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Flame-retardant encapsulating material and preparation method thereof

A potting material and flame retardant technology, applied in the field of flame retardant potting materials and their preparation, can solve the problems of poor fire resistance and flame retardant performance, low flame retardant level, etc., and achieve high humidity and heat atmospheric aging resistance and good dustproof performance. , the effect of smooth surface

Inactive Publication Date: 2014-12-03
大连宝津科技发展有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a flame-retardant potting material and its preparation method, which solves the problems of poor fire-proof and flame-retardant performance and low flame-retardant level in the prior art.

Method used

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  • Flame-retardant encapsulating material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] In this embodiment, the flame retardant potting material includes A component and B component, wherein:

[0048] In terms of weight percentage, component A includes: base material bisphenol A epoxy resin 33%; thinner diethylene glycol dibenzoate 2.5%; toughening agent dioctyl phthalate 2%; pigment 1.9% % (carbon black 0.2%, medium chrome yellow 1.0%, phthalocyanine green 0.7%); organic silicon defoamer (KS-603) 0.1%; filler silicon powder 25%; flame retardant filler aluminum hydroxide weight accounted for 28%; liquid The flame retardant tris(chloroisopropyl) phosphate (TCPP) accounted for 7.5% by weight.

[0049] In terms of weight percentage, component B includes: curing agent methyltetrahydrophthalic anhydride 84%; curing agent tungalic anhydride 13%; accelerator 2,4,6-tris(dimethylaminomethyl)phenol (DMP-30 ) 3%.

[0050] The weight ratio of A component and B component is 100:30.

[0051]The preparation method of the flame-retardant potting material comprises the ...

Embodiment 2

[0066] In this embodiment, the flame retardant potting material includes A component and B component, wherein:

[0067] In terms of weight percentage, component A includes: base material bisphenol A type epoxy resin 25%; thinner diethylene glycol dibenzoate 4%; toughening agent dioctyl phthalate 4%; pigment 3 % (carbon black 0.5%, medium chrome yellow 2%, phthalocyanine green 0.5%); organic silicon defoamer (KS-603) 0.15%; filler silicon powder 28%; flame retardant filler aluminum hydroxide weight accounted for 25.85%; liquid Flame retardant tris(chloroisopropyl) phosphate (TCPP) accounts for 10% by weight;

[0068] In terms of weight percentage, component B includes: curing agent methyltetrahydrophthalic anhydride 90%; curing agent tungalic anhydride 9%; accelerator 2,4,6-tris(dimethylaminomethyl)phenol )1%;

[0069] The weight ratio of A component and B component is 100:29.

[0070] The preparation method of the flame-retardant potting material comprises the following ste...

Embodiment 3

[0085] In this embodiment, the flame retardant potting material includes A component and B component, wherein:

[0086] In terms of weight percentage, component A includes: base material bisphenol A epoxy resin 35%; thinner diethylene glycol dibenzoate 1.5%; toughening agent dioctyl phthalate 1.5%; pigment 1.5% % (carbon black 0.1%, medium chrome yellow 1.0%, phthalocyanine green 0.4%); silicone defoamer (KS-603) 0.05%; filler silicon powder 24.95%; flame retardant filler aluminum hydroxide weight 30%; liquid Flame retardant tris(chloroisopropyl) phosphate (TCPP) accounts for 5.5% by weight;

[0087] In terms of weight percentage, component B includes: curing agent methyltetrahydrophthalic anhydride 80%; curing agent tungalic anhydride 15%; accelerator 2,4,6-tris(dimethylaminomethyl)phenol (DMP-30 ) 5%;

[0088] The weight ratio of A component and B component is 100:32.

[0089] The preparation method of the flame-retardant potting material comprises the following steps:

...

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Abstract

The invention relates to the field of encapsulation of electronic component, in particular relates to a flame-retardant encapsulating material applicable to electronic and electric product and a preparation method of the flame-retardant encapsulating material, solving the problems of the prior art that the fire-proofing and flame retardant performance is poor, and relatively high flame-retardant rating cannot be obtained. The material comprises a component A and a component B; in percentage by weight, the component A comprises base stock bisphenol-A epoxy resin, fire retardant, diluent diethylene glycol dibenzoate, flexibilizer dioctyl phthalate, pigment, organic silicon defoaming agent and filler silica micropowder; the component B comprises curing agent phthalic anhydride or methyl tetrahydrophthalic anhydride, curing agent eleostearate anhydride, and accelerator 2, 4, 6-tri(dimethylamino methyl) phenol; before the flame-retardant encapsulating material is used, the component A is pre-heated in an oven and then uniformly agitated in an up-to-bottom way; and the component A and the component B are uniformly mixed, so as to obtain flame-retardant encapsulating material; and then the encapsulating can be carried out. The flame-retardant encapsulating material provided by the invention is mainly applicable to insulating packaging of various electronic components such as power engine, rail transit, war industry, spaceflight, car and power.

Description

technical field [0001] The invention relates to the field of packaging of electronic components, in particular to a flame-retardant potting material for electronic and electrical products and a preparation method thereof. Background technique [0002] Epoxy resin potting glue has excellent mechanical properties, chemical medium resistance, adhesive properties and electrical insulation properties, and is widely used in the potting of mechanical and electronic components. It is generally composed of a matrix and a curing agent mixed in a certain proportion. , In order to meet the needs of different working environments, tougheners, accelerators, diluents and fillers are added appropriately. For electronic components, it is necessary to pot the small gaps in the products, so higher requirements are put forward for the performance of epoxy resin potting glue. At present, most epoxy resin potting adhesives have high viscosity and poor fluidity, and are not suitable for potting s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/02C08K13/02C08K5/103C08K5/12C08K3/04C08K3/36C08K5/09C08K5/10C08K5/18C08K3/22C08K5/521C09K3/10
Inventor 王若兵
Owner 大连宝津科技发展有限公司