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System and method for realizing communication between local main module and local sub module

An inter-module and main module technology, applied in the direction of instruments, electrical digital data processing, etc., can solve the problem of excessive main CPU resources, improve reliability, versatility and scalability, and reduce the occupation of main CPU resources. Effect

Active Publication Date: 2012-10-31
SHENZHEN INOVANCE TECH +1
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AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a system and method for realizing communication between the local master-slave modules in view of the problem that the protocol analysis in the communication between the master-slave modules of the above-mentioned system occupies too many resources of the master CPU

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  • System and method for realizing communication between local main module and local sub module
  • System and method for realizing communication between local main module and local sub module
  • System and method for realizing communication between local main module and local sub module

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Embodiment Construction

[0032] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0033] Such as figure 2 What is shown is a schematic diagram of a system embodiment of the present invention for realizing communication between local master and slave modules. The system is used for realizing communication between the master module and the local module of the same device. In this embodiment, the system includes a main module 20 and a local module 10, where the main module 20 includes a main CPU 21, a dual-port RAM 221, and a soft core processor 222. The above-mentioned main module 20 may be a programmable logic controller (PLC) or the like. The programmable logic controller...

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Abstract

The invention provides a system for realizing communication between a local main module and a local sub module, which is used for realizing the communication between a main module and a local module of same equipment, wherein the main module comprises a main CPU (central processing unit), a dual-port RAM (random access memory) and a soft-core processor; the dual-port RAM (random access memory) is used for storing data written by the main CPU and the soft-core processor; the soft-core processor comprises a protocol analysis unit for carrying protocol analysis on the data written to the dual-port RAM by the main CPU, sending the analyzed data to the local module, carrying protocol analysis on the data of the local module and writing the analyzed data to the dual-port RAM; and the main CPU is used for directly writing data to the dual-port RAM and reading the data written by the soft-core processor from the dual-port RAM. The invention further provides a corresponding method. According to the system and the method, provided by the invention, the protocol analysis for the communication between the main module and the sub module is realized through the soft-core processor, so that the resource occupation of the main CPU is reduced, therefore the reliability of the system internal communication is improved.

Description

Technical field [0001] The present invention relates to the field of device internal communication, and more specifically, to a system and method for realizing communication between local master and slave modules. Background technique [0002] In industrial products, in addition to communicating with the outside through the fieldbus, there are also a large number of local master-slave communications within the system. For example, in a programmable logic controller (PLC), internal communication is mainly reflected in the communication between the main module (such as the main CPU) and the local module (such as the expansion module). These communications usually use internal custom protocol forms, such as bus communication or SPI communication, etc. The interface form is that the main module and the local module are directly connected through the chip port. [0003] Such as figure 1 Shown is a schematic diagram of the communication between the existing main CPU and the local module...

Claims

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Application Information

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IPC IPC(8): G06F13/14
Inventor 郑臣艳朱凯胡平
Owner SHENZHEN INOVANCE TECH
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