Semiconductor packaging structure and manufacturing method thereof

Abstract

The invention provides a semiconductor packaging structure and a manufacturing method thereof. The method for manufacturing the semiconductor packaging structure comprises the following steps of: arranging a first chip on a substrate; arranging a second chip on the first chip; arranging a third chip on the second chip; and connecting the semiconductor packaging structure between an upper surface of the exposed part of the first chip and a lower surface of the corresponding part of the third chip through a plurality of connecting components. According to the semiconductor packaging structure, the manufacturing cost of the stacked chip can be reduced.

Description

technical field [0001] The invention relates to a semiconductor packaging structure and a manufacturing method thereof, in particular to a semiconductor packaging structure of stacked chips and a manufacturing method thereof. Background technique [0002] In the semiconductor production process, integrated circuit packaging (IC package) is one of the important steps in the manufacturing process. It is used to protect the IC chip and provide external electrical connections to prevent damage from external forces or environmental factors during transportation and placement. In today's electronic devices, a single electronic device usually needs to be provided with multiple chips to perform multiple functions at the same time, so as to meet the needs of modern people for electronic devices. However, if a plurality of chips are respectively formed in different packaging structures, the occupied space of the packaging structures will be increased. Therefore, semiconductor structu...

AI Technical Summary

Problems solved by technology

However, since TSV technology needs to drill holes on chips or wafers, the requirements for manufacturing process time and precision control are very high, resulting in a very expensive manufacturing process.

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