32results about "Box-like PCB arrangements" patented technology

A sensor assembly for a vehicle including a sensor module having a main printed circuit board (PCB). A plurality of auxiliary printed circuit boards (PCBs) are coupled to the main PCB and electrically connected to the main PCB. Each of the plurality of auxiliary PCBs has at least one sensor that is configured to generate a signal. Each of the plurality of auxiliary PCBs are coupled to each other in a defined position relative to each other. A plurality of attachment elements couple the plurality of auxiliary PCBs and the main PCB to at least partially maintain the defined positions of the auxiliary PCBs relative to each other and to electrically connect the plurality of auxiliary PCBs to the main PCB. A retainer abuts the plurality of auxiliary PCBs.

A board, a board assembly method, and a communication device for communication technologies are disclosed. The board includes a main chip module, a basic configuration, an interface component, and a first circuit board. The main chip module includes a main chip and a second circuit board. The main chip is located on a surface of the second circuit board. There is at least one first circuit board. The basic configuration and the interface component are located on a surface of the at least one first circuit board. The main chip is separately electrically connected to the basic configuration and the interface component. According to the present disclosure, resource waste can be reduced, and costs of the board can be reduced.

A sensor assembly for a vehicle including a sensor module having a main printed circuit board (PCB). A plurality of auxiliary printed circuit boards (PCBs) are coupled to the main PCB and electrically connected to the main PCB. Each of the plurality of auxiliary PCBs has at least one sensor that is configured to generate a signal. Each of the plurality of auxiliary PCBs are coupled to each other in a defined position relative to each other. A plurality of attachment elements couple the plurality of auxiliary PCBs and the main PCB to at least partially maintain the defined positions of the auxiliary PCBs relative to each other and to electrically connect the plurality of auxiliary PCBs to the main PCB. A retainer abuts the plurality of auxiliary PCBs.

A package for multiple MEMS-based speakers in a compact form factor is provided. One package includes: a first rigid section defining a first vent aperture; a second rigid section defining a second vent aperture; a first speaker die attached to the first rigid section and covering the first vent aperture; a second speaker die attached to the second rigid section and covering the second vent aperture; a first flexible section attached between and providing electrical continuity between the first rigid section and the second rigid section; and a spacer defining an acoustic port, where the first rigid section is attached to a first side of the spacer, and the second rigid section is attached to a second side of the spacer, where the first speaker die faces the second speaker die.

The invention relates to an interconnection device (1) intended to interconnect at least two circuit boards (50), the device comprising a body (10) made of at least one polymer material and a plurality of electrically conductive tracks (20) extending from a first face of the body (10) to a second face of the body (10). According to the invention, the interconnection device (1) comprises a first connector (41) fixedly mounted on the first face of the body (10) and a second connector (42) fixedly mounted on the second face of the body (10), wherein the first connector (41) is in electrical contact with the electrically conductive tracks (20) and is intended to be connected to a first circuit board (51), and the second connector (42) is in electrical contact with the electrically conductive tracks (20) and is intended to be connected to a second circuit board (52). The invention also relates to a method for manufacturing such an interconnection device (1). The invention also relates to an associated aircraft.

An electronic control device includes a housing, a first plate disposed within the housing, a second plate disposed within the housing such that an inner surface of the second plate faces an inner surface of the first plate, a first control module disposed within the housing, and a second control module disposed within the housing. The first control module includes a first printed circuit board having an inner surface that is bonded to one side of the first plate and one side of the second plate, a first power supply substrate disposed on an outer surface of the second plate, and a first EMI filter disposed between the first plate and the second plate having an inner surface that faces the inner surface of the first printed circuit board. The second control module includes a second printed circuit board having an inner surface that is bonded to another side of the first plate and another side of the second plate, a second power supply substrate disposed on an outer surface of the first plate, and a second EMI filter disposed between the first plate and the second plate having an inner surface that faces the inner surface of the second printed circuit board.

This disclosure includes multiple assemblies, sub-assemblies, etc., as well as one or more methods of fabricating same. For example, a first assembly includes a first circuit board. The first circuit board further includes first connector elements disposed on a first edge of the first circuit board and second connector elements disposed on a second edge of the first circuit board. The first edge may be disposed substantially opposite the second edge on the first circuit board. The apparatus may further include first circuitry affixed to the first circuit board. The first edge of the first circuit board aligns with a first axial end of the first circuitry and the second edge of the first circuit board aligns with a second axial end of the first circuitry. The first assembly is used to fabricate a second assembly.

The present invention relates to a thermal flow sensor (1) for a flow meter. The thermal flow sensor (1) comprises a main channel portion (3b), a sensor tube (4), and a thermally conductive frame element (13). The main channel portion (3b) comprises a main channel (3) for a medium whose flow rate is to be determined. The sensor tube (4) comprises a first tube portion (5) with an inlet (6) fluidly connected to the main channel (3), a second tube portion (8) with an outlet (9) fluidly connected to the main channel (3) on the opposite side of the inlet (6), a sensing portion (11) connected to the first tube portion (5) and the second tube portion (8) so that the fluid flows from the inlet (6) to the outlet (9) through the sensor tube (4), and at least two sensing heating elements (12) for measuring a temperature or power difference within the sensor tube (4) to determine the flow rate. A thermally conductive frame element (13) contacts the first tube portion (5), the second tube portion (8) and the main channel portion (3b) to equalize the temperature gradient across the first tube portion (5), the second tube portion (8) and the main channel portion (3b). The thermally conductive frame element 13 is a printed circuit board (PCB) 14.

A fiber of electrically insulating fiber body material, has a plurality of electrical conductors within the fiber body along the fiber body length. An electrical component within the fiber body includes at least one electrical contact pad disposed on an electrical component first surface. An interposer at the electrical component site within the fiber body has a platform of mechanically flexible, electrically insulating material disposed over the electrical component first surface and extending over at least its second surface. An interposer inner electrical contact pad is connected to an electrical component contact pad. An electrically conducting path extends from an interposer inner electrical contact pad to a site on the interposer inner surface extending over the second surface of the electrical component. An interposer outer electrical contact pad is connected to an electrical conductor within the fiber body and to an interposer inner surface electrically conducting path.

An electronic component module comprises: a first printed circuit board; an inductor disposed on the first printed circuit board and comprising a core, and a first coil disposed in the core; a metal plate disposed on the inductor, and a busbar disposed on the lower portion of the inductor and coupled to the first printed circuit board, wherein the first coil comprises a first terminal protruding upward from the core, and a second terminal protruding downward from the core, and the first terminal is coupled to the metal plate, and the second terminal is coupled to the busbar.

A three dimensional circuit module can include: a plurality of PCBs located on different faces, where surfaces of the PCBs include circuit modules; a plurality of circuit assemblies connected through components; where the plurality of circuit assemblies comprises at least one first circuit assembly having a first main board and at least one first side board that are located on different faces, where the first main board and at least one first side board of the first circuit assembly are obtained by integrated curing molding process; and where the first main board of the first circuit assembly is located on one PCB board, and the first side board is located on an adjacent PCB board, in order to realize connection of adjacent PCBs.

The invention relates to a circuit board (100) having a carrier (1) which can be converted from a planar shape into a three-dimensional shape and which can be populated with components, to a method for producing an electronic assembly (200) comprising the circuit board (100), and to an electronic device (300) comprising the electronic assembly (200). The carrier (1) comprises three or more regions (3a, 3b, 3c, 3d). Each region (3a, 3b, 3c, 3d) is connected to at least one adjacent region (3a, 3b, 3c, 3d), in each case by means of two or more flexible connecting bridges (7) which are spaced apart from one another along a fold line (K) running between the two adjacent regions (3a, 3b, 3c, 3d). A first and a second outer region (3a, 3d) comprise mutually complementary components (19, 21) of a snap connection (23) which, by the conversion of the carrier (1) from the planar shape into the three-dimensional shape, can be connected to each other in such a way that the carrier (1) is dimensionally stable in the three-dimensional shape.

The invention relates to the production of an electronic accessory (13) for a drive having a regulator component and / or a converter component by the following steps: providing a plurality of circuit boards (26, 27), each having an electrical conductor track arranged on the circuit board, the conductor track having an electrical connection, assembling the designed circuit boards (26, 27) with electrical components and / or electronic components provided for the circuit boards, carrying out an electrical check of the assembly, wiring, etc., arranging a section (31) on at least two circuit boards so that the section forms an almost circumferentially closed cover (20) by a bending process in the region of the electrical connection between the circuit boards, arranging a cover (36) on the open side of the cover (20) in order to thereby obtain a closed housing arrangement (38).

An electronic component module comprises: a first printed circuit board; a transformer which is disposed on the first printed circuit board and includes a core and a first coil disposed within the core; a second printed circuit board which is disposed on the transformer; a busbar which is disposed outside the core and to which the opposite ends of the first coil are coupled; and a bracket which is disposed outside the busbar and coupled to the core.

The invention relates to a package of multiple loudspeakers. A package with a compact form factor for a plurality of MEMS-based speakers is provided. A package includes a first rigid segment defining a first vent hole; a second rigid segment defining a second vent hole; a first speaker die attached to the first rigid segment and covering the first vent hole; a second speaker die attached to the second rigid segment and covering the second vent hole; a first flexible segment attached between the first rigid segment and the second rigid segment and providing electrical continuity between the first rigid segment and the second rigid segment; and a spacer defining an acoustic port with a first rigid segment attached to a first side of the spacer and a second rigid segment attached to a second side of the spacer with the first loudspeaker die facing the second loudspeaker die.

An apparatus includes a case, a first printed circuit board (PCB) and a second PCB within the case. The case includes a top portion and a bottom portion opposite to each other. The first PCB has a first surface and a second surface opposite to each other, and is attached to the top portion of the case via the second surface of the first PCB. At least one heat-generating device is mounted on the first surface of the first PCB. The second PCB has a first surface and a second surface opposite to each other, and is attached to the bottom portion of the case via the second surface of the second PCB. At least one heat-generating device is mounted on the first surface of the second PCB. The apparatus may include more PCBs. An inner shell may be provided forming an air duct within the case.

The electronic component module includes a first printed circuit board; a transformer disposed on the first printed circuit board and including a core and a first coil disposed within the core; a second printed circuit board disposed on the transformer; a bus bar disposed outside the core and to which both ends of the first coil are coupled; and a bracket disposed outside the bus bar and coupled to the core.

The present disclosure provides a board, a board assembly method, and a communication device, and belongs to the field of communication technologies. The board includes a main chip module, a basic configuration, an interface component, and a first circuit board. The main chip module includes a main chip and a second circuit board. The main chip is located on a surface of the second circuit board. There is at least one first circuit board. The basic configuration and the interface component are located on a surface of the at least one first circuit board. The main chip is separately electrically connected to the basic configuration and the interface component. According to the present disclosure, resource waste can be reduced, and costs of the board can be reduced.

In a method of producing an add-on part of a drive, one circuit board of multiple planar circuit boards, which have electrical conductor tracks with electrical connections, is provided with a centrally arranged opening for passage of a shaft. The circuit boards are populated with electrical and / or electronic components, and the populated electrical and / or electronic components and wiring are electrically tested. Segments made of a material with high thermal conductivity are arranged on at least two of the multiple circuit boards such that a bending process in a region of the electrical connections between the at least two circuit boards causes the segments to form an approximately peripherally closed cover. Lids are arranged on open sides of the cover to realize a closed housing arrangement.

The invention provides a circuit board assembly and electronic equipment. The circuit board assembly comprises a first circuit board, a first adapter plate, a second adapter plate and a second circuit board, the second adapter plate is arranged between the top of the first adapter plate and the bottom of the second circuit board, and the first circuit board sequentially passes through the first adapter plate and the second adapter plate. The first circuit board and the second circuit board are stacked in the thickness direction of the circuit board assembly. According to the circuit board assembly, the second adapter plate is arranged between the top of the first adapter plate and the bottom of the second circuit board, assembling is easy, the structure is simple, the first adapter plate and the second adapter plate are partially overlapped in the thickness direction of the circuit board assembly, the space utilization rate of the circuit board assembly in the thickness direction and the horizontal plane direction is increased, and the circuit board assembly is more convenient to use. Therefore, the reasonability of the spatial layout of the circuit board assembly is improved, the overall size of the circuit board assembly is reduced, and the user experience is improved.

The invention relates to a module (1), in particular for arrangement in a control cabinet of a low-voltage distribution system, wherein the module (1) comprises a module housing (2).Within the module housing (2) a sectionally flexible printed circuit board assembly (20) is arranged with at least three rigid printed circuit board sections (21, 22, 23, 24, 25, 26) and with at least two flexible printed circuit board sections (31, 32, 33, 34, 35), wherein at least one flexible printed circuit board section (31, 32, 33, 34, 35) is arranged between two adjacent rigid printed circuit board sections (21, 22, 23, 24, 25, 26) and is electrically connected to these two adjacent rigid printed circuit board sections (21, 22, 23, 24, 25, 26) in a signal-conducting manner, and wherein the sectionally flexible printed circuit board assembly (20) in its installed position within the module housing (2) forms a three-dimensional structure (40) in which at least a first pair of two adjacent rigid printed circuit board sections (21, 22) encloses a first angle (α) to each other and at least one second pair of two adjacent rigid circuit board sections (22,23) encloses a second angle (β) to each other.

A package for multiple MEMS-based speakers in a compact form factor is provided. One package includes: a first rigid section defining a first vent aperture; a second rigid section defining a second vent aperture; a first speaker die attached to the first rigid section and covering the first vent aperture; a second speaker die attached to the second rigid section and covering the second vent aperture; a first flexible section attached between and providing electrical continuity between the first rigid section and the second rigid section; and a spacer defining an acoustic port, where the first rigid section is attached to a first side of the spacer, and the second rigid section is attached to a second side of the spacer, where the first speaker die faces the second speaker die.

A rectifier module is disposed on a mainboard. The rectifier module includes a first circuit board, a second circuit board, a transformer, a third circuit board and a plurality of output filter capacitors. The first circuit board and the second circuit board are inserted into the mainboard. The first circuit board and the second circuit board are opposite to each other. The transformer is arranged between and connected to the first circuit board and the second circuit board. A first side of the third circuit board is connected to the first circuit board. A second side of the third circuit board is connected to the second circuit board. The plurality of output filter capacitors are disposed on the third circuit board. The rectifier module is electrically connected to the mainboard via a positive connection part and a negative connection part.

The invention relates to a thermal-type flow sensor (1) for a flow meter, comprising a main channel part (3b) with a main channel (3) for a medium whose flow is to be determined, a sensor tube (4), having a first tube portion (5), a second, opposite tube portion (8), a sensing portion (11) connecting the first and second tube portions, at least two sensing or heating elements (12) for measuring a temperature differential or a power differential in the sensor tube, a thermally conductive frame element (13) in contact with at least the first tube portion, the second tube portion as well as the main channel part, configured to equalize temperature gradients, wherein thermally conductive frame element (13) is a printed circuit board (PCB) (14).

The electronic component module includes a first printed circuit board; an inductor disposed on the first printed circuit board and including a core and a first coil disposed within the core; a metal plate disposed on the inductor; and a bus bar disposed below the inductor and coupled to the first printed circuit board; the first coil includes a first terminal protruding above the core and a second terminal protruding below the core, the first terminal being coupled to the metal plate and the second terminal being coupled to the bus bar.

The present application discloses an electronic component and an electronic device for achieving a three-dimensional stack structure, reducing the area, and improving heat dissipation. In the present application, the electronic component includes an upper cover plate, a lower cover plate, and a housing frame. The upper cover plate holds a first circuit. The lower cover plate holds a second circuit. The housing frame is individually connected to the upper and lower cover plates. An interconnection circuit is disposed on the housing frame and configured to interconnect the first circuit and the second circuit. The first circuit and the second circuit vertically overlap without interfering with each other. The height of the housing frame is not lower than a predetermined height, which is higher than the sum of the heights of the first circuit and the second circuit, thereby achieving a three-dimensional stack structure between the upper and lower cover plates and thereby reducing the area of ​​the electronic device.

A circuit board assembly (100) and an electronic device are provided. The circuit board assembly (100) includes a first circuit board (1), a first transfer board (2), a second transfer board (3), and a second circuit board (4). The second transfer board (3) is arranged between a top of the first transfer board (2) and a bottom of the second circuit board (4). The first circuit board (1) is stacked with the second circuit board (4) in a thickness direction of the circuit board assembly (100) sequentially through the first transfer board (2) and the second transfer board (3).

The electronic control device includes: a housing; a first plate disposed in the housing; a second plate disposed in the housing and having an inner surface facing the inner surface of the first plate; a first control module disposed in the housing; and a second control module disposed in the housing, wherein the first control module includes: a first printed circuit board having an inner surface coupled to one side of the first plate and one side of the second plate; a first power supply substrate disposed on an outer surface of the second plate; and a first EMI filter disposed between the first plate and the second plate, an inner surface of which is opposite to an inner surface of the first printed circuit board, and wherein the second control module includes: a second printed circuit board having an inner surface coupled to the other side surface of the first plate and the other side surface of the second plate; a second power supply substrate disposed on an outer surface of the first plate; and a second EMI filter disposed between the first plate and the second plate, an inner surface thereof faces an inner surface of the second printed circuit board.

The invention relates to a thermal-type flow sensor (1) for a flow meter, comprising a main channel part (3b) with a main channel (3) for a medium whose flow is to be determined, a sensor tube (4), having a first tube portion (5), a second, opposite tube portion (8), a sensing portion (11) connecting the first and second tube portions, at least two sensing or heating elements (12) for measuring a temperature differential or a power differential in the sensor tube, a thermally conductive frame element (13) in contact with at least the first tube portion, the second tube portion as well as the main channel part, configured to equalize temperature gradients, wherein thermally conductive frame element (13) is a printed circuit board (PCB) (14).

The invention relates to a circuit board (100) having a carrier (1) which can be converted from a flat shape into a three-dimensional shape and can be equipped with components, to a method for producing an electronics assembly (200) comprising the circuit board (100), and to an electronic device (300) comprising the electronics assembly (200). The carrier (1) comprises three or more regions (3a, 3b, 3c, 3d). Before the carrier (1) is first converted into the three-dimensional shape, each region (3a, 3b, 3c, 3d) is connected to at least one adjacent region (3a, 3b, 3c, 3d) via two or more bendable and / or breakable connection pieces (5) which are spaced apart from one another along a bending line (K) running between the two adjacent regions (3a, 3b, 3c, 3d). The regions (3a, 3b, 3c, 3d) which are connected to one another via connection pieces (5) before the first-time conversion are connected in each case via two or more flexible connecting bridges (7) which are spaced apart from one another along the bending line (K) running between the two regions (3a, 3b, 3c, 3d).