Package carrier and package structure

A technology for packaging a carrier board and a packaging structure, which is applied to cooling/heating devices, lighting devices, circuit heating devices, etc. of lighting devices, and can solve the problems of difficult manufacturing process, high manufacturing process complexity, and high manufacturing cost of light-emitting diode packaging structures. , to achieve the best cooling effect

Inactive Publication Date: 2012-12-19
SUBTRON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the number of packaging substrates and circuit substrates required for the LED packaging structure with the luminous effect of the three-dimensional polyhedron is large, which in turn leads to high manufacturing costs and difficult manufacturing processes for the LED packaging structure. The complexity is also higher

Method used

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  • Package carrier and package structure
  • Package carrier and package structure
  • Package carrier and package structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0074] figure 1 It is a schematic cross-sectional view of a packaging substrate according to an embodiment of the present invention. Please refer to figure 1 , in this embodiment, the package carrier 200 a includes a carrier 210 a, a dielectric layer 220 , a metal layer 230 , a surface treatment layer 240 and a solder resist layer 250 . In detail, the carrier 210a has a main mounting surface 212a and at least two side mounting surfaces 214a, 214b connected to the main mounting surface 212a, wherein the carrier 210a is, for example, a cooling block, a cooling fin, a heat pipe or a steam tank ( vapor chamber) soaking block. Herein, the carrier 210a is illustrated as a heat sink as an example.

[0075] The dielectric layer 220 is disposed on the carrier 210 a, and the dielectric layer 220 has a plurality of first openings 222 . In this embodiment, the package carrier 200 a further includes an adhesive layer 260 , and the dielectric layer 220 is attached to the carrier 210 a t...

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Abstract

The invention discloses a package carrier and a package structure. The package carrier includes: a carrier having a main mounting surface and at least two side mounting surfaces connecting the main mounting surface; a dielectric layer disposed on the carrier, having multiple first openings and extending from the main mounting surface up, along boundaries between the main mounting surface and the side mounting surfaces, onto the side mounting surfaces, in which the first openings expose a portion of the main mounting surface and portions of the side mounting surfaces; a metal layer disposed on the dielectric layer and having multiple second openings disposed correspondingly to the first openings and multiple third openings exposing the partial dielectric layer at the above-mentioned boundaries; a surface treatment layer disposed on the partial metal layer; and a solder resist layer disposed on a portion of the metal layer and a portion of the dielectric layer both exposed out of the surface treatment layer.

Description

technical field [0001] The present invention relates to a package carrier board and package structure, and in particular to a package carrier board and package structure with better heat dissipation effect. Background technique [0002] Taking the currently commonly used LED packaging structure as an example, the LED chip needs to be packaged before use, and the LED chip will generate a large amount of heat energy when emitting light. If the heat energy generated by the LED chips cannot be dissipated and continuously accumulates in the LED packaging structure, the temperature of the LED packaging structure will continue to rise. As a result, the light emitting diode chip may cause brightness attenuation and shorten service life due to overheating, and even cause permanent damage in severe cases. Therefore, the LED packaging structure adopted today is equipped with a heat sink to dissipate heat from the LED chip. [0003] The existing packaging substrate is mainly composed ...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H01L33/48H01L33/64H01L25/075
CPCH05K2201/10106H01L23/427H01L2224/48137H05K2201/047H01L33/642F21Y2111/007H05K1/0206H05K1/05H05K3/0061H01L2224/48227H05K1/021H01L23/142F21V29/22F21Y2101/02F21V29/70F21Y2115/10F21Y2107/40
Inventor吴建男
OwnerSUBTRON TECH