Temperature sensor as flip chip on a printed circuit board

A temperature sensor and circuit board technology, which is applied to thermometers, thermometers, instruments, etc. that use electric/magnetic components that are directly sensitive to heat, can solve problems such as unfavorable response time and variable measurement accuracy

Active Publication Date: 2012-12-05
HERAEUS SENSOR NITE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the meanders are shortened until thermal decoupling is achieved on the plastic circuit board in order to further simplify mass production, this results in unfavorable response times and thus poor measurement accuracy

Method used

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  • Temperature sensor as flip chip on a printed circuit board
  • Temperature sensor as flip chip on a printed circuit board
  • Temperature sensor as flip chip on a printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] A piece of 300 mm x 150 mm x 0.4 mm BT epoxy resin foil 10 plated with 50 μm copper on both sides and reinforced with glass fibers was processed into 1000 larger units 1 of 15 mm x 3 mm. Here, each unit 1 is provided with a contact spread 15 at one end and with a larger contact area 11, 17 of 3.5 x 2.5 mm on the front and back at the other end. The larger contact area 11 is connected to the smaller contact area 13 via a guide rail 12 in a meandering manner. On the opposite side, the contact expansion 15 is connected to the larger contact area 17 via meander-shaped guide rails 16 . Two smaller contact areas 13 , 14 of 1.5 mm extending in the longitudinal direction of the printed circuit board 1 are provided on the front side and are bridged by the flip chip 4 . The contact extension 15 is arranged on one of the smaller contact areas 14 .

[0057] The contact area is plated with soft solder 2. The soft solder 2, in particular the smaller contact areas 13, 14, contains ...

Embodiment 2

[0063] A piece of 150 mm x 100 mm x 0.3 mm BT epoxy resin foil coated with 50 μm copper on both sides and reinforced with glass fibers was processed into 500 smaller units 1 , in particular with dimensions of 10 mm x 2.5 mm. Here, each unit 1 is provided with a contact spread 15 at one end and with a larger contact area 11 , 17 of 2.5×2 mm on the front and back at the other end. On the opposite side, the contact extension 15 is connected to the contact area 17 via the guide rail 16 . Two smaller contact areas 13 , 14 of 1 mm extending in the longitudinal direction of the printed circuit board 1 are provided on the front side and are bridged by the flip chip 4 . During the processing of the copper coating, the smaller contact area 13 in this area is connected to the larger contact area 11 via the guide rail 12 . The current spreader 15 is formed outside the small contact region 14 . A linear, 1 mm wide guide rail 16 is formed between the contact extension 15 and the larger co...

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Abstract

To produce a temperature sensor, in which a conductor track (42), which has at least 100 Ohm and is made of platinum, is connected via contact fleids (41) to two conductor tracks (12, 16) made of copper, and in which the conductor track (42) made of platinum, which is implemented ifl thin-film technology as a platinum track that is at least 10 mm long, 3 to 50 pm wide and 0.1 to 5 pm thick on a rectangular surface area measuring 1 to 10 mm of a 0.1 to 1 mm thick ceramic plate (40), transitions at its two ends into contact fleids (41) that are 20 to 500 times wider, according to the invention these two widened fields (41) ifl the interior of these fleids (41) are structured, a metal paste is applied to the two internally structured flelds, and the metal paste is burned ifl, whereby the thick film (3) / pad, which is generated from the paste, contains an oxidic component and is fixed to the oxidic surface of the ceramic plate (40) which is freely accessible due to the internal structure of the contact fields (41).

Description

technical field [0001] The invention relates to a temperature sensor with a circuit board fixed between two cores of an electrical cable, and also to the manufacture of this temperature sensor, in which a guide rail made of platinum contacts the circuit board via two contact areas Two guide rails are connected, wherein the platinum guide rail is processed in thin-layer technology as a platinum guide rail 0.1 to 1 m long, 10 to 100 μm wide and 1 to 5 μm thick, which is located 1 to 10 mm on a ceramic plate with a thickness of 0.1 to 1 mm 2 On a rectangular surface of the size of , the platinum rail transitions at its two ends into a contact area that is 2 to 5 times wider. Background technique [0002] DE 39 39 165 C1 discloses a temperature sensor in which a plastic foil is connected to a connecting cable on the front and back, and a component is provided on one side of the foil which is connected to the connecting cable via guide rails on the front and back. However, the c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/18
CPCG01K7/18
Inventor K・维南德G・黑克尔S・迪特曼
Owner HERAEUS SENSOR NITE
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