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A metamaterial assembly structure and assembly method thereof

An assembly structure and assembly method technology, applied in the field of metamaterials, can solve the problems of cumbersome assembly process, time-consuming assembly cost, etc., and achieve the effects of high assembly efficiency, low production cost, and convenient assembly and fixation.

Active Publication Date: 2015-09-16
KUANG CHI INST OF ADVANCED TECH +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Although the above-mentioned assembly method of the existing metamaterials can conveniently control the thickness of the space between the metamaterial plates through the separator and the double-sided adhesive layer, the disadvantage is that the assembly process is cumbersome, not only time-consuming but also the assembly cost is too high

Method used

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  • A metamaterial assembly structure and assembly method thereof
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  • A metamaterial assembly structure and assembly method thereof

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Embodiment 1

[0027] A metamaterial assembly structure, its cross-sectional view can be found in the attached figure 2 , for assembling a multilayer metamaterial plate 1 and a separator 2 with a microstructure in its own array. The metamaterial assembly structure includes a fixed plate 4, a buckle pin 5 and a buckle structure. Both sides of the metamaterial plate 1 are provided with spacers. The plate 2 and the snap pin 5 are vertically arranged relative to the fixed plate 4 and integrally formed with the fixed plate 4. The top of the snap pin 5 is provided with a snap structure, and the snap structure is composed of two pieces symmetrical to the central axis of the snap pin 5. The shrapnel 6 is composed of axisymmetrically arranged shrapnel 6. The top of the shrapnel 6 is a wedge-shaped buckle part 7. The position of the metamaterial plate 1 corresponding to the buckle pin 5 is provided with a fixed through hole, and the position of the partition 2 corresponding to the buckle pin 5 is also...

Embodiment 2

[0034] A metamaterial assembly structure, its cross-sectional view can be found in the attached image 3 , used to assemble multi-layer metamaterial plate 1 and separator 2 with microstructure in its own array. The metamaterial assembly structure includes fixing plate 4, buckle pin 5, cover plate 8 and buckle structure. Both sides of metamaterial plate 1 All partitions 2 are provided, and all partitions 2 are integrally formed structures. The buckle pin 5 is vertically arranged relative to the fixed plate 4 and integrally formed with the fixed plate 4. The top of the buckle pin 5 is provided with a buckle structure. The structure is composed of two shrapnels 6 symmetrically arranged with the central axis of the buckle pin 5 as the symmetrical axis. The top of the shrapnel 6 is a wedge-shaped buckle part 7, and the position of the supermaterial plate 1 corresponding to the buckle pin 5 is provided with a fixed through hole. The position of the clapboard 2 corresponding to the b...

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Abstract

The invention provides a metamaterial assembly structure which is used for assembling a plurality of metamaterial boards with microstructures in arrays per se. The assembly structure comprises a fixing board and at least two buckling pins arranged on the fixing board, the top end of each buckling pin is provided with a buckling structure, fixing through holes are arranged on the metamaterial boards in positions corresponding to the buckling pins, and the buckling pins pass through the fixed through holes to fixedly connect the metamaterial boards. The assembly method of the assembly structure provided by the invention has the advantages that the assembly of metamaterials becomes easier and more convenient, the assembly efficiency is higher, and the production cost is lower.

Description

【Technical field】 [0001] The invention relates to the field of metamaterials, in particular to a metamaterial assembly structure and an assembly method thereof. 【Background technique】 [0002] Metamaterial is a kind of composite man-made material. Its basic structure is a metamaterial plate with a thickness of millimeter order. The metamaterial plate is composed of a dielectric substrate and an array of artificial microstructures on the dielectric substrate. The metamaterial plate is passed through a certain row. The combination of distribution rules constitutes a metamaterial. [0003] In view of the above-mentioned structural characteristics of metamaterials, in order to realize the assembly of metamaterial boards, people naturally think of the way of using adhesive backing, that is, borrowing from existing consumer electronics such as mobile phones, digital photo frames, MP3 / 4 and other products. a fixed way. The metamaterial plates can be bonded together by means of ad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q15/00B32B9/04B32B7/08
Inventor 刘若鹏吕晶赵治亚王书文法布里齐亚
Owner KUANG CHI INST OF ADVANCED TECH
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