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Light emitting diode packaging structure

A technology of light-emitting diodes and packaging structures, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of high production cost, large thickness and volume, and achieve the effects of low production cost, light and thin cost, and improved light field range.

Active Publication Date: 2015-07-08
常熟东南高新技术创业服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the upper part of the light emitting diode packaging structure 100 is also formed with a lens 102, its thickness and volume are relatively large, and its manufacturing cost is relatively high.

Method used

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  • Light emitting diode packaging structure
  • Light emitting diode packaging structure
  • Light emitting diode packaging structure

Examples

Experimental program
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Embodiment Construction

[0015] see figure 2 and image 3 , an embodiment of the present invention provides a light emitting diode packaging structure 10 , which includes a substrate 11 , electrodes 12 , light emitting diode chips 13 and a package body 14 .

[0016] The substrate 11 is a rectangular flat plate for carrying the electrodes 12 , LED chips 13 and packages 14 on its upper surface. The substrate 11 includes an upper surface 111 and a lower surface 112 opposite to the upper surface 111 and parallel to each other. The material of the substrate 11 is PPA (Polyphthalamide, polyvinyl acetate) or the like. It can be understood that the lengths of the sides of the substrate 11 may be the same or different. Further, the shape of the substrate 11 is not limited to a rectangle, and may also be a circle or the like.

[0017] There are at least two electrodes 12 formed on the surface of the substrate 11 , and each electrode 12 is electrically insulated from each other. The electrodes 12 respective...

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PUM

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Abstract

The invention relates to a light emitting diode packaging structure which comprises a substrate, an electrode, a light emitting diode chip and a packaging body, wherein the electrode is formed on the surface of the substrate, and the light emitting diode chip is arranged on the substrate and is electrically connected with the electrode. The packaging body covers the substrate and is used for packaging the light emitting diode chip inside the substrate. The packaging body comprises a body and a light scattering area surrounding the body. The body comprises a combination surface attached with the substrate and a light emitting surface opposite to the combination surface. The light scattering area is formed by scattered particles doped in the partial body, and the light scattering area is arranged around the light emitting diode chip.

Description

technical field [0001] The invention relates to a semiconductor structure, in particular to a light emitting diode packaging structure. Background technique [0002] Generally, when a light emitting diode (Light Emitting Diode, LED) package structure is used as a light source of a direct-lit backlight module, it is usually required to have a wide light field to reduce the generation of light spots and bright and dark bands on the display screen. Such as figure 1 Shown is a light-emitting diode package structure 100 that produces a wide light field. A V-shaped lens 102 is formed on the upper light-emitting surface of the light-emitting diode package structure 100. The lens 102 refracts part of the light emitted by the light-emitting diode chip 103 toward the surroundings of the light emitting diode packaging structure 100, thereby generating a wider light field. However, since the lens 102 is formed on the upper part of the light emitting diode packaging structure 100, its ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/58H01L33/54
Inventor 林新强曾文良
Owner 常熟东南高新技术创业服务有限公司