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Suspension polymerization composition, method and use thereof

A technology of composition and polymer, applied in applications, home appliances, treatment using electromagnetic fields, etc., can solve problems such as unsatisfactory, low hygroscopicity, low thermal expansion, etc.

Active Publication Date: 2021-02-09
NANO DIMENSIONS TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Currently, such board materials may not meet some of the specifications for next-generation packaging technologies, such as excellent physical properties in terms of impact strength, scratch resistance, high heat resistance, low thermal expansion, and low moisture absorption

Method used

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  • Suspension polymerization composition, method and use thereof
  • Suspension polymerization composition, method and use thereof
  • Suspension polymerization composition, method and use thereof

Examples

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Embodiment Construction

[0015] Provided herein are examples of thermoset enhanced resin compositions and methods of forming panels, sheets, and / or films.

[0016] Curing of liquid epoxy resins, i.e. their conversion to thermoset solids, can be the basis for their commercial use. The same goes for polyester, polyurethane, phenolic and melamine resins. However, liquid epoxy resins due to their structure and their curing method, dimensional stability during their curing stage, chemical resistance, chemical inertness, durability, adhesion, physicochemical properties can be tailored by proper selection of the initial epoxy resin superior to these other resins (eg phenolic resins) in terms of capacity and inhibition of volatile loss.

[0017] Typically, bisphenol A / epichlorohydrin based resins, novolac based epoxy resins and other di- or polyfunctional resins containing aromatic ring structures will cure to hard rigid compositions with considerably lower impact and elongation properties . There are many...

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Abstract

The present disclosure relates to thermosetting reinforced resin compositions and methods of forming plates, sheets and / or films using porous particles impregnated with embedded reactive monomers and / or oligomers and / or polymers, the The porous particles are configured to partially leach functional end portions of reactive monomers and / or oligomers and / or polymers and react with cross-linking agents and photo-initiated polymer radicals to form enhanced interpenetrating hybrid networks Plates, sheets and / or films.

Description

Background technique [0001] The present disclosure relates to thermoset enhanced resin compositions and methods of forming panels, sheets and / or films. In particular, the present disclosure relates to compositions and methods using porous particles impregnated with reactive monomers and / or oligomers and / or polymers, the porous particles being configured to partially leach reactive monomers and / or oligomers functional ends of the material and react with cross-linking agents to form reinforced plates, sheets and / or films. [0002] Various electronic and other devices such as computers, semiconductor devices, displays, and communication devices include printed electronic circuit boards. The printed electronic circuit board may include signal lines for transmitting signals, insulating layers for preventing short circuits between the signal lines, switching elements, and the like. Printed electronic circuit boards can desirably have various performance factors to provide improved...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08K3/20C08K9/04C08K9/12
CPCC08G59/184C08G59/245C08G59/42C08G59/44C08G59/46C08G59/50C08G59/56C08G59/687C08K3/36C08L33/062C08L63/00C08F292/00C08F222/1006C08J5/18C08K7/26C09D11/101C09D11/30H05K1/0366H05K3/0011C08J2363/00H05K2203/013H05K2203/10C08J5/24
Inventor 希拉·埃利梅莱赫
Owner NANO DIMENSIONS TECH LTD
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