may include a reactor for deposition or etching, so that a series of various steps for processing batches of semiconductor substrates can be performed.

[0070] The semiconductor manufacturing unit 1 further includes a substrate storage device 3, a substrate transfer device 4, and a manufacturing command system MES related to the functions of the substrate processing devices 2a-2f, the substrate storage device 3, and the substrate transfer device 4. in figure 1 In the illustrated embodiment, the semiconductor manufacturing unit 1 further includes a gas analysis device 5, an internal...

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PUM

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Abstract

The present invention relates to a device for handling substrates in a semiconductor manufacturing plant that has substrate processing facilities, a substrate storage means, a substrate transport means, and a system for controlling manufacturing execution systems (MES) in functional relationship to the substrate processing facilities, the substrate storage means, and the substrate transport means. Said device includes: at least one substrate storage and transport box that is transported by the transport means and stored in the storage means,at least one device for analyzing the gases forming the inner atmosphere of a substrate storage and transport box, said analyzing device producing analysis signals that represent the critical gas amount that is capable of generating molecular contamination and is present in the storage and transport box,and a control device that controls the transport means and storage means, the control device including instructions for detecting a need for molecular decontamination on the basis of analysis signals emitted by the gas-analyzing device.

Description

Technical field [0001] The present invention relates to a method and device for manufacturing semiconductors or micro-electromechanical systems (MEMS) through implementation in a semiconductor manufacturing plant. More specifically, the present invention relates to a device for increasing the output of a semiconductor manufacturing plant. Background technique [0002] In a semiconductor manufacturing plant, substrates such as semiconductor wafers and / or photomasks need to be processed in a processing chamber, in which various steps are performed, such as a step of depositing materials and an etching step. Between each step, the substrate moves between devices. [0003] When manufacturing microelectronic chips, a large number of processing steps (approximately 400) can cause sequence restrictions between processing equipment. The substrate is transferred between devices. Because the waiting time between equipment can be long (usually several hours), it is necessary to store the su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/673
CPCH01L21/67253H01L21/67389Y02P90/02
Inventor A·法夫尔J·布努阿尔
Owner ADIXEN VACUUM PRODUCTS