Epoxy encapsulation mould of coreless armature and encapsulation method thereof
A technology for potting molds and hollow cups, which is applied to epoxy potting molds for hollow cup armatures and the field of potting. It can solve the problems of affecting the vibration of the whole machine, wounding of windings, and poor beating of the cup body, so as to reduce the mold occupation. Rate, moderate amount of dynamic balance, and the effect of improving processing efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0031] Embodiment: the potting method of the epoxy potting device of the hollow cup armature provided by the present invention is:
[0032] 1) First combine the guide post 5 with the bottom plate 6, the bottom plate 5 with the fixed plate 11, press the middle mold core 3 into the upper hole of the bottom template 10 and place it on the fixed plate 11 to form a mold cavity; impregnate all the components of the mold Put the armature cup on the middle mold core 3 after the liquid release agent; install the potting middle ring 2, the upper template 1, lock and tighten the screw 7; inject the liquid epoxy resin into the cavity through the feed hole 8; After the epoxy resin is preliminarily cured for 20 minutes, remove the upper template 1 and the potting middle ring 2 through the ejector 12; remove the stripping plate 4 with the armature cup, the bottom template 10, and the middle mold core 3 from the bottom plate 6 Stand at 120° C. for post-curing after up and down; after post-cur...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 