Heating structure of printed circuit board laminating machine
A technology for heating structures and printed circuits, used in lamination, lamination devices, layered products, etc., can solve the problems of heating blanket failure, deformation of the carrier plate, etc., to improve equipment life, stable heating rate, and improve products. Yield effect
Inactive Publication Date: 2012-10-31
竞陆电子(昆山)有限公司
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Problems solved by technology
[0002] In the prior art, when the laminator presses the printed circuit board, the carrier plate is placed on the lower pallet, the printed circuit board stack structure is placed in the carrier plate, and the upper platen is pressed down to realize the pressing. The heating method is general. If the heating electric blanket is installed in each carrier plate, since the carrier plate needs to be transported repeatedly, it is easy to cause the failure of the heating electric blanket and the deformation of the carrier plate
Method used
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Embodiment
[0010] Embodiment: a heating structure of a printed circuit board laminating machine, the laminating machine has a lower supporting plate 1 and an upper pressing plate 2, and heaters 3 are installed inside the upper pressing plate 2 and the lower supporting plate 1, and the heating Device 3 is a heating electric blanket.
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The invention discloses a heating structure of a printed circuit board laminating machine. The laminating machine is provided with a lower supporting plate and an upper pressure plate; and heaters are arranged inside both the upper pressure plate and the lower supporting plate. According to the invention, the heaters are arranged inside the upper pressure plate and the lower supporting plate, and thus, not only is the warming rate stable and the yield of products can be promoted, but also a bearing disk is difficult to deform and the service life of equipment can be prolonged. Moreover, the heating structure has simple structure and is easy to implement.
Description
technical field [0001] The invention belongs to the improvement of printed circuit board production equipment, and in particular relates to a heating structure of a laminator. Background technique [0002] In the prior art, when the laminator presses the printed circuit board, the carrier plate is placed on the lower pallet, the printed circuit board stack structure is placed in the carrier plate, and the upper platen is pressed down to realize the pressing. The heating method is general. If the heating electric blanket is installed in each carrying plate, since the carrying plate needs to be transported repeatedly, it is easy to cause the failure of the heating electric blanket and the deformation of the carrying plate. Contents of the invention [0003] In order to overcome the above-mentioned defects, the present invention provides a heating structure of a printed circuit board lamination machine. The heating structure of the printed circuit board lamination machine not...
Claims
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Inventor 李泽清
Owner 竞陆电子(昆山)有限公司