32results about "Treatment using electric/magnetic/electromagnetic fields" patented technology

The invention relates to a single- or multilayer, oriented, film coated with an aminosilane compound and composed of polyester which comprises an additive which, on irradiation with electromagnetic radiation, forms metal nuclei on which further metal can be deposited in further steps of the process. The invention further relates to a process for producing this film and to its use in printed circuit boards, ribbon cables, smart cards, RFID labels, membrane keyboards, and film-based circuits of any type.

A composite conductive film is provided that includes a layer of cross-linked polymer having a surface and an inorganic mesh comprising a plurality of nanowires of an inorganic material. The nanowires are, in isolated form, characterized by a first conductivity stability temperature. Further, the plurality of nanowires is embedded within at least a region of the layer of cross-linked polymer, where the region is continuous from the surface of the layer of cross-linked polymer. The layer of cross-linked polymer and the inorganic mesh are arranged to form the composite conductive film having a second conductivity stability temperature that is greater than the first conductivity stability temperature.

A circuit board structure includes a circuit board and an adhesive layer. The circuit board has a first board surface and an opposite second board surface, and the first board surface defines a predetermined portion. The circuit board has a conductive circuit disposed on the first board surface and at least partially arranged on the predetermined portion. The adhesive layer is seamlessly formed on the predetermined portion of the first board surface of the circuit board, and the conductive circuit arranged on the predetermined portion is seamlessly covered by the adhesive layer. A surface of the adhesive layer arranged away from the circuit board is a planar bonding surface.

A conductive element includes: a substrate having a first wavy surface, a second wavy surface, and a third wavy surface; a first layer provided on the first wavy surface; and a second layer formed on the second wavy surface. The first and second layers form a conductive pattern portion. The first, second, and third wavy surfaces satisfy the following relationship:

0≦(Am1/λm1)<(Am2/λm2)<(Am3/λm3)≦1.8

• • (where Am1 is an average width of vibrations of the first wavy surface, Am2 is an average width of vibrations of the second wavy surface, Am3 is an average width of vibrations of the third wavy surface, λm1 is an average wavelength of the first wavy surface, λm2 is an average wavelength of the second wavy surface, and λm3 is an average wavelength of the third wavy surface.)

The invention provides an anti-interference circuit board and a terminal. The circuit board specifically comprises a substrate which is provided with a first surface, and the first surface is providedwith a first region for placing a magnetometer; the substrate is internally provided with a plurality of circuit layers, and the plurality of circuit layers are arranged in a stacked manner, for example, the substrate is at least internally provided with a first functional circuit used for generating a magnetic field generated in a first direction and a second functional circuit used for generating a magnetic field generated in a second direction which are stacked; when the positions of the first functional circuit and the second functional circuit are specifically set, the first region is located in the vertical projection of the first functional circuit and the second functional circuit on the first surface. What can be seen from the description is that the first functional circuit andthe second functional circuit are arranged to compensate the interference of the magnetometer in the first region, and the first functional circuit and the second functional circuit are located belowthe magnetometer during arrangement, so that the occupied surface area of the anti-interference circuit board is reduced.

The invention relates to an electronic module used for being installed to a mounting surface (6). The electronic module comprises a circuit board (2) disposed on a heat source (1) and envelope material (4) which packages the circuit board (2) at least from the other side facing to the heat source (1). The circuit board (2) is provided with a through heat hole (3). The heat source (1) thermally contacts with the heat hole (3). At least part of the other side of the circuit board (2), corresponding to the heat hole (3), is provided with a cavity (8), and the cavity (8) is filled with heat conduction material (5) which is thermally conductively connected to the mounting surface. In addition, the invention further relates to a light emitting device, and a manufacture method of the electronic module. The electronic module is simple in structure and low in manufacture cost. The envelope material of the module is modified, so that the electronic module is low in thermal resistance and fine in stability.

A substrate manufacturing method includes an inner layer circuit forming step for partially removing metal films from an insulating base material (2), on both surfaces of which the metal films are stuck, and forming an inner layer circuit (3); and an insulating layer forming step for applying first insulating resin (4) to each of both the surfaces of the insulating base material (2) with an inkjet system and forming an insulating layer (5). In the insulating layer forming step, a via hole (6) from which the inner layer circuit (3) is partially exposed is formed simultaneously with the application of the first insulating resin (4). Consequently, a step of separately forming a via hole with a laser or the like is unnecessary, expenses are relatively low, and it is possible to simplify a manufacturing process.

The present invention discloses a carrying device, a wet etching apparatus and a usage method thereof. The carrying device comprises a carrying body and a heating unit both disposed under a to-be-processed substrate, the carrying body is used for carrying the to-be-processed substrate such that the to-be-processed substrate is placed inclined; the heating unit is used for heating the to-be-processed substrate, such that temperature of the to-be-processed substrate rises gradually from a top portion to a bottom portion thereof. In the technical solution of the present invention, by disposing the heating unit under the to-be-processed substrate, the temperature of the to-be-processed substrate rises gradually from the top portion to the bottom portion thereof, thus etch rate of the etchant on the bottom portion of the to-be-processed substrate can be increased, and uniformity of etch rate in the inclined wet etching process is improved.