Unlock instant, AI-driven research and patent intelligence for your innovation.

Method and device for thermally coupling a heat sink to a component

A technology of thermal coupling and components, applied in the direction of heat exchange equipment, lighting and heating equipment, electrical equipment construction parts, etc.

Inactive Publication Date: 2013-01-23
NOKIA NETWORKS OY
View PDF12 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Another disadvantage is that a large portion of the thermal filler remains on the electrical component after it has been separated from the heat sink

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for thermally coupling a heat sink to a component
  • Method and device for thermally coupling a heat sink to a component
  • Method and device for thermally coupling a heat sink to a component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0054] The separation of the heat sink from the electrical component can be achieved by providing an intermediate layer and at least one layer of thermal filler together between the heat sink and the electrical component.

[0055] The intermediate layer can be at least one of the following:

[0056] -gauze;

[0057] —Glass fiber structure;

[0058] -Ceramic structure;

[0059] -Foil;

[0060] -grid;

[0061] -Fabric;

[0062] -textile.

[0063] As an option, a primer can be used to pre-treat the intermediate layer to improve contact with the thermal filler.

[0064] The intermediate layer may include a porous structure, especially a more or less regular pattern of pores. The holes can be distributed symmetrically or asymmetrically across the intermediate layer. The holes may have substantially the same size and / or form or have different sizes and / or forms.

[0065] Apply thermal filler to the heat sink or to the electrical components or to both. The intermediate layer can be provided on th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method and a device for thermally coupling a heat sink to a component are provided, wherein a thermal filler and an intermediate layer are applied between the heat sink and the component.

Description

Technical field [0001] The invention relates to a method and apparatus for thermally coupling a heat sink to a component. Background technique [0002] Now, certain electrical components are consuming large amounts of power dissipated as heat. Therefore, component heating and heat sinks are used to dissipate heat from these electrical components to avoid damage and extend the durability of the electrical components. [0003] In some applications, due to mechanical constraints and / or tolerances and / or gaps between the heat sink and the component, the thermal resistance between the heat sink and the component is high (even though the heat sink can be directly attached to the electrical component). In this case, a thermal filler (such as thermally conductive gel, paste, or liquid) is applied between the electrical component and the heat sink. Thermal fillers provide good thermal conductivity and can vary in thickness due to specific mechanical requirements. [0004] During the produc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373H01L23/42
CPCH01L23/42H01L23/3735H01L2924/0002H01L2924/00H01L23/373F28F9/00H05K7/20409H05K13/04
Inventor S.福斯A.希贝特
Owner NOKIA NETWORKS OY