32results about "Treatment using electric/magnetic/electromagnetic fields" patented technology

The invention relates to a multilayer, oriented film, in which at least one layer comprises a polyester which comprises an additive which, on irradiation with electromagnetic radiation, forms metal nuclei on which further metal can be deposited in further steps of the process. The invention further relates to a process for the production of this film and to its use in printed circuit boards, ribbon cables, smart cards, RFID labels, membrane keyboards, and film-based circuits of any type.

A method for producing an electrically conductive thin film on a substrate is disclosed. Initially, a reducible metal compound and a reducing agent are dispersed in a liquid. The dispersion is then deposited on a substrate as a thin film. The thin film along with the substrate is subsequently exposed to a pulsed electromagnetic emission to chemically react with the reducible metal compound and the reducing agent such that the thin film becomes electrically conductive.

[Problem] To provide the following: a conductive-pattern formation method that can improve the conductivity of the conductive pattern; and a composition for forming a conductive pattern via light exposure or microwave heating. [Solution] A conductive-pattern-forming composition containing the following is prepared: copper particles with a copper-oxide thin film formed on the entire surface or part of the surface of each particle; plate-shaped silver particles with thicknesses of 10 to 200 nm; and a binder resin. Said conductive-pattern-forming composition is used to form an arbitrarily-shaped printed pattern on a substrate, and said printed pattern is exposed to light or microwave-heated to produce a sintered copper / silver body, thereby forming a conductive film.

A metal substrate includes a first insulating substrate, a second insulating substrate, a first metal layer, a second metal layer and a release layer. The first insulating substrate has a first modified surface and a second surface opposite to the first modified surface. The first metal layer faces the second surface. The release layer is bonded on the first modified surface. The second insulating substrate is bonded on a side of the release layer, such that the release layer is between the first modified surface and the second insulating substrate. The second metal layer is disposed on a side of the second insulating substrate, such that the second insulating substrate is between the release layer and the second metal layer. An original surface roughness of the first modified surface has a variation substantially less than 10% after the first modified surface is released from the release layer.

An electronic device includes: a housing and a printed circuit board (PCB) structure disposed in the housing. The PCB structure includes a circuit board including an opening area formed through a first surface of the circuit board and a second surface of the circuit board opposite the first surface and a conductive pattern formed in a peripheral area around the opening area, a plate disposed on the second surface of the circuit board covering the opening area, an electronic element disposed on the plate and electrically connected with the circuit board, a resin portion disposed between the plate and the circuit board and extending from the conductive pattern, the resin portion including a conductive material, and a solder portion formed between the resin portion and the plate.

A metal substrate includes a first insulating substrate, a second insulating substrate, a first metal layer, a second metal layer and a release layer. The first insulating substrate has a first modified surface and a second surface opposite to the first modified surface. The first metal layer faces the second surface. The release layer is bonded on the first modified surface. The second insulating substrate is bonded on a side of the release layer, such that the release layer is between the first modified surface and the second insulating substrate. The second metal layer is disposed on a side of the second insulating substrate, such that the second insulating substrate is between the release layer and the second metal layer. An original surface roughness of the first modified surface has a variation substantially less than 10% after the first modified surface is released from the release layer.

A method for producing an electrically conductive thin film on a substrate is disclosed. Initially, a reducible metal compound and a reducing agent are dispersed in a liquid. The dispersion is then deposited on a substrate as a thin film. The thin film along with the substrate is subsequently exposed to a pulsed electromagnetic emission to chemically react with the reducible metal compound and the reducing agent such that the thin film becomes electrically conductive.

A conductive element comprises: a base having a first wave surface, a second wave surface and a third wave surface; a first layer provided on the first wave surface; and a second layer formed on the second wave surface. The first layer has a laminated structure obtained by laminating two or more layers; the second layer has a single-layer structure or laminated structure comprising some of the layer(s) of the first layer; the first layer and the second layer form a conductive pattern section. The first wave surface, the second wave surface and the third wave surface satisfy the relationship: 0 <=(Am1 / lambdam1)<(Am2 / lambdam2)<(Am3 / lambdam3) <= 1.8 (where Am1 is the average amplitude of oscillation of the first wave surface, Am2 is the average amplitude of oscillation of the second wave surface, Am3 is the average amplitude of oscillation of the third wave surface, lambdam1 is the average wavelength of the first wave surface, lambdam2 is the average wavelength of the second wave surface, and lambdam3 is the average wavelength of the third wave surface).

Provided is a copper-fine-particle dispersion liquid with which photosintering can be used to easily form a conductive film having a low electrical resistance. This copper-fine-particle dispersion liquid (1) includes a dispersion medium, and copper fine particles (11) dispersed in the dispersion medium. The copper-fine-particle dispersion liquid (1) includes a sintering promoter. The sintering promoter is a compound which removes copper oxide from copper at a temperature higher than room temperature. Accordingly, during photosintering of the copper fine particles (11), the sintering promoter removes a surface oxide film on the copper fine particles (11).

The invention relates to a circuit board structure and a manufacturing method thereof. The circuit board structure comprises a circuit board and an adhesive layer. The circuit board is provided with a first board surface and a second board surface which are arranged at the opposite sides, and a preset region is defined on the first board surface. The circuit board comprises a conductive line which is arranged on the first board surface, and the conductive line is at least partially arranged on the preset region. The adhesive layer is seamlessly formed on the preset region of the first board surface of the circuit board, and the part of the conductive line arranged on the preset region is seamlessly wrapped by the adhesive layer. The surface, which is away from the circuit board, of the adhesive layer is defined as an adhesive surface, and the adhesive surface is planar. Therefore, the circuit board structure is low in cost and great in adhesive effect.

The present invention discloses a carrying device, a wet etching apparatus and a usage method thereof. The carrying device comprises a carrying body and a heating unit both disposed under a to-be-processed substrate, the carrying body is used for carrying the to-be-processed substrate such that the to-be-processed substrate is placed inclined; the heating unit is used for heating the to-be-processed substrate, such that temperature of the to-be-processed substrate rises gradually from a top portion to a bottom portion thereof. In the technical solution of the present invention, by disposing the heating unit under the to-be-processed substrate, the temperature of the to-be-processed substrate rises gradually from the top portion to the bottom portion thereof, thus etch rate of the etchant on the bottom portion of the to-be-processed substrate can be increased, and uniformity of etch rate in the inclined wet etching process is improved.

The present application provides an anti-interference circuit board and a terminal. The circuit board specifically includes a substrate, the substrate has a first surface, and a first area for placing a magnetometer is provided on the first surface; A plurality of circuit layers, and a plurality of circuit layers are stacked, such as at least a stacked first functional circuit for generating a magnetic field generated in the first direction and a circuit for generating a magnetic field generated in the second direction are provided in the substrate The second functional circuit; when specifically setting the positions of the first functional circuit and the second functional circuit, it is satisfied that: the first area is located in the vertical projection of the first functional circuit and the second functional circuit on the first surface . It can be seen from the above description that the interference received by the magnetometer in the first area is compensated by setting the first functional circuit and the second functional circuit, and the first functional circuit and the second functional circuit are located below the magnetometer during setting, The surface area occupied by the anti-jamming circuit board is reduced.

A substrate manufacturing method includes an inner layer circuit forming step for partially removing metal films from an insulating base material (2), on both surfaces of which the metal films are stuck, and forming an inner layer circuit (3); and an insulating layer forming step for applying first insulating resin (4) to each of both the surfaces of the insulating base material (2) with an inkjet system and forming an insulating layer (5). In the insulating layer forming step, a via hole (6) from which the inner layer circuit (3) is partially exposed is formed simultaneously with the application of the first insulating resin (4). Consequently, a step of separately forming a via hole with a laser or the like is unnecessary, expenses are relatively low, and it is possible to simplify a manufacturing process.

The invention provides a method for separating a flexible substrate and a rigid conductive carrier; the method comprises the following steps that the first end of the rigid conductive carrier is in contact with a conductive solution, wherein the flexible substrate is formed on the rigid conductive carrier; and a voltage is applied to the second end of the rigid conductive carrier and the conductive solution so as to separate the rigid conductive carrier from the flexible substrate, wherein the conductive solution is capable of corroding the surface, facing the flexible substrate, of the rigidconductive carrier.