101results about "Box-like PCB arrangements" patented technology

An unmanned aerial vehicle, comprising: a fuselage having a first side board and a second side board spaced apart and connected by at least one transverse board; the first side board, the second side board, and the at least one transverse board being printed circuit boards; at least one of the first side board, the second side board, and the at least one transverse board having formed and mounted thereon conductive traces and at least one component, respectively, for controlling and monitoring the unmanned aerial vehicle; first and second wings mounted to the fuselage; and, a tail mounted to the fuselage.

The present invention provides a flexible circuit board with a heat dissipation layer on which bending processing can be carried out easily, while achieving its slimming down, and which can maintain the flatness of the heat dissipation layer. The flexible circuit board, at least, has a wiring layer 3a adapted to be electrically connected to a circuit element, an insulating layer 2, and a heat dissipation layer 3b, and which is characterized in that said wiring layer 3a is formed of a copper foil which has a tensile strength of 250 MPa or less and a thickness of 50 μm or less, and said heat dissipation layer is formed of a copper foil which has a tensile strength of 400 MPa or more and a thickness of 70 μm or more.

An ion trap mass analyzer includes an elongated tunnel that has a wall, a longitudinal axis and an inner space. The wall includes a substrate and conductor trace patterns. There is also a variable electric potential means for providing electric potentials which is connected to the conductor trace patterns. The conductor trace patterns and the variable electric potential means provide a variable electric field within the inner space of the tunnel for transferring, storing, and analyzing ions.

Provided is an article comprising a flexible circuit comprising a polymeric dielectric layer having first and second major surfaces, one or both of the first and second major surfaces having a conductive layer thereon, wherein at least one conductive layer comprises an electrical circuit configured to power one or more light emitting semiconductor devices located on the flexible circuit, wherein the flexible circuit is shaped to form a three dimensional structure.

An LED chip package structure using a substrate as a lampshade includes a substrate unit and a light-emitting unit. The substrate unit has a substrate body with a lampshade shape. The light-emitting unit has a plurality of light-emitting elements electrically disposed on an inner surface of the substrate body. Therefore, one part of light beams projected by the light emitting elements is reflected out of the lampshade by the inner surface of the substrate body.

Meeting todays requirement in power supply technology demands significant technological advancement in optimizing circuit topology, components and materials, thermal and packaging designs. These requirements are being pushed mainly by continuously increasing power density and efficiency requirements. Ultimately, these trends will come to a point whereby limitations from the above mentioned technological advancements is dependent on one of the above, which is the packaging design. To realize this dependence, we need to look at the growing power systems for modern equipment out there. Let us enumerate some of the available AC adapters in terms of power densities of a 45 W adapter. Firstly, square type architecture introduced by Apple is about 7 W / in3, considering the packaging has a profile limitation whereby its AC plug is removable thus occupying relatively bigger chunk of the volume. The next one is by Asus of similar profile to Apple incorporating the AC Plug eliminating the socket assembly in the packaging; which packs about 9 W / in3. Lastly, the typical rectangular profile by Eos which is about 7 W / in3. As for this particular embodiment it is about 40% smaller in profile, in contrast to the 45 W Apple packaging, with increase power density of about 12 W / in3. Packaging design method plays a great role in achieving the above requirements for a very high density converters.

A server system includes an array of server cells. Some or all of the server cells include a set of at least three side panels forming an enclosure and a compute component comprising a processor core. At least one side panel of each server cell is removably mechanically coupled and removably electrically coupled to a facing side panel of an adjacent server cell. The enclosure may form a triangular prism enclosure, a cuboid enclosure, a hexagonal prism enclosure, etc. The enclosure can be formed from a rigid flex printed circuit board (PCB) assembly, whereby the side panels are implemented as rigid PCB sections that are interconnected via flexible PCB sections, with the flexible PCB sections forming corners between the rigid PCB sections when the rigid-flex PCB assembly is folded into the enclosure shape. The compute component and other circuit components are disposed at the interior surfaces of the rigid PCB sections.

A package carrier includes: a carrier having a main mounting surface and at least two side mounting surfaces connecting the main mounting surface; a dielectric layer disposed on the carrier, having multiple first openings and extending from the main mounting surface up, along boundaries between the main mounting surface and the side mounting surfaces, onto the side mounting surfaces, in which the first openings expose a portion of the main mounting surface and portions of the side mounting surfaces; a metal layer disposed on the dielectric layer and having multiple second openings disposed correspondingly to the first openings and multiple third openings exposing the partial dielectric layer at the above-mentioned boundaries; a surface treatment layer disposed on the partial metal layer; and a solder resist layer disposed on a portion of the metal layer and a portion of the dielectric layer both exposed out of the surface treatment layer.

The invention is directed to an object (2) with a three-dimensional shape made of a folded sheet (4) so as to form at least one face (6), at least one corner (10) and / or at least one edge (8), the object comprising electrically conductive traces (14) printed on the sheet (4); and at least one functional area (12) printed on one of the at least one face (6), adjacent to one of the at least one edge (8), or adjacent to one of the at least one corner (10), the at least one functional area (12) being electrically connected to the conductive traces (14) and forming at least one control for a touch input, for a display output, and / or for sensing a change of shape of the object.

An LED bulb comprises a structural shell formed by folding a flat PCB into a three-dimensional polyhedron shape and a fitting for removably coupling the bulb to a light socket. The PCB comprises a plurality of LEDs, at least one LED mounted electronically on a plurality of faces of the polyhedron, and a driver circuit for driving each LED. The perimeter of the PCB is shaped to join adjacent faces. Each LED produces minimal excess heat, which is partially conducted by a metallic heat sink bridge to the PCB and dissipated to the air through the PCB and through a plurality of spaces in the shell.

The utility model provides a safety cover, belonging to the field of electronic circuit protection , used for covering a protected area of a protected circuit board and providing protection for the elements in the protected area. The safety cover comprises a flexible circuit board which can be folded up to form a holding space with an opening on a side of the holding space and the flexible circuit board covers the protected area of the protected circuit board, covering the elements of the protected area; wherein, the flexible circuit board can trigger a circuit to erase or damage the message on the elements of the protected area when the flexible circuit board is under physical attack. The utility model has the advantages that protecting the important elements from suffering attack by covering the important elements of the circuit board via the flexible circuit board with a holding space.

Provided is a faceplate for an In-The-Ear (ITE) hearing aid and a method of manufacturing a faceplate for an In-The-Ear (ITE) hearing aid in which the faceplate can be manufactured in a compact size, using a foldable flexible printed circuit board (PCB), while maintaining the quality, enabling mass-production, and reducing the manufacturing cost.

Memory systems and methods of forming memory modules. In one embodiment, a computer memory system includes a substantially tubular frame with an elongate card edge extending along the frame. A flexible circuit comprising a flexible substrate, a plurality of memory chips affixed to the flexible substrate, and a plurality of electrical terminals interconnected with the memory chips, is secured along a perimeter of the tubular frame with the electrical terminals arranged along the card edge.

A circuit board device (30) comprises a circuit board unit (31) and a support frame (32) which is in the shape of a polyhedron. The circuit board unit (31) comprises at least two hard boards (311) and at least one soft board (312) connected between the at least two hard boards (311). The at least two hard boards (311) are oppositely folded through the at least one soft board (312) and are respectively arranged at different sides of the support frame (32). In the circuit board device (30), the support frame (32) which is in the shape of the polyhedron and the circuit board unit (31) formed by the hard boards (311) connected by the soft board (312) are employed, by means of the flexible property of the soft board (312), different hard boards (311) are oppositely folded and are respectively arranged at different sides of the support frame (32), therefore, the circuit board unit (31) can be arranged in a three-dimensional space, and the space utilization ratio of the circuit design is increased. The invention also relates to an image acquisition module (100) provided with the circuit board device (30).

A heat-dissipating board structure and a circuit board module are provided. The heat-dissipating board structure includes a first board, a second board, a heat-transmitting layer and a buffering liquid. The first board has a first inner surface and the first inner surface has a plurality of first metal protrusions thereon. The second board is correspondingly engaged with the first board to form an accommodating chamber therebetween. The second board has a second inner surface and the second inner surface has a plurality of second metal protrusions thereon. The heat-transmitting layer is disposed in the accommodating chamber and arranged between the first metal protrusions and the second metal protrusions. The buffering liquid is filled in a residual space of the accommodating chamber. Therefore, the heat-dissipating board structure can meet the design requirements of a light-weight and thin electronic product and can effectively remove heat from a heat source.

A miniaturized voltage-transforming device includes a first circuit board and a second circuit board parallel to and separated from each other by a predetermined distance so that there is no physical connection therebetween, and a transformer having a plurality of primary-side pins and a plurality of secondary-side pins, wherein the transformer is located beside the first circuit board and the second circuit board, and has its primary-side pins and secondary-side pins directly or indirectly connected to the first circuit board and the second circuit board physically, so that the transformer is electrically connected to the first circuit board and the second circuit board via the primary-side pins and the secondary-side pins.

The present invention is applicable to the field of electronic circuit protection and provides a safety protection box used for surrounding the protected area of a protected circuit wafer and providing protection for the components in the area. The safety protection box consists of a circuit wafer. The circuit wafer has thin middle and thick periphery and thus a box shape is formed. Wiring layers are arranged on the circuit wafer. When suffering from a physical attack, the wiring layers trigger the interrelated circuits to erase or destroy the information on the components in the protected area. The present invention protects the components in the protected area by covering a circuit wafer which is thin in the middle and thick in the periphery, on the protected area of a protected circuit wafer.

Solutions for providing stackable electronics packaging are provided. In some embodiments, electronic components are accommodated in the cavity of a printed circuit board (PCB) or printed circuit assembly (PCA), or co-accommodated in adjoining cavities of adjacent, stacked PCAs or PCBs. The cavities allow for closer stacking of the PCAs or PCBs. In some embodiments, a PCA comprises an encapsulant conformally layered over a PCB with electronic components mounted on top and bottom. Power and / or signal channels are routed through the encapsulant to the top and / or bottom layers. The encapsulated PCAs may be stacked. In various embodiments, stackable PCAs are modular, facilitating customization.

An antenna device includes a housing having a plurality of printed circuit board (PCB) panels connected together with folded joints therebetween to define a polyhedral shape having a first open end. Each of the PCB panels includes a dielectric substrate and an electrically conductive layer thereon inside of the housing. Wireless communication circuitry is mounted on at least one of the plurality of PCB panels outside the housing, and an antenna feed is connected to the wireless communication circuitry adjacent a second end opposite the first open end of the housing.

The invention brings forward an electric connector and a plugging module thereof, and a manufacturing method of a plugging module. The plugging module is composed of a pedestal, an input unit, an output unit, and an output terminal. The pedestal contains a top plate, a base plate, and at least one connecting plate connecting the base plate and the top plate. A plurality of input terminals and a plurality of conversion terminals are fixed on the pedestal. The input unit includes at least one input circuit board and at least one channel; the at least one input circuit board is arranged at the pedestal vertically and is electrically connected to one end portion of each input terminal; at least one channel is arranged on the input circuit board and contains a transformer electrically connected to the input circuit board. The output unit is arranged at the pedestal horizontally; and the output circuit board is electrically connected to the input circuit board by the conversion terminal. The output terminal is fixed to and is electrically connected to the output circuit board. According to the invention, the plugging module having advantages of convenient assembling, low cost, and small size is suitable for batch and automatic production.

The invention belongs to the technical field of unmanned aerial vehicles, and discloses a control device of an unmanned aerial vehicle. The control device comprises a housing, an inertial measurement device fixed within the housing, a flight control main circuit board electrically connected with the inertial measurement device, and an interface soft board electrically connected to the flight control main circuit board and tightly attached to the inner wall of the housing. The two sides of the interface soft board pass through the housing to be electrically connected to an external device. The invention further discloses an unmanned aerial vehicle provided with the above control device. According to the invention, based on the above structural arrangement, all parts are compact in structure, and the integration degree of the whole control device is improved. The influence of the shock to the inertial measurement device is reduced and the measurement stability of the inertial measurement device is improved. The interface soft board is attached inside the housing, and all split type interface boards are integrated as one piece by the interface soft board. Therefore, the installation stability of the interface soft board inside the housing is improved. Meanwhile, the interface soft board can be freely folded, and the interface space is saved. The volume of the entire control device is reduced.