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Method of separating first substrate and second substrate

A substrate, the fourth technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of high cost, complicated process, low yield rate, etc., and achieve the effect of improving yield rate and reducing cost

Inactive Publication Date: 2015-08-26
CPT TECH GRP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this process is complex, costly and has low yield

Method used

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  • Method of separating first substrate and second substrate
  • Method of separating first substrate and second substrate
  • Method of separating first substrate and second substrate

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Embodiment Construction

[0038] Figure 1A to Figure 1E It is a schematic flow diagram of separating the first substrate and the second substrate according to an embodiment of the present invention. Please refer to Figure 1A , first, provide a first substrate S1 and a second substrate S2 connected to each other, the first substrate S1 has a first edge E1 opposite to a second edge E2, a third edge E3 connecting the first edge E1 and the second edge E2, The fourth edge E4 is opposite to the third edge E3 and connects the first edge E1 and the second edge E2. In this embodiment, there may be no sealant between the first substrate S1 and the second substrate S2, and the first substrate S1 and the second substrate S2 may be connected together through electrostatic interaction.

[0039] figure 2 for with Figure 1A The cross-sectional schematic diagrams of the first substrate and the second substrate corresponding to the section line A-A' of . Please refer to figure 2 , in this embodiment, the thick...

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Abstract

The invention relates to a method for separating a first substrate from a second substrate. The method comprises the following steps: providing a first substrate and a second substrate connected with each other, wherein the first substrate is provided with a first edge and a second edge opposite to each other and a third edge connected with the first edge and the second edge; providing a cutter and inserting the cutter between the first substrate and the second substrate; providing a wire, connecting the wire between the first substrate and second substrate and moving the wire from the first edge to the second edge along the third edge; and providing a spacer, placing the spacer between the first substrate and the second substrate along the wire and moving the spacer from the first edge to the second edge along the third edge. The method has the advantages of simple operation, low yield and low cost.

Description

technical field [0001] The invention relates to a method for separating a first substrate and a second substrate, in particular to a method for separating two substrates in a display. Background technique [0002] In terms of display development, with the advancement of optoelectronic technology and semiconductor manufacturing technology, flat-panel displays with superior characteristics such as high image quality, good space utilization efficiency, and no radiation have gradually become the mainstream of the market. In the current market, in addition to high image quality and other characteristics of the display, consumers also require the display to have a thin, light and small appearance, which is good for appearance or portability. However, in the current ultra-thin display manufacturing process, the main technical bottleneck lies in how to fabricate the pixel array on the ultra-thin substrate. [0003] In the conventional technology, before manufacturing the pixel arra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/00
Inventor 陈永坚郭哲成黄彦余林子斌
Owner CPT TECH GRP