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Optical sensor system and detecting method for enclosed semiconductor device module

A technology for semiconductors and devices, applied in the field of embodiments used in microprocessors, can solve problems such as endangering safety, exposing noise from modules, and conflicting device operation.

Inactive Publication Date: 2013-02-27
VESTAS WIND SYST AS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The disadvantage of these techniques is that they require galvanic connections extending from the inside of the power electronics module to the outside for sensing and control purposes
If this connection is not properly isolated, this may cause conflicts in the operation of the unit, noise may be exposed from the module, and safety may be compromised

Method used

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  • Optical sensor system and detecting method for enclosed semiconductor device module
  • Optical sensor system and detecting method for enclosed semiconductor device module
  • Optical sensor system and detecting method for enclosed semiconductor device module

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Embodiment Construction

[0038] In general, the invention relates to providing a fiber optic sensor system for an enclosed semiconductor device, such as a power electronics module or a microprocessor with a housing, in order to monitor its operation.

[0039] will now refer to image 3 A detailed example of the power electronic module of the present invention is described. For illustration purposes, it is assumed that the power electronics module is constructed with figure 1 and 2 The devices shown are essentially the same. Module 300 has a plastic housing 302 with a copper base plate 304 to which a DCB 306 is soldered or thermally attached using a suitable thermal interface material. The connection between the substrate and the DCB306 can also be achieved by a so-called sintering process. The substrate provides a strong base for the device and assists in spreading heat away from the multiple active semiconductor devices, known as die, mounted on the DCB 306 .

[0040] The DCB306 is formed from a...

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Abstract

A sensor system and method for a power electronics module is discussed. The system comprises a optical fibre 318 mounted inside the module housing 302 and connected to an external sensor system 320 (not shown). The optical fibre 318 is arranged so that it lies proximate to one or more semiconductor dies 308 within the housing, and can sense their temperature. The fibre can be connected to the die 308 by glue, mechanical connection, or can in other examples by provided in the underlying support structure such as a DCB (direct copper bonded ceramic structure) or base plate 304. The fibre can contain an optical grating, such as an FBG or LPG, or can operate based on interferometry, to detect temperature or strain.

Description

field of invention [0001] The present invention relates to optical sensor systems and detection methods for enclosed semiconductor device modules, and in particular to embodiments for use in power electronics modules or microprocessors with housings. Background technique [0002] A power electronics module is a device that houses a plurality of power system components, such as semiconductor devices that are typically used to switch high currents and high voltages. In these applications, the semiconductor devices are usually MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) or IGBTs (Insulated Gate Bipolar Transistors) because they offer high efficiency and fast switching. [0003] A known power electronic module 10 will now be referred to as figure 1 and 2 shown in . [0004] figure 1 The appearance of the module 10 is shown. Module 10 includes a plastic housing 102 attached to a metal base plate 104 by one or more screws (not shown) and / or adhesive. The met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D3/08G01D5/353G01D18/00
CPCG01K11/3206G01K1/14G01D3/08G01D18/00G01D5/353G01D5/35316H01L23/34H01L23/3735H01L2224/4846H01L2224/48137H01L2224/49111H01L2224/4917H01L2224/48139H01L2224/8592H01L2224/40225
Inventor T·何乔特L·格拉韦德
Owner VESTAS WIND SYST AS