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Test structure and test method

A technology for testing structures and testing ports, which is applied in the direction of measuring devices, instruments, electrical components, etc., can solve the problems of unavoidable conductive plugs deviating from the conductive layer area, excessive conductive plugs, and increased costs, so as to save area and solder The number of discs is small and the effect of improving detection efficiency

Active Publication Date: 2012-12-19
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this design rule requires the manufacture of excessive conductive plugs, which increases the cost, and the use of this design rule cannot prevent the conductive plugs from deviating from the conductive layer area.

Method used

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  • Test structure and test method

Examples

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no. 1 example

[0028] The first embodiment of the present invention provides a test structure, the specific structure schematic diagram please refer to figure 2 , the test structure includes several column conductive layers 610, 620, 630, 640 and several row conductive layers 801, 802, the several column conductive layers are located on the same layer, the several row conductive layers are located on another layer, the column The conductive layer and the row conductive layer are arranged crosswise, and are electrically connected at the cross position by conductive plugs at different intervals from the edge of the column conductive layer or the edge of the row conductive layer, wherein the row conductive layer, the column conductive layer, and the conductive plug at the cross position constitute Test unit: a first selection unit 910 and a second selection unit 920, the first selection unit 910 is respectively connected to several rows of conductive layers 801, 802, and is used to select one o...

no. 2 example

[0045] The second embodiment of the present invention provides another test structure, please refer to the specific structure schematic diagram image 3 . The test structure includes several columns of conductive layers 110, 120, 130, 140, 310, 320, 330, 340 and several rows of conductive layers 301, 302, 501, 502, and the column conductive layers 110, 120, 130, 140 are located at The same layer, the column conductive layers 310, 320, 330, 340 are located in another layer, the row conductive layers 301, 302 are located in the same layer, the row conductive layers 501, 502 are located in another layer, and the column conductive layers Arranged crosswise with the row conductive layer, and electrically connected at the cross position through conductive plugs with different spacing from the edge of the column conductive layer or the edge of the row conductive layer, wherein the row conductive layer, column conductive layer, and conductive plug at the cross position constitute a te...

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Abstract

The invention discloses a test structure. The test structure comprises multiple row conductive layers, multiple column conductive layers, a first selection unit, a second selection unit, a first test port and a second test port, wherein the row conductive layers and the column conductive layers of adjacent layers are crossly arranged and electrically connected in crossed positions through conductive plugs with different distances from the edges of the row conductive layers or the column conductive layers; the first selection unit is connected with the row conductive layers respectively and used for selecting one of the row conductive layers for communicating an electric signal; the second selection unit is connected with the column conductive layers respectively and used for selecting one of the column conductive layers for communicating the electric signal; the first test port is connected with the first selection unit; and the second test port is connected with the second selection unit. The invention further provides a test method using the test structure. Minimal distance between each conductive plug and the edge of each conductive layer can be tested by using the test structure, so that the area of a test base plate is saved, and the test efficiency is improved.

Description

technical field [0001] The invention relates to a semiconductor manufacturing process, in particular to a test structure and a test method for testing the minimum distance between a conductive plug and the edge of a conductive layer. Background technique [0002] With the rapid development of Ultra Large Scale Integration (ULSI), the manufacturing process of integrated circuits has become more and more complex and refined, and the width of conductive layers such as polysilicon gates and metal interconnections has become thinner and thinner. The distance between the conductive plug and the edge of the conductive layer also becomes smaller and smaller. Since the actual position of the conductive plug may be shifted compared with the position of the conductive plug in the layout design, if the position of the conductive plug is too close to the edge of the conductive layer during the layout design process, the actual conductive plug There may be only a partial connection betwe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/544G01B7/14
Inventor 冯军宏甘正浩
Owner SEMICON MFG INT (SHANGHAI) CORP