Post-CMP cleaning brush

Abstract

Embodiments of the invention include a CMP brush that has a combination of central nodules at an inner region of the brush and one or more edge nodules at an end region of the brush where the central nodules and edge nodules are in a staggered or matched arrangement with each other and an upper surface of each edge nodule on the brush has the same or a greater contact area than an upper surface of a central nodule. The area of contact of the upper surface of each edge nodule with the substrate edge region is the same or greater than the area of contact of the upper surface of a central nodule with the substrate center region.

Description

[0001] priority [0002] This application claims the benefit of U.S. Provisional Application No. 61 / 425,644, filed December 21, 2010, and U.S. Provisional Application No. 61 / 306,582, filed February 22, 2010, the entire contents of which are incorporated by reference This article. technical field [0003] The present invention generally relates to chemically mechanically polished substrates. More particularly, the present invention relates to brushes for cleaning substrates after chemical mechanical polishing. Background technique [0004] Integrated circuits can be formed on semiconductor substrates, especially silicon wafers, by successive deposition of conductive, semiconductive and insulating layers on the wafer. Features of the circuit can be etched after each layer is deposited. After deposition and etching of a series of layers, the surface of the uppermost layer of the substrate may become increasingly non-planar. Non-planar surfaces can create problems during the...

AI Technical Summary

Problems solved by technology

[0009] However, with conventional CMP brushes, a certain amount of undesired particles can still remain on the washed substrate surface, especially in the near-edge regions

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