Metallography detection method for bonding interface having honeycomb sandwich structure

A honeycomb interlayer and metallographic detection technology, applied in the field of measurement, can solve the problems of complex structure and shape, inability to determine the factors affecting the bonding quality, and inability to detect weak adhesion and virtual adhesion of the honeycomb structure.

Inactive Publication Date: 2013-02-13
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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  • Abstract
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  • Application Information

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Problems solved by technology

The honeycomb sandwich structure is generally formed by bonding the skin, adhesive and honeycomb. At present, the bonding quality of the honeycomb sandwich structure is mainly evaluated by non-destructive testing and mechanical properties. The non-destructive testing method can determine debonding, but cannot detect the honeycomb structure. For weak adhesion and weak adhesion, the mechanical performance test can only give the bonding strength, and some structural shapes are complex, and the performance test samples cannot be processed, and the factors that affect the bonding quality cannot be judged according to the above two methods

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  • Metallography detection method for bonding interface having honeycomb sandwich structure
  • Metallography detection method for bonding interface having honeycomb sandwich structure
  • Metallography detection method for bonding interface having honeycomb sandwich structure

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Embodiment Construction

[0029] The technical scheme of the present invention will be described in further detail below in conjunction with accompanying drawing and embodiment:

[0030] See attached Figure 1~6 Shown, the metallographic detection method of the bonding interface of a kind of honeycomb sandwich structure is characterized in that: the step of this method is:

[0031] (1) Cut sample 6 on the honeycomb sandwich structure. Sample 6 is cut in a direction perpendicular to skin 1, that is, parallel to honeycomb wall 2. The position and quantity of sample 6 should meet the following conditions:

[0032] 1.1 For a flat honeycomb sandwich structure with no change in thickness and dimension, at least two samples 6 shall be cut from the middle and the edge respectively;

[0033] 1.2 For the honeycomb sandwich structure with varying thickness and dimension, cut at least two samples 6 at the maximum and minimum places of the thickness test;

[0034] 1.3 For the honeycomb sandwich structure with var...

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Abstract

The present invention relates to a metallography detection method for a bonding interface having a honeycomb sandwich structure, wherein a sample is cut from a honeycomb structure or a performance test part, cold inlaying is performed, a metallography sample is grinded, and a bonding state of a glue film and a honeycomb is observed through a metallurgical microscope. According to the present invention, if the honeycomb inserts into the glue film deep and the glue film climbs on the surface of the honeycomb, the bonding strength is high and the bonding quality is good, if the honeycomb inserts into the glue film deep and the glue film does not climb on the surface of the honeycomb, or the honeycomb inserts into the glue film shallowly and even does not enter the glue film and the glue film climb on the surface of the honeycomb less or does not climb, the bonding strength is low and the bonding quality is poor, and the bonding is the weak bonding or the virtual bonding, wherein the bonding quality is related to a temperature, pressure and a pressurization time during a curing process.

Description

technical field [0001] The patent of the present invention is a metallographic detection method of the bonding interface of a honeycomb sandwich structure, which belongs to the field of measurement technology. Background technique [0002] The honeycomb sandwich structure is widely used in aviation, aerospace, automobile, construction and other fields due to its light weight, high strength and superior mechanical properties of elastic modulus. For the honeycomb sandwich structure, it is mainly the bonding structure, and the bonding quality directly affects the service life of the structure, so the detection of the bonding quality of the honeycomb sandwich structure is extremely important. The honeycomb sandwich structure is generally formed by bonding the skin, adhesive and honeycomb. At present, the bonding quality of the honeycomb sandwich structure is mainly evaluated by non-destructive testing and mechanical properties. The non-destructive testing method can determine de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/88G01N1/32G01N1/06
Inventor 范金娟侯学勤王占彬刘含洋
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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