The invention belongs to the field of
new energy materials, and particularly relates to controllable preparation and application of multi-scale oxidation-resistant
copper powder. A
copper source solution and a
reducing agent solution are mixed to adjust the pH value, and
copper particles of 0.05-2 microns are prepared; when the dispersing agent is added into the
reducing agent, the free chain of the
polymer causes the copper
crystal to aggregate and grow, and the copper
powder of 3-5 microns is prepared; and the copper
powder with the size of 7-10 microns is prepared by utilizing a
secondary growth principle of crystals. And then the copper powder prepared through the three different methods is coated, and the copper powder with effective anti-oxidation
coating is obtained. The nano-micron copper powder of various sizes is prepared by adjusting the pH value of the solution, changing the content of the dispersing agent in the
reducing agent and through a
secondary growth process on the basis, and the method has the advantages of being simple in technological process, low in cost, high in
oxidation resistance, good in stability and the like; the
conductive paste used for preparing the thick-film
resistor element is well matched with an aluminum
oxide substrate, and the average
sheet resistance is 2-8 m
omega / square.