Pumpkin cornflake and preparation method thereof
A production method and technology of corn flakes, which are applied in the field of food processing, can solve problems such as affecting the taste, losing product characteristics, and no longer being crispy, and achieve the effects of increasing nutrition, enriching varieties, and preventing moisture absorption
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0019] (1) Weigh 600g of waxy corn flour, 200g of sweet corn flour, and 90g of pumpkin powder, and mix them evenly to obtain material A;
[0020] (2) Under the condition of stirring, spray 200g of drinking water evenly into material a, and mix evenly to make material b;
[0021] (3) Feed material b into a preheated twin-screw extruder for extrusion molding, and then granulate and tablet to obtain cornflakes with a thickness of 0.2-0.4 mm;
[0022] (4) Bake the corn flakes at a baking temperature of 150° C. for a baking time of 9 minutes. When cooled to 55° C., evenly spray 70 g of melted beeswax on the surface of the corn flakes, and quickly cool to room temperature to obtain pumpkin corn flakes.
Embodiment 2
[0024] (1) Weigh 550g of waxy corn flour, 150g of sweet corn flour, and 80g of pumpkin powder, and mix them evenly to obtain material A;
[0025] ⑵Under the condition of stirring, spray 150g of drinking water evenly into the medium a material, and mix evenly to prepare the b material;
[0026] (3) Feed material b into a preheated twin-screw extruder for extrusion molding, and then granulate and tablet to obtain cornflakes with a thickness of 0.2-0.4 mm;
[0027] (4) Bake the corn flakes at a baking temperature of 145° C. and a baking time of 8 minutes. When cooling to 53° C., evenly spray 50 g of melted beeswax on the surface of the corn flakes, and rapidly cool to room temperature to obtain pumpkin corn flakes.
Embodiment 3
[0029] (1) Weigh 650g of waxy corn flour, 250g of sweet corn flour, and 100g of pumpkin powder, and mix them evenly to prepare material A;
[0030] ⑵Under the condition of stirring, spray 250g of drinking water evenly into the medium a material, and mix evenly to prepare the b material;
[0031] (3) Feed material b into a preheated twin-screw extruder for extrusion molding, and then granulate and tablet to obtain cornflakes with a thickness of 0.2-0.4 mm;
[0032] (4) Bake the corn flakes at a baking temperature of 155° C. and a baking time of 10 minutes. When cooling to 57° C., evenly spray 80 g of melted beeswax on the surface of the corn flakes, and rapidly cool to room temperature to obtain pumpkin corn flakes.
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com