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A kind of 3D three-dimensional imaging film and its application

一种立体成像、薄膜的技术,应用在合成树脂层状产品、分层产品、化学仪器和方法等方向,能够解决高分子光聚合物成像材料不耐溶剂等问题

Active Publication Date: 2016-01-13
SHANGHAI BESTECH CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a 3D three-dimensional imaging film to solve the problems encountered in the prior art when the polymer photopolymer imaging material is directly applied to the manufacturing process of in-mold injection molding, in-mold blow molding, and card making. In the whole process, the polymer photopolymer imaging material is not resistant to solvents, and it needs to withstand high temperature and high pressure around 270°C, and it needs to be bonded with different plastic materials instantaneously under high temperature and high pressure conditions, and the bonding strength needs to be high. Meeting Industry Standards Issues

Method used

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  • A kind of 3D three-dimensional imaging film and its application

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0092] The 3D three-dimensional imaging film of the present embodiment comprises:

[0093] Common protective layer, made of polyethylene terephthalate;

[0094]The 3D three-dimensional imaging layer is made of polymer photopolymer imaging material, and the matrix material of polymer photopolymer imaging is acrylic acid;

[0095] The carrier layer is made of PP;

[0096] One plane of the 3D stereoscopic imaging layer is connected with the common protective layer through the first bonding layer, and the other plane of the 3D stereoscopic imaging layer is connected with the carrier layer through the second bonding layer, and the first bonding layer and the second bonding layer The material is silicone.

Embodiment 2

[0098] The 3D three-dimensional imaging film of the present embodiment comprises:

[0099] The reinforced protective layer is made of polyethylene terephthalate, and the surface of the reinforced protective layer is hardened to make it anti-scratch and anti-friction;

[0100] The 3D three-dimensional imaging layer is made of high molecular photopolymer imaging material, and the high molecular photopolymer imaging material is carbonate;

[0101] The carrier layer is made of PC;

[0102] One plane of the 3D three-dimensional imaging layer is connected with the reinforced protective layer through the first bonding layer, and the other plane of the 3D stereoscopic imaging layer is connected with the carrier layer through the second bonding layer, and the first bonding layer and the second bonding layer The material is UV glue.

Embodiment 3

[0104] The 3D three-dimensional imaging film of the present embodiment comprises:

[0105] Anti-ultraviolet protective layer, the substrate is made of polytetrafluoroethylene;

[0106] 3D stereo imaging layer made of silver bromide;

[0107] The carrier layer is made of PC;

[0108] One plane of the 3D three-dimensional imaging layer is connected with the reinforced protective layer through the first bonding layer, and the other plane of the 3D stereoscopic imaging layer is connected with the carrier layer through the second bonding layer, and the first bonding layer and the second bonding layer The material is polyurethane.

[0109] As mentioned above, since the first bonding layer and the second bonding layer of the embodiment of the present invention use a solvent-free adhesive, the problem of solvent resistance of the 3D stereoscopic imaging film in the entire manufacturing process is fundamentally solved.

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Abstract

The invention discloses a 3D (3-dimensional) stereo imaging film comprising a protection layer, a 3D stereo imaging layer and a carrier layer, wherein the protection layer is made of a resin material or a composite material of the resin material; the 3D stereo imaging layer is made of a macromolecule photopolymer imaging material or a silver salt material; the carrier layer is made of the resin material; one plane of the 3D stereo imaging layer is connected with the protection layer by a first bonding layer; the other plane of the 3D stereo imaging layer is connected with the carrier layer by a second bonding layer; and the materials of the first bonding layer and the second bonding layer are both solvent-free adhesives. According to the 3D stereo imaging film, the problem that a 3D stereo imaging layer is not resistant to solvents in the processes of intramode injection molding, intramode blow molding, 3D card manufacture, sealing gasket manufacture, 3C (computer, communication and consumer electronics) product protection film manufacture and outdoor label manufacture is solved by arranging and selecting the first bonding layer and the second bonding layer, the 3D stereo imaging film is effectively bonded with different plastic materials instantly at high temperature and high pressure, and the problem that the 3D stereo imaging layer is not resistant to high temperature is further solved by arranging an heat-insulation temperature-resistant layer.

Description

technical field [0001] The invention relates to a 3D three-dimensional imaging film and its application. Background technique [0002] The so-called polymer photopolymer imaging material is a material that can show a very deep 3D stereoscopic image effect on a very thin flat material. At present, it is mainly used in the field of anti-counterfeiting labels, but when used It will form a layered phenomenon with the attached object, which has the disadvantage of being easily uncovered. And when it is directly applied to the manufacturing process of in-mold injection molding, in-mold blow molding, card making and other fields to manufacture three-dimensional image marks integrally formed with products, it will encounter that the polymer photopolymer imaging material is not resistant to The problem of solvents, as well as the need to withstand high temperature and high pressure around 270°C in certain processes, and the problem of instant bonding with different plastic materials...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/06B32B7/12
CPCB32B7/10B32B7/12B32B27/06B32B27/08B32B27/32B32B2323/04B32B2327/18B32B2355/02B32B2367/00B32B2369/00B32B2379/08
Inventor 吕晓义孙德操
Owner SHANGHAI BESTECH CHEM CO LTD