16results about "Box-like PCB arrangements" patented technology

A board, a board assembly method, and a communication device for communication technologies are disclosed. The board includes a main chip module, a basic configuration, an interface component, and a first circuit board. The main chip module includes a main chip and a second circuit board. The main chip is located on a surface of the second circuit board. There is at least one first circuit board. The basic configuration and the interface component are located on a surface of the at least one first circuit board. The main chip is separately electrically connected to the basic configuration and the interface component. According to the present disclosure, resource waste can be reduced, and costs of the board can be reduced.

A sensor assembly for a vehicle including a sensor module having a main printed circuit board (PCB). A plurality of auxiliary printed circuit boards (PCBs) are coupled to the main PCB and electrically connected to the main PCB. Each of the plurality of auxiliary PCBs has at least one sensor that is configured to generate a signal. Each of the plurality of auxiliary PCBs are coupled to each other in a defined position relative to each other. A plurality of attachment elements couple the plurality of auxiliary PCBs and the main PCB to at least partially maintain the defined positions of the auxiliary PCBs relative to each other and to electrically connect the plurality of auxiliary PCBs to the main PCB. A retainer abuts the plurality of auxiliary PCBs.

An electronic control device includes a housing, a first plate disposed within the housing, a second plate disposed within the housing such that an inner surface of the second plate faces an inner surface of the first plate, a first control module disposed within the housing, and a second control module disposed within the housing. The first control module includes a first printed circuit board having an inner surface that is bonded to one side of the first plate and one side of the second plate, a first power supply substrate disposed on an outer surface of the second plate, and a first EMI filter disposed between the first plate and the second plate having an inner surface that faces the inner surface of the first printed circuit board. The second control module includes a second printed circuit board having an inner surface that is bonded to another side of the first plate and another side of the second plate, a second power supply substrate disposed on an outer surface of the first plate, and a second EMI filter disposed between the first plate and the second plate having an inner surface that faces the inner surface of the second printed circuit board.

The present invention relates to a thermal flow sensor (1) for a flow meter. The thermal flow sensor (1) comprises a main channel portion (3b), a sensor tube (4), and a thermally conductive frame element (13). The main channel portion (3b) comprises a main channel (3) for a medium whose flow rate is to be determined. The sensor tube (4) comprises a first tube portion (5) with an inlet (6) fluidly connected to the main channel (3), a second tube portion (8) with an outlet (9) fluidly connected to the main channel (3) on the opposite side of the inlet (6), a sensing portion (11) connected to the first tube portion (5) and the second tube portion (8) so that the fluid flows from the inlet (6) to the outlet (9) through the sensor tube (4), and at least two sensing heating elements (12) for measuring a temperature or power difference within the sensor tube (4) to determine the flow rate. A thermally conductive frame element (13) contacts the first tube portion (5), the second tube portion (8) and the main channel portion (3b) to equalize the temperature gradient across the first tube portion (5), the second tube portion (8) and the main channel portion (3b). The thermally conductive frame element 13 is a printed circuit board (PCB) 14.

A fiber of electrically insulating fiber body material, has a plurality of electrical conductors within the fiber body along the fiber body length. An electrical component within the fiber body includes at least one electrical contact pad disposed on an electrical component first surface. An interposer at the electrical component site within the fiber body has a platform of mechanically flexible, electrically insulating material disposed over the electrical component first surface and extending over at least its second surface. An interposer inner electrical contact pad is connected to an electrical component contact pad. An electrically conducting path extends from an interposer inner electrical contact pad to a site on the interposer inner surface extending over the second surface of the electrical component. An interposer outer electrical contact pad is connected to an electrical conductor within the fiber body and to an interposer inner surface electrically conducting path.

The invention relates to a circuit board (100) having a carrier (1) which can be converted from a planar shape into a three-dimensional shape and which can be populated with components, to a method for producing an electronic assembly (200) comprising the circuit board (100), and to an electronic device (300) comprising the electronic assembly (200). The carrier (1) comprises three or more regions (3a, 3b, 3c, 3d). Each region (3a, 3b, 3c, 3d) is connected to at least one adjacent region (3a, 3b, 3c, 3d), in each case by means of two or more flexible connecting bridges (7) which are spaced apart from one another along a fold line (K) running between the two adjacent regions (3a, 3b, 3c, 3d). A first and a second outer region (3a, 3d) comprise mutually complementary components (19, 21) of a snap connection (23) which, by the conversion of the carrier (1) from the planar shape into the three-dimensional shape, can be connected to each other in such a way that the carrier (1) is dimensionally stable in the three-dimensional shape.

An electronic component module comprises: a first printed circuit board; a transformer which is disposed on the first printed circuit board and includes a core and a first coil disposed within the core; a second printed circuit board which is disposed on the transformer; a busbar which is disposed outside the core and to which the opposite ends of the first coil are coupled; and a bracket which is disposed outside the busbar and coupled to the core.

The electronic component module includes a first printed circuit board; a transformer disposed on the first printed circuit board and including a core and a first coil disposed within the core; a second printed circuit board disposed on the transformer; a bus bar disposed outside the core and to which both ends of the first coil are coupled; and a bracket disposed outside the bus bar and coupled to the core.

The present disclosure provides a board, a board assembly method, and a communication device, and belongs to the field of communication technologies. The board includes a main chip module, a basic configuration, an interface component, and a first circuit board. The main chip module includes a main chip and a second circuit board. The main chip is located on a surface of the second circuit board. There is at least one first circuit board. The basic configuration and the interface component are located on a surface of the at least one first circuit board. The main chip is separately electrically connected to the basic configuration and the interface component. According to the present disclosure, resource waste can be reduced, and costs of the board can be reduced.

The invention provides a circuit board assembly and electronic equipment. The circuit board assembly comprises a first circuit board, a first adapter plate, a second adapter plate and a second circuit board, the second adapter plate is arranged between the top of the first adapter plate and the bottom of the second circuit board, and the first circuit board sequentially passes through the first adapter plate and the second adapter plate. The first circuit board and the second circuit board are stacked in the thickness direction of the circuit board assembly. According to the circuit board assembly, the second adapter plate is arranged between the top of the first adapter plate and the bottom of the second circuit board, assembling is easy, the structure is simple, the first adapter plate and the second adapter plate are partially overlapped in the thickness direction of the circuit board assembly, the space utilization rate of the circuit board assembly in the thickness direction and the horizontal plane direction is increased, and the circuit board assembly is more convenient to use. Therefore, the reasonability of the spatial layout of the circuit board assembly is improved, the overall size of the circuit board assembly is reduced, and the user experience is improved.

The invention relates to a module (1), in particular for arrangement in a control cabinet of a low-voltage distribution system, wherein the module (1) comprises a module housing (2).Within the module housing (2) a sectionally flexible printed circuit board assembly (20) is arranged with at least three rigid printed circuit board sections (21, 22, 23, 24, 25, 26) and with at least two flexible printed circuit board sections (31, 32, 33, 34, 35), wherein at least one flexible printed circuit board section (31, 32, 33, 34, 35) is arranged between two adjacent rigid printed circuit board sections (21, 22, 23, 24, 25, 26) and is electrically connected to these two adjacent rigid printed circuit board sections (21, 22, 23, 24, 25, 26) in a signal-conducting manner, and wherein the sectionally flexible printed circuit board assembly (20) in its installed position within the module housing (2) forms a three-dimensional structure (40) in which at least a first pair of two adjacent rigid printed circuit board sections (21, 22) encloses a first angle (α) to each other and at least one second pair of two adjacent rigid circuit board sections (22,23) encloses a second angle (β) to each other.

A rectifier module is disposed on a mainboard. The rectifier module includes a first circuit board, a second circuit board, a transformer, a third circuit board and a plurality of output filter capacitors. The first circuit board and the second circuit board are inserted into the mainboard. The first circuit board and the second circuit board are opposite to each other. The transformer is arranged between and connected to the first circuit board and the second circuit board. A first side of the third circuit board is connected to the first circuit board. A second side of the third circuit board is connected to the second circuit board. The plurality of output filter capacitors are disposed on the third circuit board. The rectifier module is electrically connected to the mainboard via a positive connection part and a negative connection part.

A circuit board assembly (100) and an electronic device are provided. The circuit board assembly (100) includes a first circuit board (1), a first transfer board (2), a second transfer board (3), and a second circuit board (4). The second transfer board (3) is arranged between a top of the first transfer board (2) and a bottom of the second circuit board (4). The first circuit board (1) is stacked with the second circuit board (4) in a thickness direction of the circuit board assembly (100) sequentially through the first transfer board (2) and the second transfer board (3).

The invention relates to a thermal-type flow sensor (1) for a flow meter, comprising a main channel part (3b) with a main channel (3) for a medium whose flow is to be determined, a sensor tube (4), having a first tube portion (5), a second, opposite tube portion (8), a sensing portion (11) connecting the first and second tube portions, at least two sensing or heating elements (12) for measuring a temperature differential or a power differential in the sensor tube, a thermally conductive frame element (13) in contact with at least the first tube portion, the second tube portion as well as the main channel part, configured to equalize temperature gradients, wherein thermally conductive frame element (13) is a printed circuit board (PCB) (14).

The invention relates to a circuit board (100) having a carrier (1) which can be converted from a flat shape into a three-dimensional shape and can be equipped with components, to a method for producing an electronics assembly (200) comprising the circuit board (100), and to an electronic device (300) comprising the electronics assembly (200). The carrier (1) comprises three or more regions (3a, 3b, 3c, 3d). Before the carrier (1) is first converted into the three-dimensional shape, each region (3a, 3b, 3c, 3d) is connected to at least one adjacent region (3a, 3b, 3c, 3d) via two or more bendable and / or breakable connection pieces (5) which are spaced apart from one another along a bending line (K) running between the two adjacent regions (3a, 3b, 3c, 3d). The regions (3a, 3b, 3c, 3d) which are connected to one another via connection pieces (5) before the first-time conversion are connected in each case via two or more flexible connecting bridges (7) which are spaced apart from one another along the bending line (K) running between the two regions (3a, 3b, 3c, 3d).

The utility model relates to a package and a system. There is provided a package comprising: a first rigid segment defining a first vent hole; a second rigid segment defining a second vent hole; a first speaker die attached to the first rigid segment and covering the first vent hole; a second speaker die attached to the second rigid segment and covering the second vent hole; a first flexible segment attached between the first rigid segment and the second rigid segment and providing electrical continuity between the first rigid segment and the second rigid segment; and a spacer defining an acoustic port with a first rigid segment attached to a first side of the spacer and a second rigid segment attached to a second side of the spacer with the first loudspeaker die facing the second loudspeaker die.