Suspension polymerization compositions, methods and use thereof

A composition, polymer technology, applied in applications, home appliances, treatment using electromagnetic fields, etc., can solve problems such as unsatisfactory, low hygroscopicity, low thermal expansion, etc.

Active Publication Date: 2017-08-01
NANO DIMENSIONS TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Currently, such board materials may not meet some of the specifications for next-generation packaging technologies, such as excellent physical properties in terms of impact strength, scratch resistance, high heat resistance, low thermal expansion, and low moisture absorption

Method used

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  • Suspension polymerization compositions, methods and use thereof
  • Suspension polymerization compositions, methods and use thereof
  • Suspension polymerization compositions, methods and use thereof

Examples

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Embodiment Construction

[0016] Provided herein are examples of thermoset reinforced resin compositions and methods of forming plates, sheets, and / or films.

[0017] The curing of liquid epoxy resins, that is, their conversion into thermoset solids, may be the basis for their commercial use. The same goes for polyester, polyurethane, phenolic and melamine resins. However, liquid epoxy resin due to its structure and its curing method, dimensional stability during its curing phase, chemical resistance, chemical inertness, durability, adhesion, physicochemical properties can be tailored by proper selection of initial epoxy resin It is superior to these other resins (such as phenolic resins) in terms of ability and suppression of volatility loss.

[0018] Typically, bisphenol A / epichlorohydrin based resins, novolac based epoxy resins and other difunctional or multifunctional resins containing aromatic ring structures will cure to hard rigid compositions with fairly low impact and elongation properties ....

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Abstract

The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets and / or films using of porous particulates impregnated with embedded live monomer and / or oligomer and / or polymer configured to partially leach out a functional terminal end of the live monomer and / or oligomer and / or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and / or film of hybrid interpenetrating networks.

Description

Background technique [0001] The present disclosure relates to thermoset reinforced resin compositions and methods of forming plates, sheets and / or films. In particular, the present disclosure relates to compositions and methods using porous particles impregnated with reactive monomers and / or oligomers and / or polymers configured to partially leach reactive monomers and / or oligomers and / or polymers The functional end of the material and reacts with the cross-linking agent to form a reinforced plate, sheet and / or film. [0002] Various electronic and other devices such as computers, semiconductor devices, displays, and communication devices include printed electronic circuit boards. The printed electronic circuit board may include signal lines for transferring signals, insulating layers for preventing short circuits between the signal lines, switching elements, and the like. Printed electronic circuit boards may desirably have various performance factors to provide improved per...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K3/20C08K9/04C08K9/12
CPCC08G59/184C08G59/245C08G59/42C08G59/44C08G59/46C08G59/50C08G59/56C08G59/687C08K3/36C08L33/062C08L63/00C08F292/00C08F222/1006C08J5/18C08K7/26C09D11/101C09D11/30H05K1/0366H05K3/0011C08J2363/00H05K2203/013H05K2203/10C08J5/24
Inventor 希拉·埃利梅莱赫
Owner NANO DIMENSIONS TECH LTD
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