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Method for producing light-emitting device and light emitting device

A technology for a light-emitting device and a manufacturing method, which is applied in the fields of semiconductor/solid-state device manufacturing, electrical components, and electric-solid-state devices, etc., can solve the problems of poor operation efficiency, the quality of the light-emitting device 300 is kept constant, and the removal of the substrate 302 is difficult. Effects of improved heat dissipation characteristics and simple quality

Active Publication Date: 2013-01-16
CITIZEN ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the above-mentioned conventional light-emitting device 300, the substrate 302 is finally removed, so although the overall thickness of the light-emitting device has been reduced, it is necessary to seal the plurality of electrodes 303a, 303b, and 303c firmly fixed on the substrate 302. In the state where the 306 side is fixed and remains, only the substrate 302 is peeled off, and a mechanical or chemical method is used for this peeling, so there is difficulty in removing the substrate 302, and the work efficiency is not good, and it has a negative impact on the light emission after the substrate 302 is peeled off. The problem that the quality of the device 300 is difficult to maintain

Method used

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  • Method for producing light-emitting device and light emitting device
  • Method for producing light-emitting device and light emitting device
  • Method for producing light-emitting device and light emitting device

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no. 1 Embodiment approach ）

[0071] Figure 1 to Figure 3 A light-emitting device manufactured by the manufacturing method of the first embodiment of the present invention is shown, Figure 4 to Figure 25 The steps of the manufacturing method of the first embodiment are shown.

[0072] exist figure 1 as well as figure 2Among them, the light-emitting device 10 has: a light-emitting diode element (hereinafter, a light-emitting element) 3 having an N electrode 3a and a P electrode 3b as a pair of element electrodes; a transparent sealing resin or a light-transmitting sealing resin 5 mixed with fluorescent particles (hereinafter the sealing member) seals the light emitting element 3 in a state where each of the pair of element electrodes of the light emitting element 3 exposes the lower surface as at least one side; and a pair of external connection electrodes are formed on the sealing member 5 At least one surface of the exposed pair of element electrodes is electrically connected to an N electrode 3 a ...

no. 2 Embodiment approach ）

[0091] Figure 26 A light-emitting device manufactured by the manufacturing method of the second embodiment of the present invention is shown, Figure 27 to Figure 32 The steps of the manufacturing method of the second embodiment are shown.

[0092] The basic structure of the light emitting device 20 of this embodiment and figure 1 The light-emitting device 10 according to the first embodiment shown is the same, so the same symbols are attached to the same structures, and detailed descriptions are omitted.

[0093] This light-emitting device 20 differs from the previous light-emitting device 10 in that a protective film 25 is formed on substantially the entire surface of the lower surface 5 a of the sealing member 5 that resin-seals the light-emitting element 3 . The protective film 25 is formed for the purpose of reinforcing the flexible sealing member 5 made of silicone resin, and the N external connection electrode 23n formed on the lower surface of the sealing member 5 ...

no. 3 Embodiment approach ）

[0108] Figure 33 A light-emitting device obtained by the manufacturing method of the third embodiment of the present invention is shown, Figure 34 The characteristic steps of the manufacturing method of the third embodiment are shown. In addition, the same reference numerals are assigned to components equivalent to those in the first embodiment, and detailed description thereof will be omitted.

[0109] Such as Figure 33 As shown, the light-emitting device 30 of this embodiment includes: a light-emitting element 3 having an upper surface, a lower surface, and a peripheral surface between the upper surface and the lower surface, and a pair of element electrodes on the lower surface; a sealing member, so that the light-emitting element 3 is arranged in such a way that a pair of element electrodes of the light emitting element 3 are exposed to seal the light emitting element 3; and a pair of external connection electrodes are electrically connected to the pair of element ele...

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Abstract

In order to produce, via an extremely simple method, a thin light-emitting device that does not have a substrate in which a light-emitting element has been mounted, disclosed is a method for producing a light-emitting device, said method comprising: preparing a plurality of light-emitting elements each having a pair of element electrodes; arraying the plurality of light-emitting elements in a sealing member in a manner so that at least one surface of the pair of element electrodes provided to each light-emitting element is exposed; forming on the aforementioned sealing member a plurality of pairs of external connection electrodes, each pair connected to the pair of element electrodes provided to each light-emitting element; and dividing the aforementioned sealing member having a plurality of light-emitting elements, obtaining a plurality of light-emitting devices each provided with a light-emitting element having a pair of element electrodes, a sealing member that seals the light-emitting element in a state such that at least one surface of each of the pair of element electrodes is exposed, and a pair of external connection electrodes provided on the sealing member and electrically connected to the pair of element electrodes.

Description

technical field [0001] The present invention relates to a method of manufacturing a light emitting device including a light emitting diode element, and a light emitting device. Background technique [0002] Light-emitting diode elements (hereinafter simply referred to as light-emitting elements) are small, have good luminous efficiency, and have bright light-emitting colors, and have long life and excellent driving characteristics. Therefore, in recent years, they have been widely used as light sources for backlights of color display devices. , lighting, etc. Here, the light emitting device in the present invention will also be described as an embodiment of a light emitting device including a light emitting element. [0003] In recent years, for light-emitting elements mounted on substrates, transparent resins, transparent glass, or sealing members including fluorescent resins are used to coat light-emitting elements on substrates to provide white light-emitting devices and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/00H01L33/60H01L33/62
CPCH01L33/52H01L33/486H01L2224/48091H01L2224/48465H01L2224/73265H01L2933/0066H01L33/60H01L2224/48227H01L2933/0033H01L2224/32013H01L2224/16225H01L2224/19H01L2924/181H01L2224/96H01L2224/97H01L21/568H01L2224/04105H01L2224/32225H01L2224/73267H01L2924/00014H01L2924/00H01L2924/00012H01L2224/83
Inventor 今津健二
Owner CITIZEN ELECTRONICS CO LTD
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