Chassis with bus structure

A bus structure and chassis technology, applied in the direction of support structure installation, etc., can solve the problems of low installation strength, inapplicability, failure, etc., to achieve the effect of satisfying installation reliability, improving assembly efficiency, and saving material costs

Active Publication Date: 2012-11-07
RIGOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional electronic equipment structure installation is connected by screws. The advantage of this connection method is that it is reliable and stable; the disadvantage is that the installation takes man-hours, and structures such as screw holes and nuts take up a lot of space, and the structure that is too compact is not suitable.
[0004] The traditional plastic hook can make the instrument compact, but there are many disadvantages: 1. Due to the poor fatigue resistance of ordinary plastic, it will break or fail after repeated disassembly and assembly
2. The installation strength is not high
3. The mold structure is complex
However, the structural scheme of the above application is suitable for a relatively large bus-type chassis installed on the cabinet, which is large in size and not compact in structure, and is not suitable for the structural scheme of desktop operation instruments

Method used

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  • Chassis with bus structure
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  • Chassis with bus structure

Examples

Experimental program
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Embodiment 1

[0047] Such as figure 1 , 2 As shown, this embodiment provides a chassis with a bus structure, including a rear end cover 1, a sleeve 8, an instrument frame 30, a module card 3, a main control board 10, a power module 9, and a front panel 7. The sleeve 8, an instrument frame 30 is arranged, the rear end wall of the instrument frame 30 is provided with a module card inlet 27, the side wall is provided with a power module socket 28, and a module card guide rail 29, a main control board 10 and a bus backplane 5 are arranged inside, and the main The control board 10 is arranged on the side wall of the module card guide rail 29 and connected to the power module 9 , and the power module 9 is arranged on the power module socket 28 .

[0048] Such as figure 2 , 3 As shown, the inside of the front frame 6 is longitudinally provided with a bus backplane 5, and the module card 3 is inserted into the module card guide rail 29 through the module card inlet 27 and inserted into the bus ba...

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PUM

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Abstract

The invention relates to a chassis with a bus structure. The chassis comprises a sleeve, an instrument frame and a main control panel, wherein the instrument frame is arranged in the sleeve; a module card entrance is arranged at the rear end wall of the instrument frame; a power-supply module socket is arranged on the side wall of the instrument frame; a module card guide rail and the main control panel are arranged in the instrument frame; the main control panel is arranged on the side wall of the module card guide rail and is connected with the power-supply module which is arranged on the power-supply module socket; the instrument frame is fixedly connected by inserting a front frame and a rear frame; a bus rear panel is longitudinally arranged in the front frame; the module card is inserted into the module card guide rail through the module card entrance and is socketed with the bus rear panel; and the module card guide rail is connected with the rear frame and the front frame respectively in a clamping and hooking way. According to the chassis with the bus structure, the design difficult point of an instrument in a compact space is solved, as the internal main structures and the main control panel are all assembled by self-locking structure assembles such as plugging, clamping and hooking, the chassis is high in assembling efficiency, compact in structure and high in installation reliability.

Description

technical field [0001] The invention mainly relates to an incoming bus type cabinet, in particular to a cabinet with a bus structure. Background technique [0002] Nowadays, the functions of electronic equipment are becoming more and more complete, and the internal structure is becoming more and more complicated. Due to the space and convenience of carrying, etc., it is required to develop towards miniaturization, which puts forward higher requirements for the internal structure design of electronic equipment. Packing the most functional devices into the smallest volume is the goal of modern electronic equipment design. [0003] The traditional electronic equipment structure installation is connected by screws. The advantage of this connection method is that it is reliable and stable; the disadvantage is that the installation takes man-hours, and structures such as screw holes and nuts take up a lot of space, and the structure that is too compact is not suitable. [0004] T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/14
Inventor 王悦王铁军李维森
Owner RIGOL
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