Electronic module, light emitting device and manufacture method of electronic module

Abstract

The invention relates to an electronic module used for being installed to a mounting surface (6). The electronic module comprises a circuit board (2) disposed on a heat source (1) and envelope material (4) which packages the circuit board (2) at least from the other side facing to the heat source (1). The circuit board (2) is provided with a through heat hole (3). The heat source (1) thermally contacts with the heat hole (3). At least part of the other side of the circuit board (2), corresponding to the heat hole (3), is provided with a cavity (8), and the cavity (8) is filled with heat conduction material (5) which is thermally conductively connected to the mounting surface. In addition, the invention further relates to a light emitting device, and a manufacture method of the electronic module. The electronic module is simple in structure and low in manufacture cost. The envelope material of the module is modified, so that the electronic module is low in thermal resistance and fine in stability.

Description

technical field [0001] The invention relates to an electronic module, a light emitting device and a manufacturing method of the electronic module. Background technique [0002] Today, lighting devices are increasingly used in daily life, and most of the electronic modules of these lighting devices have plastic encapsulation materials, which usually appear in the form of an external housing. This encapsulation material ensures that the electronic module meets the requirements of dust and water resistance in industrial use, and also avoids damage to the circuit board and the electronic components mounted on it, especially LEDs, during transportation or installation. [0003] as in figure 1 As shown in , the encapsulation material 4 integrally seals the heat source 1 , such as the circuit board 2 with LEDs therein, and a thermal hole 3 passing through the circuit board 2 is provided under the heat source 1 . Such a fully sealed electronic module can be fixed on the mounting s...

AI Technical Summary

Problems solved by technology

However, since the encapsulation material 4 has a relatively large thickness and high sealing performance, it is not convenient to export the heat generated by the heat source 1, such as the LED, to the outside, that is to say, the thermal resistance of the entire electronic module is relatively high.

This often results in a less stable electronic module and possibly damage to the entire lighting installation

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