66results about "Box-like PCB arrangements" patented technology

The invention provides a single board, a single board assembling method and communication equipment, and belongs to the technical field of communication. The single board comprises a main chip module, basic configuration, an interface device and a first circuit board. The main chip module comprises a main chip and a second circuit board, and the main chip is located on the surface of the second circuit board; the number of the first circuit board is at least one, and the basic configuration and the interface device are located on the surface of the at least one first circuit board; the main chip is electrically connected with the basic configuration and the interface device. According to the invention, resource waste can be reduced, and the cost of the single board is reduced.

A sensor assembly for a vehicle including a sensor module having a main printed circuit board (PCB). A plurality of auxiliary printed circuit boards (PCBs) are coupled to the main PCB and electrically connected to the main PCB. Each of the plurality of auxiliary PCBs has at least one sensor that is configured to generate a signal. Each of the plurality of auxiliary PCBs are coupled to each other in a defined position relative to each other. A plurality of attachment elements couple the plurality of auxiliary PCBs and the main PCB to at least partially maintain the defined positions of the auxiliary PCBs relative to each other and to electrically connect the plurality of auxiliary PCBs to the main PCB. A retainer abuts the plurality of auxiliary PCBs.

A board, a board assembly method, and a communication device for communication technologies are disclosed. The board includes a main chip module, a basic configuration, an interface component, and a first circuit board. The main chip module includes a main chip and a second circuit board. The main chip is located on a surface of the second circuit board. There is at least one first circuit board. The basic configuration and the interface component are located on a surface of the at least one first circuit board. The main chip is separately electrically connected to the basic configuration and the interface component. According to the present disclosure, resource waste can be reduced, and costs of the board can be reduced.

A circuit board includes chip die mounted on a three dimensional rectangular structure, a three dimensional triangular prism structure, or a combination thereof. A ball grid array for the chip die mounted on any such three dimensional structure is interposed between the three dimensional structure and the circuit board itself.

A circuit board assembly may include a first circuit board including a first slot. The circuit board assembly may include a second circuit board. The first circuit board may be interlocked with the second circuit board via interlocking provided by the second circuit board into the first slot.

A sensor assembly for a vehicle including a sensor module having a main printed circuit board (PCB). A plurality of auxiliary printed circuit boards (PCBs) are coupled to the main PCB and electrically connected to the main PCB. Each of the plurality of auxiliary PCBs has at least one sensor that is configured to generate a signal. Each of the plurality of auxiliary PCBs are coupled to each other in a defined position relative to each other. A plurality of attachment elements couple the plurality of auxiliary PCBs and the main PCB to at least partially maintain the defined positions of the auxiliary PCBs relative to each other and to electrically connect the plurality of auxiliary PCBs to the main PCB. A retainer abuts the plurality of auxiliary PCBs.

A package for multiple MEMS-based speakers in a compact form factor is provided. One package includes: a first rigid section defining a first vent aperture; a second rigid section defining a second vent aperture; a first speaker die attached to the first rigid section and covering the first vent aperture; a second speaker die attached to the second rigid section and covering the second vent aperture; a first flexible section attached between and providing electrical continuity between the first rigid section and the second rigid section; and a spacer defining an acoustic port, where the first rigid section is attached to a first side of the spacer, and the second rigid section is attached to a second side of the spacer, where the first speaker die faces the second speaker die.

A system for controlling a robotic end-effector is disclosed. The system includes a robotic arm, a surgical tool including an end-effector with articulatable arm and a clamp jaw. A tool driver is coupled to the surgical tool and a motor is coupled to the tool driver and is configured to drive the surgical tool. A sensor is configured to sense external forces applied to the end-effector. A central control circuit is configured to control the tool driver. The central control circuit is configured to receive a sensed parameter from the sensor, receive a sensed motor current (I) from the motor, and control the tool driver based on the sensed parameter and the motor current (I).

The invention relates to an interconnection device (1) intended to interconnect at least two circuit boards (50), the device comprising a body (10) made of at least one polymer material and a plurality of electrically conductive tracks (20) extending from a first face of the body (10) to a second face of the body (10). According to the invention, the interconnection device (1) comprises a first connector (41) fixedly mounted on the first face of the body (10) and a second connector (42) fixedly mounted on the second face of the body (10), wherein the first connector (41) is in electrical contact with the electrically conductive tracks (20) and is intended to be connected to a first circuit board (51), and the second connector (42) is in electrical contact with the electrically conductive tracks (20) and is intended to be connected to a second circuit board (52). The invention also relates to a method for manufacturing such an interconnection device (1). The invention also relates to an associated aircraft.

An electronic control device includes a housing, a first plate disposed within the housing, a second plate disposed within the housing such that an inner surface of the second plate faces an inner surface of the first plate, a first control module disposed within the housing, and a second control module disposed within the housing. The first control module includes a first printed circuit board having an inner surface that is bonded to one side of the first plate and one side of the second plate, a first power supply substrate disposed on an outer surface of the second plate, and a first EMI filter disposed between the first plate and the second plate having an inner surface that faces the inner surface of the first printed circuit board. The second control module includes a second printed circuit board having an inner surface that is bonded to another side of the first plate and another side of the second plate, a second power supply substrate disposed on an outer surface of the first plate, and a second EMI filter disposed between the first plate and the second plate having an inner surface that faces the inner surface of the second printed circuit board.

This disclosure includes multiple assemblies, sub-assemblies, etc., as well as one or more methods of fabricating same. For example, a first assembly includes a first circuit board. The first circuit board further includes first connector elements disposed on a first edge of the first circuit board and second connector elements disposed on a second edge of the first circuit board. The first edge may be disposed substantially opposite the second edge on the first circuit board. The apparatus may further include first circuitry affixed to the first circuit board. The first edge of the first circuit board aligns with a first axial end of the first circuitry and the second edge of the first circuit board aligns with a second axial end of the first circuitry. The first assembly is used to fabricate a second assembly.

The present invention relates to a thermal flow sensor (1) for a flow meter. The thermal flow sensor (1) comprises a main channel portion (3b), a sensor tube (4), and a thermally conductive frame element (13). The main channel portion (3b) comprises a main channel (3) for a medium whose flow rate is to be determined. The sensor tube (4) comprises a first tube portion (5) with an inlet (6) fluidly connected to the main channel (3), a second tube portion (8) with an outlet (9) fluidly connected to the main channel (3) on the opposite side of the inlet (6), a sensing portion (11) connected to the first tube portion (5) and the second tube portion (8) so that the fluid flows from the inlet (6) to the outlet (9) through the sensor tube (4), and at least two sensing heating elements (12) for measuring a temperature or power difference within the sensor tube (4) to determine the flow rate. A thermally conductive frame element (13) contacts the first tube portion (5), the second tube portion (8) and the main channel portion (3b) to equalize the temperature gradient across the first tube portion (5), the second tube portion (8) and the main channel portion (3b). The thermally conductive frame element 13 is a printed circuit board (PCB) 14.

A fiber of electrically insulating fiber body material, has a plurality of electrical conductors within the fiber body along the fiber body length. An electrical component within the fiber body includes at least one electrical contact pad disposed on an electrical component first surface. An interposer at the electrical component site within the fiber body has a platform of mechanically flexible, electrically insulating material disposed over the electrical component first surface and extending over at least its second surface. An interposer inner electrical contact pad is connected to an electrical component contact pad. An electrically conducting path extends from an interposer inner electrical contact pad to a site on the interposer inner surface extending over the second surface of the electrical component. An interposer outer electrical contact pad is connected to an electrical conductor within the fiber body and to an interposer inner surface electrically conducting path.

An electronic component module comprises: a first printed circuit board; an inductor disposed on the first printed circuit board and comprising a core, and a first coil disposed in the core; a metal plate disposed on the inductor, and a busbar disposed on the lower portion of the inductor and coupled to the first printed circuit board, wherein the first coil comprises a first terminal protruding upward from the core, and a second terminal protruding downward from the core, and the first terminal is coupled to the metal plate, and the second terminal is coupled to the busbar.

A three dimensional circuit module can include: a plurality of PCBs located on different faces, where surfaces of the PCBs include circuit modules; a plurality of circuit assemblies connected through components; where the plurality of circuit assemblies comprises at least one first circuit assembly having a first main board and at least one first side board that are located on different faces, where the first main board and at least one first side board of the first circuit assembly are obtained by integrated curing molding process; and where the first main board of the first circuit assembly is located on one PCB board, and the first side board is located on an adjacent PCB board, in order to realize connection of adjacent PCBs.

The invention relates to a circuit board (100) having a carrier (1) which can be converted from a planar shape into a three-dimensional shape and which can be populated with components, to a method for producing an electronic assembly (200) comprising the circuit board (100), and to an electronic device (300) comprising the electronic assembly (200). The carrier (1) comprises three or more regions (3a, 3b, 3c, 3d). Each region (3a, 3b, 3c, 3d) is connected to at least one adjacent region (3a, 3b, 3c, 3d), in each case by means of two or more flexible connecting bridges (7) which are spaced apart from one another along a fold line (K) running between the two adjacent regions (3a, 3b, 3c, 3d). A first and a second outer region (3a, 3d) comprise mutually complementary components (19, 21) of a snap connection (23) which, by the conversion of the carrier (1) from the planar shape into the three-dimensional shape, can be connected to each other in such a way that the carrier (1) is dimensionally stable in the three-dimensional shape.

The invention relates to the production of an electronic accessory (13) for a drive having a regulator component and / or a converter component by the following steps: providing a plurality of circuit boards (26, 27), each having an electrical conductor track arranged on the circuit board, the conductor track having an electrical connection, assembling the designed circuit boards (26, 27) with electrical components and / or electronic components provided for the circuit boards, carrying out an electrical check of the assembly, wiring, etc., arranging a section (31) on at least two circuit boards so that the section forms an almost circumferentially closed cover (20) by a bending process in the region of the electrical connection between the circuit boards, arranging a cover (36) on the open side of the cover (20) in order to thereby obtain a closed housing arrangement (38).

An electronic assembly includes a first printed circuit board (PCB), a second PCB, and a ground shield. The first PCB includes a first plurality of electronic components and a first conductive layer. The second PCB includes a second plurality of electronic components and a second conductive layer. The ground shield is electrically connected between the first conductive layer of the first PCB and the second conductive layer of the second PCB to electrically connect the first PCB and the second PCB. The first PCB and the second PCB are arranged in a stacked manner so that the first conductive layer and the second conductive layer mutually shield at least one of the first plurality of electronic components and at least one of the second plurality of electronic components from electromagnetic interference.

An electronic component module comprises: a first printed circuit board; a transformer which is disposed on the first printed circuit board and includes a core and a first coil disposed within the core; a second printed circuit board which is disposed on the transformer; a busbar which is disposed outside the core and to which the opposite ends of the first coil are coupled; and a bracket which is disposed outside the busbar and coupled to the core.

Tamper-resistant assembly (600; 800; 1500; 2100) which exhibits: a tamper-responsive sensor (500; 605; 610, 611, 612; 811, 821; 821, 822; 1200; 1510, 1520; 1510', 1520'), wherein the tamper-responsive sensor has: at least one shaped, flexible layer (510; 1700) with a first side (511; 1701) and a second side (512; 1702) opposite the first side, wherein the at least one shaped, flexible layer has surface curvatures (513) extending from the first side and surface curvatures (513) extending from the second side, wherein the at least one shaped, flexible layer is folded together as at least one flattened, folded-over layer; and Circuit lines (501; 1705) forming at least one resistance network, wherein the circuit lines are arranged on the first side and / or the second side of the at least one shaped, flexible layer, wherein the circuit lines are at least partially wrapped around the surface curvatures extending from the at least one of the first sides or the second side of the at least one shaped, flexible layer.

An electronic component module comprises: a first printed circuit board; a transformer which is disposed on the first printed circuit board and includes a core and a first coil disposed within the core; a second printed circuit board which is disposed on the transformer; a busbar which is disposed outside the core an to which the opposite ends of the first coil are coupled; and a bracket which is disposed outside the busbar and coupled to the core.

The present invention relates to an ion transmission device, which is designed to transmit ions by means of an electric field, wherein the ion transmission device has an ion transmission channel in which an ion transmission chamber is formed, wherein the ion transmission device has a plurality of field generating electrodes for generating an electric field, and the field generating electrodes are arranged in sequence along the longitudinal extension of the ion transmission channel so as to move ions through the ion transmission chamber along a transmission direction. The present invention also relates to an ion mobility spectrometer and a mass spectrometer.

The invention relates to a package of multiple loudspeakers. A package with a compact form factor for a plurality of MEMS-based speakers is provided. A package includes a first rigid segment defining a first vent hole; a second rigid segment defining a second vent hole; a first speaker die attached to the first rigid segment and covering the first vent hole; a second speaker die attached to the second rigid segment and covering the second vent hole; a first flexible segment attached between the first rigid segment and the second rigid segment and providing electrical continuity between the first rigid segment and the second rigid segment; and a spacer defining an acoustic port with a first rigid segment attached to a first side of the spacer and a second rigid segment attached to a second side of the spacer with the first loudspeaker die facing the second loudspeaker die.

The electronic module has a three-dimensional frame, a printed circuit board and a plurality of electronic devices. The printed circuit board is fixed to the three-dimensional frame and has a plurality of support portions which extend transversely to each other in space. The electronic devices are fixed to the printed circuit board and are operatively coupled to each other. The electronic devices are arranged on at least one support portion of the printed circuit board.

An apparatus includes a case, a first printed circuit board (PCB) and a second PCB within the case. The case includes a top portion and a bottom portion opposite to each other. The first PCB has a first surface and a second surface opposite to each other, and is attached to the top portion of the case via the second surface of the first PCB. At least one heat-generating device is mounted on the first surface of the first PCB. The second PCB has a first surface and a second surface opposite to each other, and is attached to the bottom portion of the case via the second surface of the second PCB. At least one heat-generating device is mounted on the first surface of the second PCB. The apparatus may include more PCBs. An inner shell may be provided forming an air duct within the case.

A circuit board includes chip die mounted on a three dimensional rectangular structure, a three dimensional triangular prism structure, or a combination thereof. A ball grid array for the chip die mounted on any such three dimensional structure is interposed between the three dimensional structure and the circuit board itself.

A novel 3D package configuration is provided by stacking a plurality of semiconductor package units or a folded flexible circuit board structure on a package substrate and electrically connected therewith based on the foldable characteristics of the flexible circuit board, and the high temperature resistance of the flexible circuit board which is suitable for insulating layer process, metal layer process, photolithography process, etching and development process, to make conventional semiconductor dies of various functions be bonded on one die and / or two side of a flexible circuit board and electrically connected therewith in advance.

The electronic component module includes a first printed circuit board; a transformer disposed on the first printed circuit board and including a core and a first coil disposed within the core; a second printed circuit board disposed on the transformer; a bus bar disposed outside the core and to which both ends of the first coil are coupled; and a bracket disposed outside the bus bar and coupled to the core.

A three dimensional circuit module can include: a plurality of PCBs located on different faces, where surfaces of the PCBs include circuit modules; a plurality of circuit assemblies connected through components; where the plurality of circuit assemblies comprises at least one first circuit assembly having a first main board and at least one first side board that are located on different faces, where the first main board and at least one first side board of the first circuit assembly are obtained by integrated curing molding process; and where the first main board of the first circuit assembly is located on one PCB board, and the first side board is located on an adjacent PCB board, in order to realize connection of adjacent PCBs.