Laminating manufacturing method for rigid-flex boards with rigid board areas different in thickness

Abstract

The invention provides a laminating manufacturing method for rigid-flex boards with rigid board areas different in thickness. The laminating manufacturing method includes: an initial designing step, a secondary rigid board area expanding step, an auxiliary expanding step and a laminating step, wherein the initial designing step is used for finding out the rigid board areas with different thickness from different areas of the rigid-flex boards during designing; the secondary rigid board expanding step is used for enabling a special area to be extended from the periphery of a secondary rigid board thin in board thickness to an external rigid board area to serve as a pressing buffering area; the auxiliary expanding step is used for adjusting and milling rigid board shape of the rigid-flex boards and milling windows in semi-solidifying of sheets; the laminating step is sued for laminating the rigid-flex boards. The laminating manufacturing method for the rigid-flex board with rigid board areas different in thickness is easy and convenient to operate and capable of effectively ensuring effective graphs on the rigid-flex boards to be pressed evenly, and accordingly, the rigid-flex boards in accordance with requirements can be produced.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, more specifically, the invention relates to a method for laminating a rigid-flex board with unequal thickness of the hard board area. Background technique [0002] The hard board area of ​​conventional soft-rigid boards is usually designed with equal thickness. In the stack design of each hard board area, each layer of hard board and prepreg are designed in the same stack, and the thickness is basically the same. This design stacking and production are uniform relatively simple; figure 1 As shown, the hard board areas H11 and H12 on both sides of the soft board area W11 are designed to be of equal thickness. [0003] However, some rigid-flex boards with special requirements (for example, due to the needs of device assembly) require that the thickness of some hard boards is inconsistent; generally, the hard board area that runs through the most layers and has the thickest board ...

AI Technical Summary

Problems solved by technology

[0010] The technical problem to be solved by the present invention is to propose a method of unequal thickness in the hard board area in view of the limitations of the above two methods and the inability to perfectly solve the problem of lamination of soft-hard boards with unequal thickness in the hard board area. The designed lamination method for rigid-flex boards is not only easy to operate, but also can effectively ensure that the effective graphics in the hard board area of ​​the flexible-rigid board are evenly pressed, thereby producing a rigid-flex board that meets the requirements

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