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Laser processing apparatus

A laser processing and laser technology, applied in auxiliary devices, metal processing, laser welding equipment, etc., can solve the problems of long time and long production interval, and achieve the effect of good precision and shortened processing time.

Inactive Publication Date: 2015-06-24
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the case of processing a large number of patterning lines, the production interval of processing becomes longer, and if the required accuracy of the pitch becomes higher, it takes longer time for positioning

Method used

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  • Laser processing apparatus
  • Laser processing apparatus
  • Laser processing apparatus

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0052] exist figure 1 A schematic diagram of a laser processing apparatus according to an embodiment of the present invention is shown in . The laser processing device 1 has: a laser oscillator 2 for emitting laser light; a lens and mirror mechanism 3; first to fourth optical units 41 to 44; and an XY stage 5 for On the substrate G for placing solar panels. Here, a process in which a plurality of sub-cells are formed on the substrate G by scanning a laser beam spot along a plurality of processing-planned lines on the substrate G will be described as an example.

[0053] [Lens and mirror mechanism]

[0054] The lens and mirror mechanism 3 has: a collimator lens 3a for collimating laser light; a mirror 3b; and a beam splitter 3c.

[0055] [optical unit]

[0056] The first optical unit 41 has a mirror 51 , a diffractive optical element 52 , and an f-sinθ lens 53 . The reflection mirror 51 reflects the laser light from the second optical unit 42 to the diffractive optical ele...

no. 2 Embodiment approach

[0072] exist image 3 A schematic diagram of a laser processing apparatus according to a second embodiment of the present invention is shown in . In this laser processing apparatus 100 , in addition to the same configuration as that of the first embodiment, each of the optical units 41 to 44 is provided with a motor for rotation M1 and a motor for movement M2 . exist image 3 In the figure, only the rotation motor M1 and the movement motor M2 of the first optical unit 41 are shown, but the two motors M1 and M2 are similarly provided in each of the optical units 41 to 44 .

[0073] In addition, in the device of the second embodiment, a schematic plan view showing the arrangement of the four optical units 41 to 44 and figure 2 exactly the same.

[0074] The rotation motor M1 is a motor for rotating the diffractive optical element 52 of each of the optical units 41 to 44 around the optical axis. And the motor M2 for a movement is a motor for moving the whole lens barrel 41a-...

Embodiment

[0100] As an example, when there are 26 branches and the pitch is adjusted from d1 = 1.5 mm to d2 = 1.4 mm, the specific amount of rotation and movement are shown below.

[0101] Rotation amount of diffractive optical element 52: 21°

[0102] The movement amount of the first optical unit 41 is +2.6mm

[0103] The movement amount of the third optical unit 43 is -2.6mm

[0104] The movement amount of the fourth optical unit 44 is -5.2mm

[0105] In this embodiment, by rotating the diffractive optical element 52 of each of the optical units 41 to 44 including the diffractive optical element 52 by the rotation motor M1 , it is possible to adjust the optical structure formed on the substrate G by each of the optical units 41 to 44 with high precision. Spacing of multiple beam spots.

[0106] Furthermore, the pitch between the optical units after rotating the optical units 41 to 44 can be adjusted by the motor M2 for movement. Spacing of beam spots.

[0107] In particular, when...

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PUM

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Abstract

The invention provides a laser processing apparatus which emits a laser beam along a plurality of processing scheduled lines simultaneously by arranging a plurality of optical units even if the spaces between the plurality of processing scheduled lines are small. The laser processing apparatus comprises a laser oscillator (2) for emitting a laser beam; a first optical unit (41) and a second optical unit (42). The first optical unit (41) and the second optical unit (42) each is provided with a diffraction optical element (52) for splitting the laser beam emitted from the laser oscillator (2) into a plurality of laser beams; and a lens (53) by which the plurality of laser beams from the diffraction optical element (52) are condensed along a straight line on a substrate. Further, a first straight line (L1) formed by the alignment of a plurality of beam spots condensed on the substrate by the first optical unit (41) and a second straight line (L2) formed by the alignment of a plurality of beam spots condensed on the substrate by the second optical unit (42) are staggered in parallel.

Description

technical field [0001] The present invention relates to a laser processing device, and more particularly to a laser processing device for irradiating laser light along a plurality of processing planned lines on a substrate. Background technique [0002] In the manufacture of solar cells, a thin layer on a substrate is irradiated with laser light along a plurality of lines to divide a plurality of sub-cells. Then, the divided sub-batteries are connected to each other. [0003] In such a patterning step of irradiating laser light to the solar cell substrate for processing, laser light is irradiated along a large number of lines to be processed at a predetermined pitch. [0004] For example, in the device of Patent Document 1, a plurality of optical units each capable of outputting four laser beams are provided. And, by scanning a plurality of optical units, a plurality of scribe grooves are formed at a predetermined pitch. [0005] Furthermore, in Patent Document 2, an opti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/067
CPCB23K26/042B23K26/0643B23K26/0648B23K26/067B23K26/0853B23K37/0408B23K2101/36
Inventor 畑强之清水政二林尚久
Owner MITSUBOSHI DIAMOND IND CO LTD