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Metamaterial and preparation method thereof

A metamaterial and combined technology, applied in the direction of chemical instruments and methods, lamination, layered products, etc., can solve the problems of large loss, overweight metamaterials, etc., and achieve the effect of small density, stable electromagnetic characteristics, and easy portability

Active Publication Date: 2014-04-16
KUANG CHI INNOVATIVE TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to overcome the defects of overweight and excessive loss of metamaterials in the prior art, and provide a metamaterial using a pure organic resin substrate. bring great convenience

Method used

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Embodiment Construction

[0028] The present invention will be described in further detail below in conjunction with the embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto.

[0029] Such as figure 1 A schematic structural diagram of a metamaterial is shown. The metamaterial is formed by stacking at least one layer of metamaterial substrates, and each layer of metamaterial substrates is bonded together by hot melt adhesive. Such as image 3 As shown, each metamaterial substrate consists of a layer of copper foil and a layer of resin substrate. The copper foil and the resin substrate are stacked together. The copper foil and the resin substrate are bonded together by hot melt adhesive. Hot melt adhesive refers to normal temperature It is a type of polymer resin base material that can be melted after heating and has viscosity in the molten state. The resin base material can be polyamide, polyurethane, polyethylene, etc., and the resin base plat...

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Abstract

The invention relates to the field of metamaterials. Metamaterial is produced by bonding a plurality of metamaterial base plates etched with an artificial microstructure together via a hot-melt adhesive. The invention further provides a preparation method for the metamaterial, wherein purely organic resin is used for producing the metamaterial, so that the metamaterial is low in density, light in weight and convenient to carry; simultaneously, the metamaterial has the characteristics of being corrosion-resistant, impact-resistant, fireproof, moistureproof, sound-proofing, anti-seismic and the like; and with the adoption of the metamaterial base plates etched with the artificial microstructure, the metamaterial has excellent and stable electromagnetic characteristics.

Description

technical field [0001] The invention relates to the field of dielectric substrates, in particular to a metamaterial and a preparation method thereof. Background technique [0002] At present, the realization of metamaterial microstructure is completed by making metal wires on thermosetting glass fiber reinforced polymer resin-based copper clad laminates. The main dielectric substrate materials are insulating materials used in the circuit board industry: FR4, PTFE, polyimide, etc. Using FR4 and polyimide as the base material has a large dielectric loss, which affects the performance of the metamaterial. However, the cost of using PTFE substrates is very high, resulting in a substantial increase in the total cost of metamaterials, which limits the large-scale application of metamaterials. Thermoplastic polymer resin materials such as polyolefin have low dielectric loss, close to PTFE, and the price is very low, so they are ideal materials for preparing metamaterials. Howeve...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/08B32B15/20B32B7/12B32B37/12
Inventor 刘若鹏季春霖黄新政
Owner KUANG CHI INNOVATIVE TECH