Reverse dip-coating method and device thereof

Abstract

The invention relates to a reverse dip-coating method and a device thereof. The device comprises a direct current regulated power supply, an electric push rod, a sol container and a substrate fixing device, wherein the sol container is a thermostatic container and is installed on a lifting push rod of the electric push rod, the electric push rod is controlled by the direct current regulated power supply, the advancing speed of the electric push rod is regulated through the voltage, and the substrate fixing device which is used for fixing a substrate is also arranged on one side of the sol container. The device has the advantages of being wide in control range of lifting speed, high in precision, good in stability, convenient to operate, good in continuity of coating, low in manufacturing cost of the device and the like, by the aid of the device, thin films with thicknesses in a range of dozens of nanometers to microns can be prepared on substrates which can be in any shape and of various sizes, and the uniformity and the consistency of prepared thin films are good.

Description

technical field [0001] The invention belongs to the technical field of thin film preparation, and relates to a reverse pulling method for film formation and a device thereof. Background technique [0002] The sol-gel method has the advantages of simple process, low equipment requirements, and easy preparation of uniform multi-component films, and has attracted extensive attention in the field of film preparation. When the film is prepared by the sol-gel method, the film-forming techniques mainly include spin coating method, spray coating method and pulling method. Among them, the spin coating method is only suitable for small-sized flat substrates, and its use is basically limited to laboratory research and development; while the spray coating method and pull-up method can prepare thin films on large-sized substrates of different shapes, and are widely used in laboratory and industrial production. are of practical value. [0003] The main process of the spraying method is:...

AI Technical Summary

Problems solved by technology

However, during the liquid discharge process, the patent CN200410022550.X uses gravity or pressure to control the liquid discharge speed. With the discharge of the sol, the gravity decreases, resulting in a decrease in the liquid discharge speed and uneven film thickness; When controlling the liquid discharge speed, the precise control of the pressure is also extremely difficult

In addition, after the sol is discharged, the sol must be added to the container when coating the film again, which makes the continuity of the film coating process poor

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