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Thin closed magnetic circuit inductor and manufacturing method thereof

A manufacturing method and closed magnetic circuit technology, applied in the manufacture of inductors/transformers/magnets, inductors with magnetic cores, circuits, etc., can solve the problems of difficulty in reducing costs, poor inductance characteristics, poor production efficiency, etc. Production cost, avoid air bubbles and powder settling, improve the effect of inductor quality

Inactive Publication Date: 2012-12-05
重庆美桀电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The above-mentioned use of magnetic glue to make wire-wound chip inductors has poor production efficiency, difficulty in reducing costs, and poor inductance characteristics

Method used

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  • Thin closed magnetic circuit inductor and manufacturing method thereof
  • Thin closed magnetic circuit inductor and manufacturing method thereof
  • Thin closed magnetic circuit inductor and manufacturing method thereof

Examples

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Embodiment Construction

[0020] The present invention provides a thin closed magnetic circuit inductor and its manufacturing method. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0021] figure 2 The thin closed magnetic circuit inductor of the present invention is shown, including a magnetic core 4, a coil 5, and a covering body 6'.

[0022] The magnetic core 4 has a first surface 41 and a second surface 42 facing each other, the first surface 41 has a convex portion 410 , and the second surface 42 has a silver-plated portion 420 . The silver-plated part 420 is formed by forming a recess on the second surface 42 of the magnetic core 4 and then electroplating silver on ...

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PUM

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Abstract

The invention provides a thin closed magnetic circuit inductor and a manufacturing method thereof. The method comprises the following steps of: mixing a powdery magnetic material and a powdery adhesive to form a solid mixture according to a preset ratio; putting a magnetic core with a convex part into a mold in an upwards convex part mode; arranging a coil on the magnetic core, so that the convex part of the magnetic core penetrates through a hollow part of the coil; filling the solid mixture into the mold so as to cover the first surface of the convex part of the magnetic core, the convex part and the coil; and finally, heating the solid mixture in the mold, so that the powdery magnetic material is adhered through the powdery adhesive so as to coat the coil and the convex part of the magnetic core, and high-pressure forming is not required during heating. The manufacturing cost of the thin closed magnetic circuit inductor can be reduced, the production efficiency is improved, and the inductance of the inductor is improved.

Description

technical field [0001] The invention relates to a thin closed magnetic circuit inductor and a manufacturing method thereof, in particular to a thin closed magnetic circuit inductor encapsulated by a solid mixture and a manufacturing method thereof. Background technique [0002] Inductor is a kind of passive component, which has the functions of wave filtering, noise reduction, instantaneous current suppression, EMI reduction and power conversion, etc. It has been widely used in various electronic products for a long time. [0003] Chip inductors have the advantages of small size and standardized size, and their market share has been increasing in recent years. They can be divided into two types: multi-layer chip inductors and wire-wound chip inductors. , wherein the wire-wound chip inductor is wound in a high-density manner and packaged into a chip shape. Wire-wound chip inductors have the advantages of traditional coils and multilayer chip inductors, but their production i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F41/00H01F17/04
Inventor 谭隆竞罗鹏程
Owner 重庆美桀电子科技有限公司
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