Bonding apparatus and method for controlling same

A bonding device and a technology of controlling the amount, applied in the direction of nonlinear optics, instruments, optics, etc., can solve the problems of reduced visibility of the display surface, etc., and achieve high-speed and efficient bonding, efficient positioning and bonding, and stable operation Effect

Inactive Publication Date: 2013-02-20
SHIBAURA MECHATRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when an air layer enters between liquid crystal modules, protective sheets, touch panels, etc. (hereinafter referred to as workpieces), the visibility of the display surface will be reduced due to external light reflection.

Method used

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  • Bonding apparatus and method for controlling same
  • Bonding apparatus and method for controlling same
  • Bonding apparatus and method for controlling same

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Embodiment Construction

[0086] Below, embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings.

[0087] [A. Composition]

[0088] [1. Overall composition]

[0089] First, the whole structure of the bonding apparatus (henceforth this apparatus) of this embodiment is demonstrated. Such as figure 1 As shown, this device is a device in which four holding devices 2 are mounted on a rotary table 1 . The rotary table 1 is configured to be intermittently rotated by the index mechanism 11 corresponding to the loading and unloading position 1A, the sticking material preparation position 1B, the positioning position 1C, and the vacuum bonding position 1D.

[0090] Such as figure 2 as well as image 3 As shown, the holding device 2 is a device for holding the workpiece S1 and the workpiece S2 facing up and down. In this embodiment, rectangular-shaped board|substrates, such as a liquid crystal module and a cover panel, are ...

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Abstract

Provided is a low-cost and small bonding apparatus which can efficiently align and bond works by using a turntable. A method for controlling the bonding apparatus is also provided. The bonding apparatus which bonds a pair of works (S1, S2) is provided with: a turntable (1) which intermittently rotates corresponding to a plurality of positions; a plurality of holding apparatuses (2) which are provided on the turntable (1) and hold the works (S1, S2); an aligning section (300) which is provided on the holding apparatuses (2) and aligns the work (S1); and a pressing apparatus (5) which bonds the work (S2) on the work (S1) by urging the work (S2) held by the holding apparatus (2). A driving section (400) which drives the aligning section (300) is provided independently from the turntable (1) and removably from the aligning section (300).

Description

[0001] The patent application of the present invention is the branch of the invention patent application with the national application number of 200980134458.3, the international application number of PCT / JP2009 / 004373, the international application date of September 4, 2009, and the invention title of "laminating device and its control method". case application. technical field [0002] This invention relates to the bonding apparatus which improved the technique of bonding flat workpieces, such as a liquid crystal module and a cover panel, and its control method. Background technique [0003] In general, a liquid crystal panel is composed of a laminated liquid crystal module, a protective sheet for protecting its surface, a touch panel for operation, and the like. These liquid crystal modules, protective sheets, touch panels, etc. (hereinafter referred to as workpieces) are assembled in the liquid crystal module frame, and a space is formed between them to avoid contact wit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13G02F1/133G02F1/1333
CPCG02F1/1333G02F1/133G02F2001/133354G02F2001/133331G02F1/1303G02F1/133331G02F1/133354G02F1/13
Inventor 白川义广横田典之井田琢也
Owner SHIBAURA MECHATRONICS CORP
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